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AZ 9260 Photoresist

AZ 9260 thick film photoresist 
AZ^® 9260 thick film photoresist is designed for the more demanding higher-resolution thick resist requirements. It provides high-resolution with superior aspect ratios, as well as wide focus and exposure latitude and good sidewall profiles. AZ^® 9260 photoresisti is available for a film thicknesses up to 24 µm.
Critical dimension resolutions range from < 1 µm lines and spaces at a film thickness of 4.6 µm, to 3.5 µm lines and spaces at a film thickness of 24 µm on silicon using today's standard broadband exposure tools. Aspect ratios of 5 - 7 can be achieved.
Under the guidance of leading thin-film recording head manufacturers, AZ^® 9260 photoresist is optimized for both coil plating and top pole recording head applications.
Sensitivity to both h- and i-line makes AZ^® 9260 photoresist capable for both broadband and i-line steppers.
Recommended developers are inorganicbased upon potassium hydroxide. The preferred developer is AZ^® 400K Developer 1:4, a buffered developer designed to maximize bath life and process stability. For integrated circuit applications, TMAH developers such as AZ^® 826 MIF developer can be used.

For further information refer Photoresist AZ 9260.pdf

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