TI xLift Photoresist
Thickness Range and Exposure
Film thickness: 4 ... 25 μm sales volumes: from 250 ml
UV-sensitivity: i, h, and g-line (310 - 440 µm), broadband and monochromatic
Sales volumes: 250 ml, 500 ml, 1.000 ml, 2500 ml and 5 Liter
TI xLift is specially designed for the application in the so called "image reversal technology" for subsequent lift-off of thick and very thick deposited layers. For harsh chemical attack, such as direct mesa grooving in HF-HNO3 containing media or etching in high HF-concentrations prefer TI 35E.
What 'adjustable undercut means' - two examples
AZ® 400K 1:3 ... 1:4
For further information refer Photoresist MicroChemicals TI xLift
Lithography Application Notes
Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here: application notes.