AZ® 5214 E

Image Reversal Resist for High Resolution

Thickness Range and Exposure

Film thickness: 1.0 ... 2.0 µm
UV-sensitivity: i-, h-line (310 - 420 nm), NOT g-line sensitive
Sales volumes:
250 ml, 500 ml, 1000 ml, 2,5 L and 5 L bottles

General Information

This special photoresist is intended forlift-off techniques which call for a negative side wall profile. The reversal bakemoderately cross-links the exposed resist making the developed structuresthermally stable up to approx. 130°C. Due to the comparably low resist filmthickness, the process parameter window for an undercut is rather small thusrequiring some optimizations in the exposure dose and the reversal bake parameters. Therefore, if the resolution required is not in the sub-µm range, a thickerresist such as the TI 35ESx (next section), or the AZ® nLOF 2000 negative resistsmight be a good alternative.

Development

AZ® 726 MIF or AZ® 351B 1 : 4 recommended;
AZ® 326 MIF or AZ® 400K 1 : 4 possible

Technical Data Sheet:

For further information please refer to the technical data sheet:
>
AZ® 5214 E (TDS)

 

Lithography Application Notes

Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here:
> application notes

Sales Volumes, Purity Grade and Shipping

Our typical lead time is 1-3 working days within Germany, lead times to other countries on request. On demand, in urgent cases our etchants can be shipped within 24 hours to a destination inside Germany.

Please send us your request.

e-mail: sales(at)microchemicals.com
phone: +49 (0)731 977 343 0
fax: +49 (0)731 977 343 29

Thank you very much for your interest!

The undercut of AZ® 5214E attained under optimized process parameters.
Source: AZ® 5200-EIR NEGATIVE TONE PROCESSING by AZ-EM®
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