AZ ECI 3027 Photoresist
AZ® ECI 3000 (available for film thickness of 2.7 μm, 1.2 μm, and 0.7 μm)
High Resolution with Broad Process Window
Film thickness: 0.5...4 μm (depending on viscosity grade)
UV-sensitivity: i-, h-, g-line (310 - 440 nm), broadband or monochromatic
Sales volumes: 250ml, 500ml, 1000ml, 2.5L, and 5L
General Information
AZ® ECI 3000 reveals an im- proved adhesion as well as a high thermal stability. There- fore, this resist series is well suited for wet- as well as dry chemical processes.
The AZ® ECI 3000 series comes in three viscosity grades for film thicknesses of 2.7, 1.2, and 0.7 μm at 4000 rpm
Left: 900 nm resist lines with the AZ® ECI 3027 at approx. 2.7 μm resist film thickness. Right: 450 nm resist lines with the AZ® ECI 3012 at approx. 1.2 μm film thick- ness. Source: AZ® ECI 3000 Product Data Sheet by AZ-EM®
The very high resolution potential allows feature sizes of 300 nm, and yields a larger and very stable process parameter windows towards lower resolution requirements.
Development
AZ® 726 MIF or AZ® 351B 1 : 4 recommended; AZ® 400K 1 : 4 or AZ® 326 MIF possi- ble
AZ® ECI 3027 high resolution photoresist
AZ® ECI 3027 photoresist series are a family of fast positive resists with high resolution capabilities (0.4 µm CDs in production in i-line) enabling wide process latitudes. The resist family is suited for i-line as well as broadband exposure covering g-, h- and i-line illumination wavelengths. It is designed to have superior implant and dry etch resistance. Further characterization highlights show strong wet etch adhesion and good thermal stability. AZ® ECI 3027 photoresist series are specifically tailored for universal application and excellent cost of ownership.
For further information refer Photoresist
AZ ECI 3027.pdf
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Materials.
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