Our Gold Plating Solution NB SEMIPLATE AU 100 TH
1 and 5 L units, short lead time, (AZ-)Resist compatible
NB SEMIPLATE AU 100 TH is an alkaline, non-cyanide electroplating formulation which produces a bright, ductile deposit.
NB SEMIPLATE AU 100 TH is a ready-to-use product. It is not necessary to add other materials for the initially start of the application. Over time, it may be necessary depending on the electrolyte and application to add additives (see data sheet).
In comparison with other gold plating processes, the NB SEMIPLATE AU 100 TH electrolyte demonstrates exceptional throwing power that results in good coverage of recesses, holes and hollows of parts of complex geometry.
Deposits from the NB SEMIPLATE AU 100 TH process also exhibit the unique ability to build brightness with increasing thickness. Specific gravity measurements of the deposit consistently show values of 19.1 which indicate freedom of codeposited polymers generally found in deposits from other systems of similar purity. NB SEMIPLATE AU 100 TH deposits have main applications in MEMS processing.
- Physical Properties of the Deposit
- Purity 99.9%Hardness 130 to 190 mHV0,020
- Contact Resistance 0.3 mW (measured by cross-wire method with 200 gram load
- Deposit weight for 2.5 microns 31.6 mg/in 2 (4.9 mg/cm2) (100 micro inches)
For further information please refer to TDS_NB_Semiplate_Au_100_TH_en.pdf
Individual Technical Support and Price Request
If you are interested in products for the maintenance of the electrolyte solution and preparation, then please send us your inquiry.
For any further technical discussions around the application of our plating solutions in your running or scheduled plating processes, or your price and lead time request, please contact us via:
Tel.: +49 (0)731 36080 409
Fax: +49 (0)731 36080 908