TI xLift Photoresist
TI
xLift
TI xLift is a image reversal photoresist for
lift-off of thick films.
Thickness 5 .. 15 µm, up to 25 µm with special coating
techniques
UV-Sensitivity i, h, and g-line (310 - 440 µm),
broadband and monochromatic
General Information
TI xLift is specially designed for the application in
the so called "image reversal technology" for
subsequent lift-off of thick and very thick deposited
layers. For harsh chemical attack, such as direct mesa
grooving in HF-HNO3 containing media or etching in high
HF-concentrations prefer TI 35E.
What 'adjustable undercut means' - two examples
For further information refer Photoresist
MicroChemicals TI xLift
®AZ, the AZ logo, BARLi , Aquatar and
Kallista are registered trademarks of AZ Electronic
Materials.
|
