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TI Plating Photoresist

TI Plating 
The TI Plating photoresist is optimized for spray coating of thin (2 µm) to very thick (20 µm) films. TI Plating can either be processed in positive mode or negative (image reversal) mode This technical data sheet intends to give you a guideline for process parameters for various applications. However, the optimum values for e.g. dilution, exposure dose, or development depend on the individual equipment and need to be adjusted on each individual demand.
  
For further information refer Photoresist TI Plating

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