Thick Positive Photoresists
AZ 4533
(Datasheet as PDF)
AZ 4562
(Datasheet as PDF)
AZ 9260
(Datasheet as PDF)
AZ 40XT (Datasheet as PDF)
AZ® 4500-Series:
Thick Resists for Medium Resolution
Film thickness: 2.5 ... 10 μm, up to 100 μm by multiple coating
UV-sensitivity: i-, h-, g-line (310 - 440 nm), broadband or monochromatic
Sales volumes: 250ml, 500ml, 1000ml, 2.5L, and 5L
AZ® 4500-series photoresists are the safer solvent
counterparts for well known AZ® 4000-series and have been
designed especially for thick film applications to cover
a thickness range from 3 - 20 µm. Due to their low
absorption (exposed and unexposed) in the actinic range
from 300 - 450 nm, even coatings of 10 µm can be
exposed at reasonable exposure doses. At thickness below
2.5 µm these resists do not show any advantage over AZ®
1500-series.
For further information refer photoresist AZ
4500-series.pdf
Photoresist AZ 4533 and AZ 4562
AZ® 4533 and AZ® 4562 reflect the standard viscosities to
cover the range from 3 - 10+ µm film thickness.
For further information refer photoresist AZ
4500-series.pdf
AZ 9260 thick film photoresist
Film thickness: 3 ... 20 μm, up to 150 μm by multiple coating (with restrictions)
UV-sensitivity: i- and h-line (310 - 410 nm), broadband or monochromatic
Sales volumes: 250 ml, 500 ml, 1000 ml, 2.5 L, and 3.78 L
AZ® 9260 thick film photoresist is designed for the
more demanding higher-resolution thick resist
requirements. It provides high-resolution with superior
aspect ratios, as well as wide focus and exposure
latitude and good sidewall profiles. AZ® 9260
photoresisti is available for a film thicknesses up to
24 µm.
Critical dimension resolutions range from < 1 µm
lines and spaces at a film thickness of 4.6 µm, to 3.5
µm lines and spaces at a film thickness of 24 µm on
silicon using today's standard broadband exposure tools.
Aspect ratios of 5 - 7 can be achieved.
Under the guidance of leading thin-film recording head
manufacturers, AZ® 9260 photoresist is optimized for
both coil plating and top pole recording head
applications.
Sensitivity to both h- and i-line makes AZ® 9260
photoresist capable for both broadband and i-line
steppers.
Recommended developers are inorganicbased upon potassium
hydroxide. The preferred developer is AZ® 400K
Developer 1:4, a buffered developer designed to maximize
bath life and process stability. For integrated circuit
applications, TMAH developers such as AZ® 826 MIF
developer can be used.
For further information refer AZ 9260.pdf
AZ® 40 XT
Film thickness: 30 ... 100 μm (> 100 μm via multiple coating possible)
UV-sensitivity: i-line (365 nm), NOT g- or h-line sensitive
Sales volumes: 100 ml, 250 ml, 500 ml, 1000 ml, 2.5 L, 3.78 L (gallon)
AZ® 40 XT is a thick positive chemically amplified photoresist with superior performance for wet and dry processes
- Vertical profiles on aligners at resist film thicknesses > 30 µm
- Excellent photospeed; good develop time (TMAH Developer compatible)
- Superior overall throughput
- Superior adhesion on substrates
- Superior DRIE performance, ideal for MEMS
- Copper substrate and good plating compatibility
- Standard wet strip process for removal
For further information refer AZ 40 XT.pdf
®AZ, the AZ logo, BARLi , Aquatar and
Kallista are registered trademarks of AZ Electronic
Materials.
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