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Etching Mixtures

Aluminium Etchant (H₃PO₄/HNO₃/CH₃COOH)
Mixtures of nitric acid (→ Al oxidation to Al₂O₃), phosphoric acid (→ solving the Al₂O₃ formed), and optionally acetic acid (→ wetting agent and buffer for HNO₃)
 
For further information refer Aluminium Etchant.pdf

Chromium Etchant N°1 ((NH₄)₂[Ce(NO₃)₆]/HClO₄)
Mixtures of perchloric acid and ceric ammonium nitrate

For further information refer Chromium Etchant.pdf

Gold Etchant NFE 50-10-40 (HNO₃/HF based)

Our standard gold etchant consists of nitric acid and hydrofluoric acid. We sell it in VLSI quality in 2.5 liter bottles.
  
For further information refer Gold Etchant.pdf 

Silicon Etchant AFN 5-4-9 (HF/HNO₃/CH₃COOH)

Mixtures of nitric acid (→ oxidation of Si to SiO₂), hydrofluoric acid (→ SiO₂ etching), and acetic acid (→ wetting agent and buffer for HNO₃).

 
For further information refer Silicon Etchant.pdf

Buffered Oxide Etch, BOE 7:1 (Ammoniumfluoride Etching Solution 87.5:12.5 or Buffered Hydrofluoric Acid)

Used for etching of SiO₂. Due to the higher PH value in contrast to unbuffered HF it gives better results in combination with photoresists.
The etch rate on SiO₂ is (depending on temperature and SiO₂ morphology) in the range of 70-90 nm per minute.

For further information refer: Buffered Oxide Etch.pdf

Sales Volumes, Shipping and Pricing
As listed in the previous section, we supply our etchants in e. g. 1.0 L, 2.5 L or 5.0 L sales units. Beside single bottles, we also offer cardboxes of 6 x 1.0 L, 6 x 2.5 L or 4 x 5.0 L.
Our typical lead time is 3-5 working days within Germany, lead times to other countries on request. On demand, in urgent cases our etchants can be shipped within 24 hours within Germany.

Please send your request to:
e-mail: sales@microchemicals.com
phone: +49 (0)731 36080 409
fax: +49 (0)731 36080 908

Thank you very much for your interest!