AZ® 4500-Series

Outstanding Properties

The AZ^_® 4500 series (AZ^_® 4533 and AZ^® 4562) are positive thick resists with optimized adhesion for common wet etching and plating processes:

• Optimized resist adhesion to all common substrate materials
• Broad process parameter window for stable and reproducible litho-processes
• Compatible with all common developers (KOH- or TMAH-based)
• Compatible with all common strippers (e. g. with AZ 100 Remover, organic solvents, or aquaeous alkaline)
• g-, h- and i-line sensitive (approx. 320 - 440 nm)
• Resist film thickness range approx. 3 - 30 µm

The members of the AZ^_® 4500 family (AZ^_® 4533 and AZ^_® 4562) differ in their solvent concentration and thus allow a broad range in the attainable resist film thickness with one resist system:

AZ^_® 4533

Resist film thickness at 4000 rpm spin speed approx. 3.3 µm, via variation of the spin speed approx. 2.5 - 5 µm attainable.

Sales volumes: 250 ml, 500 ml, 1000 ml, 2,5 L and 5 L bottles

AZ^_® 4562

Resist film thickness at 4000 rpm spin speed approx. 6 µm, via variation of the spin speed approx. 4.5 - 10 µm attainable, up to 30 µm via single-coating with adjusted spin profiles (short spin times at medium spin speed).

Sales volumes: 250 ml, 500 ml, 1000 ml, 2,5 L and 5 L bottles

Resist Film Thicknesses > 30 µm?

Generally, the AZ^_® 4562 can be coated and processed up to 30 µm and beyond. However, softbake, rehydration, exposure and development become very time-consuming in this thickness range. Additionally, even the rather transparent AZ^_® 4562 may form N^₂-bubbles during exposure when applied too thick. Therefore, for resist film thicknesses > 20 µm, we strongly recommend the chemically amplified AZ^_® 40 XT.

Suited Developers for the AZ^_® 4500 Resists

If metal ion containing developers can be used, the KOH-based AZ^_® 400K in a 1 : 4 dilution (for higher resist filmthicknesses 1 : 3.5 ... 1 : 3 diluted possible) is a suited developer.

If metal ion free developers have to be used, we recommend the TMAH-based AZ^_® 326 MIF, AZ^_® 726 MIF or AZ^_® 826 MIF developer (undiluted).

Recommended Removers for the AZ^_® 4500 Resists

For non cross-linked resist films the AZ^_® 100 Remover, DMSO or other common organic solvents cab be used as stripper. If the resist film is crosslinked (e. g. by high temperature steps > 140°C, during plasma processes such as dry etching, or during ion implantation), we recommend the NMP-free TechniStrip P1316 as remover.

Technical Data Sheet:

For further information please refer to the technical data sheet:
> AZ^_® 4500 series (TDS)