TI Spray

Thickness Range and Exposure

Film thickness: 0.5 ... 5 µm
UV-sensitivity: i-, h-, g-line (310-440nm)
Sales volumes: 250ml, 500ml, 1L, 2.5L und 5 Liter

General Information

The TI Spray Photoresist is specially designed for the application in the so called “image reversal technology” for:

  • subsequent lift-off of deposited layers
  • wet chemical treatment in HF containing etching solutions
  • direct mesa grooving

The viscosity enables a direct use in spray coating equipment for a target thickness of 1 to 10 µm. The typical aspect ratio of the structured features achievable is in the range of 1.6 .. 2.0. 

This technical data sheet intends to give you a guide-line for process parameters for various applications. However, the optimum values for e.g. exposure dose, or development depend on the individual equipment and need to be adjusted on each individual demand.

Developer

AZ® 400K Developer, AZ® 826 MIF Developer recommended;
AZ® 351B possible


 
For further information please refer to Photoresist MicroChemicals TI Spray

 

Lithography Application Notes

Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here: application notes.

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