TI xLift Photoresist

Thickness Range and Exposure

Film thickness: 4 ... 25 μm sales volumes: from 250 ml
UV-sensitivity:
 i, h, and g-line (310 - 440 µm), broadband and monochromatic
Sales volumes: 250 ml, 500 ml, 1.000 ml, 2500 ml and 5 Liter

General Information

TI xLift is specially designed for the application in the so called "image reversal technology" for subsequent lift-off of thick and very thick deposited layers. For harsh chemical attack, such as direct mesa grooving in HF-HNO3 containing media or etching in high HF-concentrations prefer TI 35E.

What 'adjustable undercut means' - two examples

 

Developer

AZ® 400K 1:3 ... 1:4
AZ® 826MIF

 

For further information refer Photoresist MicroChemicals TI xLift

 

Lithography Application Notes

Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here: application notes.

10.5 μm thick metal finger via lift-off with TI xLift
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