New Products
TechniStrip® P1316 - High Performance Removers
TechniStrip® P1316 is a powerful NMP-free remover for
- Novolak-based positive resists such as all positive AZ® resists.
- Epoxy-based resists
- Polyimides, bonding glues
- Dry films
For further information refer: TechniStrip P1316
TechniStrip® NI555
TechniStrip® NI555 is a powerful remover for Novolak-based negative resists and ultrathick positive resists such as
For further information refer: TechniStrip PI555
Wafer (Si-Wafer)
Since 2010, a network of wafer manufacturers and distributor allows us to supply various semiconductor wafers, such as
- Si wafer with different diameter, doping, surfaces and orientation
- Si wafers with SiO2 and Si3N4 coating
- single wafers up to entire lots.
For further information refer: Wafer.html
Deep-UV Photoresist (AZ®TX 1311)
The AZ® TX 1311 is a deep-UV (DUV) photoresist. This 248 nm photo resist with a thicknes up to 4 μm is designed e.g. for high energy implant applications.
For further information refer: AZ TX 1311 Deep UV Photoresist
Yellow Foil ASF SFG 10 (UV-Filter)
Our yellow foil ASF SFG 10 completely blocks all radiation with wavelengths < 500 nm, and yields a high transparency for wavelengths > 540 nm. Thus the ASF SFG 10 is perfectly suited for the processing for all common photo resists.
Fields of Application
Our yellow foil ASF SFG 10 can either be attached to windowpanes with UV stable double-faced adhesive tape (also supplied by us), or – assembled in Polycarbonate bushing - fixed around white Hg fluorescent tubes.
For further information refer: UV-filter or "Yellow light for lithografy.pdf"
Cyclopentanone (solvent cyclopentanone)
Cylcopentanone is often used as solvent in epoxy based resist formulations. Cyclopentanone is also an organic developer for some cross linking resists.
For further information refer Cyclopentanone.pdf
General Information to this topic: Solvents.pdf
DMSO (solvent dimethylsulfoxide)
DMSO is a very well suited substitute for the NMP that is regarded as toxic since a while. As a stripper or as lift off media, DMSO can be regarded as non toxic alternative to NMP. Mixtures with Cyclopentanone or with MEK even increase the strip performance of this product.
For further information refer DMSO Dimethylsulfoxide.pdf
General Information to this topic: Solvents.pdf
MIBK (solvent methyl isobutyl ketone)
MIBK is a solvent with a boiling point of 116°C. In the microelectronics it is sometimes used as a developer for e-beam resists. Synonyms for this solvent are: isobuthylketone and "4-methylpetane-2-on".
For further information refer Methyl Isobutyl Ketone.pdf
General Information to this topic: Solvents.pdf
Neuer Dicklack - AZ® 40 XT
AZ® 40 XT is a thick positive chemically amplified photoresist with superior performance for wet and dry processes
- Vertical profiles on aligners at resist film thicknesses > 30 µm
- Excellent photospeed; good develop time (TMAH Developer compatible)
- Superior overall throughput
- Superior adhesion on substrates
- Superior DRIE performance, ideal for MEMS
- Copper substrate and good plating compatibility
- Standard wet strip process for removal
For further information refer AZ 40 XT.pdf
New Negativeresist -AZ® 125 nXT
AZ® 125 nXT is a cross-linking negative resist for resist film thicknesses up to 100 µm and
even more with very steep sidewalls. The high stability and superior adhesion make the AZ®
125 nXT well suited for most electroplating applications where very thick films are required.
This resist requires no post exposure bake or any delays between the process steps.
- 30 … 100 µm via single-coating
- Aqueous alkaline developers (such as the TMAH-based AZ 326/726/827 MIF)
- Excellent adhesion, no underplating
- No post exposure bake, no delays between process steps required
- Wide substrate compatibility: Cu, Au, Ti, NiFe, GaAs…
- Wide plating compatibility: Cu, Ni, Au, solder …
- Standard wet stripping processes
For further info AZ 125 nXT.pdf nd for further details for processing AZ 125 nXT details for processing.pdf
AZ® 15 nXT
New Negativeresist
AZ® 15 nXT is a cross-linking, Cu-compatible negative resist especially designed for electro plating: Excellent adhesion, no underplating, vertical sidewall profiles, wide compatibility to plating solutions, including Cu, Ni, and Au.
Sensitivity: i-line
Developer: TMAH-based (AZ® 326/726/826 MIF)
AZ® 15 nXT structures (resist film thickness 10 μm)
For further information refer this new negative Fotoresist AZ 15nXT.pdf
New Positive Thin Photoresist
AZ ECI 3027 photoresist
AZ® ECI 3027 photoresist series are a family of fast positive resists with high resolution capabilities (0.4 µm CDs in production in i-line) enabling wide process latitudes. The resist family is suited for i-line as well as broadband exposure covering g-, h- and i-line illumination wavelengths. It is designed to have superior implant and dry etch resistance. Further characterization highlights show strong wet etch adhesion and good thermal stability. AZ® ECI 3027 photoresist series are specifically tailored for universal application and excellent cost of ownership.
For further information refer Photoresist AZ ECI 3027.pdf
More about other Positive Thin Photoresists
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