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Thin Positive Photoresists

AZ 111 XFS (Datasheet as PDF)
AZ 1505 (Datasheet as PDF)
AZ 1512HS (Datasheet as PDF)
AZ 1514H (Datasheet as PDF)
AZ 1518 (Datasheet as PDF)
AZ 6612 (Datasheet as PDF)
AZ 6624 (Datasheet as PDF)
AZ 6632 (Datasheet as PDF)
AZ MiR 701 (Datasheet as PDF)
AZ ECI 3027 (Datasheet as PDF)

AZ 111 XFS

Film thickness: 1 µm at 4000 rpm
UV-sensitivity: i, h-line (310-420nm)
Sales volumes: 250 ml, 500 ml, 1.000 ml, 2500 ml and 5 Liter

AZ^® 111 XFS is a special photoresist with excellent adhesion on all surfaces. The origin of this photoresist dates back to 1964 (AZ^® 111 S). It was one of the first commercial positive photoresists used for general purpose applications with contact printing. Meanwhile AZ^® 111 XFS, a safer solvent version of AZ^® 111 S, has advanced to meet today’s demands of semiconductor manufacturing and is still widely used where outstanding wet-etching capabilities (adhesion) and low sticking to the mask (proximity printing) are needed.
 
For further information please refer to the datasheet:  Photoresist AZ 111XFS.pdf

AZ 1500-series

Film thickness: 0.5 ... 2.5 μm
UV-sensitivity: i-, h-, g-line (310 - 440 nm), broadband or monochromatic
Sales volumes: 250 ml, 500 ml, 1000 ml, 2.5 L, and 5 L

This photoresist-series consists of several different types. They are derived from well known AZ^® 1300- and AZ^® 1400-series and reflect the replacement of former cellosolve-acetate based types by safer solvent versions made up with PGMEA as solvent.
AZ^® 1514 H is the safer solvent substitute for AZ^® 1350 H
AZ^® 1505 and AZ^® 1518 are different viscosities (for different film thicknesses) of former AZ^® 1350J/AZ^® 1450J. They are intended for general applications where photospeed is not of major concern.
AZ^® 1512 HS and AZ^® 1518 HS have been added in 1990 to fulfil the demand for higher photo-speed and at the same time improve adhesion for wet-etching. They are used on broadband exposure equipment like scanning projection aligners and UT-steppers.
 
For further information please refer to the datasheet: Photoresist AZ 1500 - series.pdf

AZ 6600-series

Film thickness: 1.0 ... 4.5 μm
UV-sensitivity: i-, h-, g-line (310 - 440 nm), broadband or monochromatic
Sales volumes: 250 ml, 500 ml, 1000 ml, 2.5 L, and 5 L

This family was launched in 1992 and represents the 3rd generation of general purpose resists. It combines the good adhesion of AZ^® 1500 HS-series with high thermal stability as required for modern dry-etch processes. Today it is one of the most popular resist-series for general applications. It is used for broadband-, g-line- and i-line-exposure as well. Resolution goes down to below 1 µm, design for a small mask-bias of 0.15 µm makes them useful where existing mask-sets shall be used together with a modern photoresist to meet today’s etching and implant processes. This family consists of a wide range of viscosities to cover different demands: AZ^® 6612, AZ^® 6612, AZ^® 6624 and AZ^® 6632 are available as standard types.
 
For further information please refer to the datasheet: Photoresist AZ 6600 - series.pdf

AZ MIR 701

Film thickness: 900 nm at 4.000 rpm, few 100 nm by dilution
UV-sensitivity: i-, h-, g-line (310 - 440 nm), broadband or monochromatic
Sales volumes: 250 ml, 500 ml, 1000 ml, 2.5 L, and 3.78 L

Product Description AZ^®MiR™ Series photoresists are fast, cost effective resists designed for replacement of older mid-range production resists. The AZ MiR series resists work well in both surfactated and non-surfactated TMAH developers using standard process conditions. AZ^® MiR 701 photoresist is designed for production use at 0.30µm to 0.40µm CDs.
For further information please refer to the datasheet: Photoresist AZ MIR 701.pdf

AZ ECI 3027 

Film thickness: 1...4μm
UV-sensitivity: i-, h-, g-line (310 - 440 nm), broadband or monochromatic
Sales volumes: 250ml, 500ml, 1000ml, 2.5L, and 5L

AZ^® ECI 3027 photoresist series are a family of fast positive resists with high resolution capabilities (0.4 µm CDs in production in i-line) enabling wide process latitudes. The resist family is suited for i-line as well as broadband exposure covering g-, h- and i-line illumination wavelengths. It is designed to have superior implant and dry etch resistance. Further characterization highlights show strong wet etch adhesion and good thermal stability. AZ^® ECI 3027 photoresist series are specifically tailored for universal application and excellent cost of ownership.

For further information refer Photoresist AZ ECI 3027.pdf

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