AZ® P4000 Positive Resists

AZ® P4110, AZ® P4330, AZ® P4903, AZ® P4620

Outstanding Properties

The AZ® P4000 positive resist series with its members AZ® P4110, AZ® P4330, AZ® P4620 and AZ® P4903 have two main characteristics:

  • An improved adhesion to all common substrates for a higher stability for e. g. wet etching or plating
  • A lower photo active compound concentration which allows the application of thick and very thick resist films (approx. 3 - 30 µm)
  • Steep wall profiles, high aspect ratios
  • Sensitive to g-, h-, and i-line
  • Recommended developers: KOH-based (e. g. AZ® 400K) or TMAH-based (e. g. AZ® 826 MIF)
  • Standard strippers (e. g. AZ® 100 Remover, TechniStrip P1316)
  • Thinner and edge bead remover: AZ® EBR Solvent = PGMEA

AZ® P4110

Resist fim thickness range: Approx. 2 - 5 µm.
Sales volumes: 3.78 L (galone), smaller sales volumes on request

AZ® P4330

Resist fim thickness range: Approx. 3 - 8 µm.
Sales volumes:
3.78 L bottles (galone), smaller sales volumes on request

AZ® P4620

Resist fim thickness range: Approx. 6 - 20 µm.
Sales volumes:
250 ml, 500 ml, 1000 ml, 2,5 L and 3,78 L (galone)

AZ P4620 (15 µm holes at 24 µm film thickness for Au plating)

AZ® P4903

Resist fim thickness range: Approx. 8 - 30 µm
Sales volumes: 3.78 L bottles (galone), smaller sales volumes on request

Maximum Aspect Ratio for 5 - 20 µm Resist Film Thickness required?

For this purpose, we recommend our AZ® 9260

> 30 µm Resist Film Thickness required?

For this purpose, we recommend our chemically amplified AZ® 40XT

Development

AZ® 400K 1:4 or AZ® 826 MIF recommended.

Technical datasheet:

For further information please refer to the technical data sheet:
> AZ P4000 series (TDS)
> AZ P4620 (Additional Information)
> AZ P4000 series (Additional Information)

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