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Other Resist Types

Electroplating Resists
AZ 15nXT (Datasheet as PDF)
AZ 125nXT (Datasheet as PDF)
AZ 40XT (Datasheet as PDF)
AZ 9260 (Datasheet as PDF)

E-Beam Resists
AZ nLof 2070 e-beam-grade (Datasheet as PDF)

Protective Coating
AZ 520D (Datasheet as PDF)

Spray Coating Resists
AZ 4999 (Datasheet as PDF)
TI Spray (Datasheet as PDF)

Printed Circuit Board Resist
PL 177 (Datasheet as PDF)

Antireflective Coatings (TARCs & BARCs)
AZ Aquatar (TARC) (Datasheet as PDF)
AZ Barli (BARC) (Datasheet as PDF)

New Negativeresist - AZ^® 15 nXT
AZ^® 15 nXT is a cross-linking, Cu-compatible negative resist especially designed for electro plating: Excellent adhesion, no underplating, vertical sidewall profiles, wide compatibility to plating solutions, including Cu, Ni, and Au.
Sensitivity: i-line
Developer: TMAH-based (AZ^® 326/726/826 MIF)
Remover: Easily strips after plating; stripped completely in AZ^® Kwik Strip at 70°C for 3 min.

AZ^® 15 nXT structures (resist film thickness 10 μm)

For further information refer this new negative Fotoresist AZ 15nXT.pdf

New Negativeresist - AZ^® 125 nXT
AZ^® 125 nXT is a cross-linking negative resist for resist film thicknesses up to 100 µm and
even more with very steep sidewalls. The high stability and superior adhesion make the AZ^®
125 nXT well suited for most electroplating applications where very thick films are required.
This resist requires no post exposure bake or any delays between the process steps.

• 30 … 100 µm via single-coating
• Aqueous alkaline developers (such as the TMAH-based AZ 326/726/827 MIF)
• Excellent adhesion, no underplating
• No post exposure bake, no delays between process steps required
• Wide substrate compatibility: Cu, Au, Ti, NiFe, GaAs…
• Wide plating compatibility: Cu, Ni, Au, solder …
• Standard wet stripping processes

For further info AZ 125 nXT.pdf and for further details for processing AZ 125 nXT details for processing.pdf

AZ^® 40 XT
AZ^® 40 XT is a thick positive chemically amplified photoresist with superior performance for wet and dry processes

• Vertical profiles on aligners at resist film thicknesses > 30 µm
• Excellent photospeed; good develop time (TMAH Developer compatible)
• Superior overall throughput
• Superior adhesion on substrates
• Superior DRIE performance, ideal for MEMS
• Copper substrate and good plating compatibility
• Standard wet strip process for removal

For further information refer AZ 40 XT.pdf

AZ^® nLof 2070 e-beam-grade

For further information refer AZ nLof 2070 e-beam-grade.pdf

AZ 9260 thick film photoresist 
AZ^® 9260 thick film photoresist is designed for the more demanding higher-resolution thick resist requirements. It provides high-resolution with superior aspect ratios, as well as wide focus and exposure latitude and good sidewall profiles. AZ^® 9260 photoresisti is available for a film thicknesses up to 24 µm.
Critical dimension resolutions range from < 1 µm lines and spaces at a film thickness of 4.6 µm, to 3.5 µm lines and spaces at a film thickness of 24 µm on silicon using today's standard broadband exposure tools. Aspect ratios of 5 - 7 can be achieved.
Under the guidance of leading thin-film recording head manufacturers, AZ^® 9260 photoresist is optimized for both coil plating and top pole recording head applications.
Sensitivity to both h- and i-line makes AZ^® 9260 photoresist capable for both broadband and i-line steppers.
Recommended developers are inorganicbased upon potassium hydroxide. The preferred developer is AZ^® 400K Developer 1:4, a buffered developer designed to maximize bath life and process stability. For integrated circuit applications, TMAH developers such as AZ^® 826 MIF developer can be used.
 
For further information refer AZ 9260.pdf

AZ 520D
AZ^® PC 520 D is a cost-effective coating for the protection of device surfaces during operations such as back-lap or backside etch.
It is based on Novolak resin, has a blue colour for easy inspection and is resistant to most etchants. The thickness of this coating is 4,6 µm at 4000 rpm spin speed.
 
For further information refer AZ 520_D PC.pdf

AZ 4999 
AZ^® 4999 is a spray coating dedicated highly transparent photoresist tailored to excel on special spray coating equipment (e.g. SUSS Delta AltaSpray) where it provides defect free and conformal coatings on devices with severe topography. 
Thick (several to several tens of microns) and uniform resist coatings are obtained on topography such as V-grooves and trenches with optimum coverage of sharp edges.
There is no accumulation of resist in trenches. The use of AZ^® 4999 photoresist enables high reproducibility in volume production applications.
 
For further information refer Photoresist AZ 4999.pdf

TI Spray 
The TI Spray Photoresist is specially designed for the application in the so called “image reversal technology” for:

• subsequent lift-off of deposited layers
• wet chemical treatment in HF containing etching solutions
• direct mesa grooving.

The viscosity enables a direct use in spray coating equipment for a target thickness of 1 to 10 µm. The typical aspect ratio of the structured features achievable is in the range of 1.6 .. 2.0.
 
This technical data sheet intends to give you a guide-line for process parameters for various applications. However, the optimum values for e.g. exposure dose, or development depend on the individual equipment and need to be adjusted on each individual demand.
 
For further information refer Photoresist MicroChemicals TI Spray

PL 177 
AZ^® PL 177 is a positive tone liquid photoresist for the application in various coating techniques, especially for printed circuit boards manufacturing. AZ^® PL 177 can be used in all those places, where layouts are directly to be copied onto and subsequently transferred into a substrate by etching, plating, sputtering and related processes.
 
The essential features of AZ^® PL 177 include:

• high resolution potential

• good drying behaviour

• aqueous-alkaline processability

• halogen free coating solvent

• possibility of multiple exposure (selective plating process) light or bright day light should be avoided
  storability of coated substrates

• blue coloured for easy inspection

PL 177 can be applied by dip coating. By dilution with suitable solvents PL 177 can be adjusted to also meet the viscosity and drying requirements of other coating techniques (spray coating, roller coating, spin coating). PL 177 is resistant towards acidic and ammoniacal etchants as well as acidic and neutral plating baths.
The final removal of the temporary resist layer, the stripping, is done with low concentrated bases. PL 177 is used in the manufacturing of printed circuit boards, multilayer inner flexible boards and in chemical milling.
 
For further information refer Photoresist AZ PL 177.pdf

AZ Aquatar (TARC) 
AZ^® Aquatar^® is a top layer anti-reflective coating for use with g- and i-line. AQUATAR^® acts like an optical coating at the interface photoresist/air and improves image contrast.
Multiple reflections within the photoresist are also suppressed, the result is generally a reduction of the amplitude of the swing curve to 1/3rd. Application is very simple: it is just spun on top of the photoresist, no additional bake cycle is required and the standard development cycle removes it.
This simple process reduces linewidth variation over topography significantly, however does not suppress reflective notching.
 
For further information refer AZ Aquatar.pdf

AZ Barli (BARC) 
AZ^® BARLi^®- II is a bottom antireflective layer coating for use on highly reflective surfaces in the semiconductor industry. It is designed to work with positive photoresists and is optimized for i-line exposure tools. Upon completion of the lithographic process, AZ^® BARLi^® - II is patterned in a dry-etch process.
AZ^® BARLi^®-II coating material is formulated in photoresist-compatible solvents to simplify the EBR process and to be both environmental and user friendly. We recommend AZ^® EBR 70/30 for best performance.
AZ^® BARLi^® - II is tailor-made to yield the near-optimum values for refractive indices (n and k) for i-line lithography, which ensures minimum reflectivity and maximum swing reduction for photoresist layers.
Composed of highly absorptive polymer-bound dyes, this material provides excellent coating uniformity and step coverage.
AZ^® BARLi^® - II shows high etch selectivity (comparable to AZ^® BARLi^® ) and high thermal stability up to 230°C. It does not show intermixing with photoresist.
AZ^® BARLi^® - II is available in two thickness grades, 900 A and 2000 A, in order to provide optimum film thickness for the first and the second swing minimum respectively at about 3000 rpm spin speed.

For further information refer AZ Barli_II.pdf

^®AZ, the AZ logo, BARLi , Aquatar and Kallista are registered trademarks of AZ Electronic Materials.