AZ® TFP 650
The TFP 650F 5 Resist is suitable for spin coat and extrusion coat applications excellent adhesion requirements and / or harsh etching conditions. The TFP 650F-5 is compatible with all commercially available wafer and photomask processing equipment. The main characteristics are:
- high photospeed
- low dark film loss
- optimized resist adhesion
- easy removal after hardbake
- high resistance to harsh etchants
Suited Developers for the TFP 650 F5:
For non cross-linked resist films the AZ 100 Remover, DMSO or other common organic solvents cab can be used as stripper. If the resist film is crosslinked (e.g. by high temperature steps >140° C, during plasma processes such as dry etching, or during ion implantation), we recommend the NMP-free, nontoxic TechniStrip P1316 as Remover or Technistrip P1331.
Technical Data Sheet (TDS):
For further information refer to the technical data sheet of the AZ TFP 650F Resist: TDS AZ TFP650 F
Lithography Application Notes
Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here: application notes.