Thin Positive Photoresists
AZ 111 XFS
(Datasheet as PDF)
AZ 1505
(Datasheet as PDF)
AZ 1512HS
(Datasheet as PDF)
AZ 1514H
(Datasheet as PDF)
AZ 1518
(Datasheet as PDF)
AZ 6612
(Datasheet as PDF)
AZ 6624
(Datasheet as PDF)
AZ 6632
(Datasheet as PDF)
AZ MiR 701
(Datasheet as PDF)
AZ ECI 3027 (Datasheet as PDF)
AZ 111 XFS
AZ® 111 XFS is a special photoresist with excellent
adhesion on all surfaces. The origin of this photoresist
dates back to 1964 (AZ® 111 S). It was one of the first
commercial positive photoresists used for general
purpose applications with contact printing. Meanwhile AZ®
111 XFS, a safer solvent version of AZ® 111 S, has
advanced to meet today’s demands of semiconductor
manufacturing and is still widely used where outstanding
wet-etching capabilities (adhesion) and low sticking to
the mask (proximity printing) are needed.
For further information please refer to the datasheet:
Photoresist
AZ 111XFS.pdf
AZ 1500-series
This photoresist-series consists of several different
types. They are derived from well known AZ® 1300- and AZ®
1400-series and reflect the replacement of former
cellosolve-acetate based types by safer solvent versions
made up with PGMEA as
solvent.
AZ® 1514 H is the safer solvent substitute for AZ® 1350 H
AZ® 1505 and AZ® 1518 are different viscosities (for
different film thicknesses) of former AZ®
1350J/AZ® 1450J.
They are intended for general applications where
photospeed is not of major concern.
AZ® 1512 HS and AZ® 1518 HS have been added in 1990 to
fulfil the demand for higher photo-speed and at the same
time improve adhesion for wet-etching. They are used on
broadband exposure equipment like scanning projection
aligners and UT-steppers.
For further information please refer to the datasheet: Photoresist
AZ 1500 - series.pdf
AZ 6600-series
This family was launched in 1992 and represents the 3rd
generation of general purpose resists. It combines the
good adhesion of AZ® 1500 HS-series with high thermal
stability as required for modern dry-etch processes.
Today it is one of the most popular resist-series for
general applications. It is used for broadband-, g-line-
and i-line-exposure as well. Resolution goes down to
below 1 µm, design for a small mask-bias of 0.15 µm
makes them useful where existing mask-sets shall be used
together with a modern photoresist to meet today’s
etching and implant processes. This family consists of a
wide range of viscosities to cover different demands: AZ®
6612, AZ® 6612, AZ® 6624 and AZ® 6632 are available as
standard types.
For further information please refer to the datasheet: Photoresist
AZ 6600 - series.pdf
AZ MIR 701
Product Description AZ®MiR™ Series photoresists are
fast, cost effective resists designed for replacement of
older mid-range production resists. The AZ MiR series
resists work well in both surfactated and
non-surfactated TMAH developers using standard process
conditions. AZ® MiR 701 photoresist is designed for
production use at 0.30µm to 0.40µm CDs.
For further information please refer to the datasheet: Photoresist
AZ MIR 701.pdf
AZ ECI 3027
AZ® ECI 3027 photoresist series are a family of fast positive resists with high resolution capabilities (0.4 µm CDs in production in i-line) enabling wide process latitudes. The resist family is suited for i-line as well as broadband exposure covering g-, h- and i-line illumination wavelengths. It is designed to have superior implant and dry etch resistance. Further characterization highlights show strong wet etch adhesion and good thermal stability. AZ® ECI 3027 photoresist series are specifically tailored for universal application and excellent cost of ownership.
For further information refer Photoresist AZ ECI 3027.pdf
®AZ, the AZ logo, BARLi , Aquatar and
Kallista are registered trademarks of AZ Electronic
Materials.
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