Electroplating Photoresists

Overview of our Electroplating Photoresists

 

 

AZ® 15 nXT - Thick Negative Resist for Plating


We offer two types of AZ® 15nXT (AZ® 15nXT (450CPS) and AZ® 15nXT (115CPS)). The main differnece between the two types is the viscosity.

Here the direct comparison:

Thickness Range and Exposure

AZ® 15nXT (450CPS)

Substrate: Si wafer for photospeed testing; Cu wafer for imagesFilm
Thickness:
10 µm
Softbake: 110°C / 180 sec.
UV-sensitivity:
i-line (Dose = 400 ± 50 mJ/cm²; Focus: 1 ± 0,5 µm
PEB: 120°C / 60 sec.
Sales volumes: 100 ml, 250 ml, 500 ml, 1000 ml, 2.5 L, 3.78 L (gallon)

AZ® 15nXT (115 CPS)

Substrate: Si wafer for photospeed testing; Cu wafer for images
Thickness: 6 µm
Softbake: 110°C / 120 sec.
UV-sensitivity: i-line (Dose = 300 ±50 mJ/cm²; Focus: 1 ± 0,5 µm
PEB: 120°C / 60 sec.
Sales volumes: on request

General Information

AZ® 15 nXT is a cross-linking negative resist for resist film thicknesses up to approx. 30 µm. The high stability and superior adhesion make the AZ® 15 nXT well suited formost electroplating applications. The resist sidewalls are very steep up to a film thickness of approx. 10 µm, towards higher resist film thicknesses the resist profile becomes more and more negative allowing the electro-deposition of structures whichnarrow from bottom to top.

Outstanding Properties

  • 5 ... 20 µm resist film thickness via single-coating
  • Aqueous alkaline developers
  • Excellent adhesion, no underplating
  • Wide substrate compatibility: Cu, Au, Ti, NiFe, …
  • Wide plating compatibility: Cu, Ni, Au, …
  • Standard wet stripping processes

Developer

We recommend the TMAH-based, ready-to-use AZ®326 MIF Developer, AZ®726 MIF Developer or AZ®826 MIF Developer.

Resist Removal

The recommended stripper for the AZ® 15 nXT is the NMP-free, nontoxic TechniStrip NI555, which is compatible with all common (even alkaline sensitive) substrate materials and can even dissolve (not only peel from the substrate) crosslinked AZ® 15 nXT resist films.

Solvents such as NMP or the untoxic substitute DMSO are suited removers, if the resist film thickness and degree of crosslinking are not too high.

Generally, heating these removers up to 60 - 80°C, or/and ultrasonic treatment, might be required to fasten theresist removal in the case of very thick or strongly crosslinked resist films.

Technical Data Sheet

For further information please refer to the Technical Datasheet:
> AZ® 15 nXT (450 CPS)
> AZ®15 nXT (115 CPS)

General information to this topic
> Info AZ® 15nXT (450CPS)

5 µm lines at 10 µm resist film thickness
5 µm holes at 10 µm resist film thickness
5 µm plated CuNi image
3.6 µm plated CuNi image

AZ® 125 nXT - Ultra-Thick Negative Resist for Plating

General Information

AZ® 125 nXT is a cross-linking negative resist for resist film thicknesses up to 100 µm with standard parameters, and even more (1 mm resist film thickness realized!) with very steep sidewalls. The high stability and superior adhesion make the AZ® 125 nXT well suited for mostelectroplating applications where very thick films are required. This resist requires neither a post exposure bake nor any delays between the process steps (such as a rehydration step, or a delay for outgassing after exposure).

Outstanding Properties

  • 30 - 100 µm resist film thickness via single-coating
  • Up to 1 mm resist film thickness possible
  • Aqueous alkaline developers (e. g. AZ® 326/726/826 MIF)
  • No post exposure bake, photo-polymerization during exposure
  • No rehydration required, no N2-formation during exposure
  • Very good adhesion, no underplating
  • Wet stripping processes (e. g. TechniStrip P1316)
  • Optimized for electroplating, wet- and dry etching
  • 100 ml, 250 ml, 1000 ml and 3.78 L sales units

Developer

We recommend the TMAH-based, ready-to-use AZ®326 MIF Developer, AZ®726 MIF Developer or AZ®826 MIF Developer.

Resist Removal

The recommended stripper for the AZ® 125nXT is the NMP-free, untoxic TechniStrip P1316, which is compatible with all common (even alkaline sensitive) substrate materials. Solvents such as NMP or the untoxic substitute DMSO are suited removers, if the resist film thickness and degree of crosslinking are not too high. Generally, heating the removers up to 60 - 80°C, or/and ultrasonic treatment, might be required to fasten theresist removal in the case of very thick resist films.

Technical Data Sheet:

For further information please refer to the Technical Datasheet:
> AZ®_125nXT

General information to this topic:
> Info AZ® 125nXT

20 µm lines at 60 µm resist film thickness
15 µm holes at 60 µm resist film thickness
80 µm plated CuNi image
All images taken from: AZ® 15 nXT and 125 nXT Product Data Sheet of AZ-EM.

AZ® 40 XT

General Information

AZ® 40 XT is a chemically amplified ultrathick positive resist. The field of application of the AZ® 40 XT starts at 15 - 30 µm, where litho-processes with conventional positive resists become very time-consuming due to increasing delays for rehydraion of N2-outgassing, both not required for the AZ® 40 XT.

Even for very high resist film thicknesses, AZ® 40 XT requires only short softbake times, no delay for rehydration, very small exposure doses due to its chemical amplification, and shows a high development rate. Therefore, processing of the AZ® 40 XT goes much faster as compared to conventional thick resists.

Two points have to be considered when starting with the AZ® 40 XT:

  • The maximum softbake temperature must not be applied abruptly, in order prevent the formation of bubbles in the resist film. We recommend eirger the usage of a proximity hotplate, or a temperature ramp on a contact hotplate.
  • For the AZ® 40 XT, a post exposure bake is obligatory in order to complete the photoreaction and make the resit developable.

Technical Data Sheet:

For further information please refer to the Technical Datasheet:
> AZ® 40XT


AZ® 9200-Series: Thick Resists for High Resolution

Resist-Types, Thickness Range and Exposure

Types:
AZ® 9260
: for film thickness 5 ... 20 µm
Sales volumes: 250 ml, 500 ml, 1000 ml and 3.78 L

AZ® 9245: for film thickness 4 ... 6 µm
Sales volumes: 3.78 L

Beside the resist types above, MicroChemicals dilutes the AZ® 9260 to different thickness levels.
We call them:

AZ® 9245: AZ® 9260 dil. 1:0,11 4.5 µm (for film thickness 4 ... 6 µm)
Sales volumes: 250 ml, 500 ml, 1000 ml
UV-sensitivity: i- and h-line (310 - 410 nm), broadband or monochromatic

General Information

Compared to the AZ® 4500 series, the AZ® 9200 resists have a lower optical absorption. This simplifies the exposure of (also very) thick resist films. Therefore – in combination with the missing g-line sensitivity – the AZ® 9200 series needs a higherexposure time under broadband condition, and reveals a lower development rate ascompared to AZ® 4500 films processed under the same conditions.

For lower resist film thicknesses we recommend a dilution with PGMEA = ‘AZ® EBRSolvent’. The following resist filmthicknesses refer to 4000 rpm understandard conditions:

  • 4.0 µm:100 g AZ® 9260 + 13 g PGMEA
  • 3.0 µm:100 g AZ® 9260 + 23 g PGMEA
  • 2.0 µm:100 g AZ® 9260 + 42 g PGMEA
  • 1.5 µm:100 g AZ® 9260 + 55 g PGMEA
  • 1.0 µm:100 g AZ® 9260 + 88 g PGMEA

Development

AZ® 400K 1 : 4 or AZ® 726 MIF recommended. In case of very thick resist films, a rather strong developerconcentration such as AZ® 400K 1 : 3.5 ... 1 : 3.0 might be reasonable forrequired short development times.

Technical Data Sheet:

For further information please refer to the Technical Datasheet:
> AZ® 9200 series

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