Photoresists for Electroplating

AZ® 15 nXT Negative Resist

Thickness Range and Exposure

• Film thickness: 5 ... 30 µm
• UV-sensitivity: i-line (365 nm), NOT g- or h-line sensitive
• Sales volumes: 100ml, 250 ml, 500 ml, 1000 ml, 2,5 L and 3,78 L bottles

General Information

AZ^_® 15 nXT is a cross-linking negative resist for resist film thicknesses up to approx. 30 µm. The high stability and superior adhesion make the AZ^_® 15 nXT well suited for most electroplating applications. The resist sidewalls are very steep up to a film thickness of approx. 10 µm, towards higher resist film thicknesses the resist profile becomes more and more negative allowing the electro-deposition of structures which narrow from bottom to top.

Outstanding Properties

• 5 ... 20 µm resist film thickness via single-coating
• Aqueous alkaline developers
• Excellent adhesion, no underplating
• Wide substrate compatibility: Cu, Au, Ti, NiFe, …
• Wide plating compatibility: Cu, Ni, Au, …
• Standard wet stripping processes

Developer

We recommend the TMAH-based, ready-to-use AZ^_® 326/726/826 MIF.

Removal

NMP or DMSO are suited removers, while the recommended stripper is the NMP-free, untoxic TechniStrip NI555. In case of very thick resist films, heating the removers up to 60-80°C, or/and ultrasonic treatment, might be beneficial to fasten the resist removal.

AZ® 125 nXT Negative Resist

Thickness Range and Exposure

• Film thickness:     30 ... 150 µm (> 500 µm can also be realized)
• UV-sensitivity:     i-line (365 nm), NOT g- or h-line sensitive
• Sales volumes:    100 ml, 250 ml, 500 ml, 1000 ml, 2,5 L and 3,78 L bottles

General Information

AZ^_® 125 nXT is a cross-linking negative resist for resist film thicknesses up to 100 µm and even more with very steep sidewalls.
The high stability and superior adhesion make the AZ^_® 125 nXT well suited for most electroplating applications where very thick films are required. This resist requires neither a post exposure bake nor any delays between the process steps.

Outstanding Properties

• 30 … 100 µm resist film thickness via single-coating
• Aqueous alkaline developers
• Excellent adhesion, no underplating
• No post exposure bake, no delays between process steps required
• Wide substrate compatibility: Cu, Au, Ti, NiFe, GaAs, …
• Wide plating compatibility: Cu, Ni, Au, solder …
• Standard wet stripping processes

Developer

We recommend the TMAH-based, ready-to-use AZ^_® 326/726/826 MIF.

Removal

NMP or DMSO are suited removers, while the recommended stripper is the NMP-free, untoxic TechniStrip P1316. In case of very thick resist films, heating the removers up to 60-80°C, or/and ultrasonic treatment, might be required to fasten the resist removal.