New Products
Neuer Dicklack - AZ® 40 XT
AZ® 40 XT is a thick positive chemically amplified photoresist with superior performance for wet and dry processes
- Vertical profiles on aligners at resist film thicknesses > 30 µm
- Excellent photospeed; good develop time (TMAH Developer compatible)
- Superior overall throughput
- Superior adhesion on substrates
- Superior DRIE performance, ideal for MEMS
- Copper substrate and good plating compatibility
- Standard wet strip process for removal
For further information refer AZ 40 XT.pdf
New Negativeresist -AZ® 125 nXT
AZ® 125 nXT is a cross-linking negative resist for resist film thicknesses up to 100 µm and
even more with very steep sidewalls. The high stability and superior adhesion make the AZ®
125 nXT well suited for most electroplating applications where very thick films are required.
This resist requires no post exposure bake or any delays between the process steps.
- 30 … 100 µm via single-coating
- Aqueous alkaline developers (such as the TMAH-based AZ 326/726/827 MIF)
- Excellent adhesion, no underplating
- No post exposure bake, no delays between process steps required
- Wide substrate compatibility: Cu, Au, Ti, NiFe, GaAs…
- Wide plating compatibility: Cu, Ni, Au, solder …
- Standard wet stripping processes
For further info AZ 125 nXT.pdf nd for further details for processing AZ 125 nXT details for processing.pdf
AZ® 15 nXT
New Negativeresist
AZ® 15 nXT is a cross-linking, Cu-compatible negative resist especially designed for electro plating: Excellent adhesion, no underplating, vertical sidewall profiles, wide compatibility to plating solutions, including Cu, Ni, and Au.
Sensitivity: i-line
Developer: TMAH-based (AZ® 326/726/826 MIF)
Remover: Easily strips after plating; stripped completely in AZ® Kwik Strip at 70°C for 3 min.
AZ® 15 nXT structures (resist film thickness 10 μm)
For further information refer this new negative Fotoresist AZ 15nXT.pdf
New Positive Thin Photoresist
AZ ECI 3027 photoresist
AZ® ECI 3027 photoresist series are a family of fast positive resists with high resolution capabilities (0.4 µm CDs in production in i-line) enabling wide process latitudes. The resist family is suited for i-line as well as broadband exposure covering g-, h- and i-line illumination wavelengths. It is designed to have superior implant and dry etch resistance. Further characterization highlights show strong wet etch adhesion and good thermal stability. AZ® ECI 3027 photoresist series are specifically tailored for universal application and excellent cost of ownership.
For further information refer Photoresist AZ ECI 3027.pdf
More about other Positive Thin Photoresists
AZ Kwik Strip
AZ® Kwik Strip® remover is a high performance photoresist stripper containing safer solvents that allow for cleaner substrate surfaces and exceptional removal of novolac resins and other organic contaminants. This remover has a neutral pH and will not damage underlying layers of metal. The material is engineered to remove photoresist that has been hard baked up to 170°C. AZ Kwik Strip remover is completely water rinsable and compatible with processes involving automatic wet stripping equipment. The recommended process is double immersion with agitation at room temperature to 90°C. For most applications, fi ve to ten minutes at 60°C is more than suffi cient. AZ Kwik Strip remover is a high purity material fi ltered to 0.2 µm and produced with trace metals controlled to < 50 ppb.
Some Features are:
Amine free, Non-corrosive to Cu, Gatts, and Cu/Al alloys..., biodegradable.
For further information refer AZ Kwik Strip.pdf
More about other Remover and Stripper
New Spray Coating Resist
AZ 4999
AZ® 4999 is a spray coating dedicated highly
transparent photoresist tailored to excel on special spray coating
equipment (e.g. SUSS Delta AltaSpray) where it provides defect free
and conformal coatings on devices with severe topography.
Thick (several to several tens of microns) and uniform resist
coatings are obtained on topography such as V-grooves and trenches
with optimum coverage of sharp edges.
There is no accumulation of resist in trenches. The use of AZ®
4999 photoresist enables high reproducibility in volume production
applications.
For further information refer Photoresist
AZ 4999.pdf
More about other Spray
Coating Resists
Ethyl Acetate
Ethyl Acetate is a solvent with a boiling point of 77°C. The vapor pressure at roomtemperature 97 hPa. Ethylacetate has the chemical formula is C 4H 8O 2 . It can be easily solved in acetone, and alkohols, but fairly bad in water (80g per Liter).
We sell this material in units of 2.5 Liter in VLSI quality.
For further information refer Ethyl Acetate.pdf
or see our site about our solvents.
Overview New Products (PDF)
New Sizes
We are glad to announce the addition of 500 ml bottles to
our line of 250 ml and 1.000 ml resist small sales volumes.
More about our sales
volumes
®AZ, the AZ logo, BARLi , Aquatar and Kallista are registered trademarks of AZ Electronic Materials.
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