AZ® 9200-Series: Thick Resists for High Resolution

Resist-Types, Thickness Range and Exposure

Types:
AZ 9260
: for film thickness 5 ... 20 µm
Sales volumes: 250 ml, 500 ml, 1000 ml and 3.78 L

AZ 9245: for film thickness 4 ... 6 µm
Sales volumes: 3.78 L

Beside the resist types above, MicroChemicals dilutes the AZ 9260 to different thickness levels. We call them:

AZ 9245:
AZ 9260 dil. 1:0,11 4.5 µm (for film thickness 4 ... 6 µm)
Sales volumes: 250 ml, 500 ml, 1000 ml

UV-sensitivity: i- and h-line (310 - 410 nm), broadband or monochromatic

General Information

Compared to the AZ® 4500 series, the AZ® 9200 resists have a lower optical absorption. This simplifies the exposure of (also very) thick resist films. Therefore – in combination with the missing g-line sensitivity – the AZ® 9200 series needs a higherexposure time under broadband condition, and reveals a lower development rate ascompared to AZ® 4500 films processed under the same conditions.

For lower resist film thicknesses we recommend a dilution with PGMEA = ‘AZ® EBRSolvent’. The following resist filmthicknesses refer to 4000 rpm understandard conditions:

4.0 µm:100 g AZ® 9260 + 13 g PGMEA

3.0 µm:100 g AZ® 9260 + 23 g PGMEA

2.0 µm:100 g AZ® 9260 + 42 g PGMEA

1.5 µm:100 g AZ® 9260 + 55 g PGMEA

1.0 µm:100 g AZ® 9260 + 88 g PGMEA

Development

AZ® 400K 1 : 4 or AZ® 726 MIF recommended. In case of very thick resist films, a rather strong developerconcentration such as AZ® 400K 1 : 3.5 ... 1 : 3.0 might be reasonable forrequired short development times.

Technical Data Sheet (TDS)

For further information refer to the technical data sheet of the AZ 9200 series (AZ 9245 and 9260): TDS AZ 9200 series

Lithography Application Notes

Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here: application notes.