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Etching Mixtures

Aluminium Etchant (ANPE 80/5/5/10 )
Mixtures of nitric acid (→ Al oxidation to Al₂O₃), phosphoric acid (→ solving the Al₂O₃ formed), and acetic acid (→ wetting agent and buffer for HNO₃)
 
For further information refer Aluminium Etchant.pdf
General Information to this topic: Aluminium Etching.pdf

Chromium Etchant N°1 ((NH₄)₂[Ce(NO₃)₆]/HClO₄)
Mixtures of perchloric acid and ceric ammonium nitrate

For further information refer Chromium Etchant.pdf
General Information to this topic: Chromium Etching.pdf

Silicon Etchant

different silicon etchants can be ordered on request starting with quantities of 150 Liter and above. Please call us for details.

For smaller quantities we recommend to mix the respective etchant out of the base materials that we have in our product range. 

For further information refer Silicon Etchant.pdf
General Information to this topic: Silicon Etching.pdf

Buffered Oxide Etch, BOE 7:1 (Ammoniumfluoride Etching Solution 87.5:12.5 or Buffered Hydrofluoric Acid)

Used for etching of SiO₂. Due to the higher PH value in contrast to unbuffered HF it gives better results in combination with photoresists.
The etch rate on SiO₂ is (depending on temperature and SiO₂ morphology) in the range of 70-90 nm per minute.

For further information refer: Buffered Oxide Etch.pdf
General Information to this topic: Wet Etching.pdf

Sales Volumes, Shipping and Pricing
As listed in the previous section, we supply our etchants in e. g. 1.0 L, 2.5 L or 5.0 L sales units. Beside single bottles, we also offer cardboxes of 6 x 1.0 L, 6 x 2.5 L or 4 x 5.0 L.
Our typical lead time is 3-5 working days within Germany, lead times to other countries on request. On demand, in urgent cases our etchants can be shipped within 24 hours within Germany.

Please send your request to:
e-mail: sales@microchemicals.com
phone: +49 (0)731 36080 409
fax: +49 (0)731 36080 908

Thank you very much for your interest!