AZ 111 XFS Photoresist
AZ 111 XFS
Film thickness: 1 µm at 4000 rpm
UV-sensitivity: i, h-line (310-420nm)
Sales volumes: 250 ml, 500 ml, 1.000 ml, 2500 ml and 5 Liter
General Information
AZ® 111 XFS is a special photoresist with excellent
adhesion on all surfaces. The origin of this photoresist
dates back to 1964 (AZ® 111 S). It was one of the first
commercial positive photoresist used for general purpose
applications with contact printing. Meanwhile AZ® 111 XFS,
a safer solvent version of AZ® 111 S, has advanced to
meet today’s demands of semiconductor manufacturing
and is still widely used where outstanding wet-etching
capabilities (adhesion) and low sticking to the mask (proximity
printing) are needed.
Development
The suitable developer is the AZ® 303 Developer. You can use it in a dilution ratio of 1:3 to 1:4.
For further information refer Photoresist
AZ 111XFS.pdf
®AZ, the AZ logo, BARLi , Aquatar and
Kallista are registered trademarks of AZ Electronic
Materials.
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