TI 35 ESX
Image Reversal Resist
Thickness Range and Exposure
Film thickness: 2.5 ... 3.5 µm
UV-sensitivity: i- line 365nm, h-line 405 nm, g-line 435 nm, broadband or monochromatic
Resist Range: 330 - 440 nm
Sales volumes: 250 ml, 500 ml, 1000 ml, 2.5 L and 5 L bottles
The TI 35 ESX resist is specially designed for the application in the so called
“image reversal technology” for:
- subsequent lift-off of deposited layers with a thickness up to 4 μm
- plasma etching
The viscosity of the resist leads to a thickness range depending on the spinspeed
from 2.5-3.5 μm. The typical aspect ratio of the structured features
achievable is in the range of 1.0 ... 2.0.
This technical data sheet intends to give you a guide-line for process
parameters for various applications. However, the optimum values for e.g.
spin profile, exposure dose, or development depend on the individual
equipment and need to be adjusted on each individual demand.
Technical Data Sheet:
For further information please refer to the technical data sheet:
> TI 35 ESX (TDS)
Lithography Application Notes
Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here:
> application notes
Sales Volumes, Purity Grade and Shipping
Our typical lead time is 1-3 working days within Germany, lead times to other countries on request. On demand, in urgent cases our etchants can be shipped within 24 hours to a destination inside Germany.
Please send us your request.
phone: +49 (0)731 977 343 0
fax: +49 (0)731 977 343 29