Thickness Range and Exposure
Film thickness: 0.5 ... 5 µm
UV-sensitivity: i-, h-, g-line (310-440nm)
Sales volumes: 250ml, 500ml, 1L, 2.5L und 5 Liter
The TI Spray Photoresist is specially designed for the application in the so called “image reversal technology” for:
- subsequent lift-off of deposited layers
- wet chemical treatment in HF containing etching solutions
- direct mesa grooving
The viscosity enables a direct use in spray coating equipment for a target thickness of 1 to 10 µm. The typical aspect ratio of the structured features achievable is in the range of 1.6 .. 2.0.
This technical data sheet intends to give you a guide-line for process parameters for various applications. However, the optimum values for e.g. exposure dose, or development depend on the individual equipment and need to be adjusted on each individual demand.
AZ® 400K Developer, AZ® 826 MIF Developer recommended;
AZ® 351B possible
For further information please refer to Photoresist MicroChemicals TI Spray
Lithography Application Notes
Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here: application notes.