TI xLift-X Photoresist

former TI xLift

NOTE: The features of the new TI xLift-X are almost identical to the previous TI xLift. There should be no problems with the application.

Thickness Range and Exposure

Film thickness: 4 ... 25 μm
UV-sensitivity:
 i, h, and g-line (310 - 440 µm), broadband and monochromatic
Sales volumes: 250 ml, 500 ml, 1.000 ml, 2,5 L and 5 L bottles

General Information

TI xLift-X is specially designed for the application in the so called "image reversal technology" for subsequent lift-off of thick and very thick deposited layers. For harsh chemical attack, such as direct mesa grooving in HF-HNO3 containing media or etching in high HF-concentrations prefer TI 35 E.

What 'adjustable undercut means' - two examples

Developer

AZ® 400K 1:3 ... 1:4
AZ® 826 MIF Developer

Technical Data Sheet:

For further information please refer to the technical data sheet:
> TI xLift-X (TDS)

 

Lithography Application Notes

Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here:
> application notes

Sales Volumes, Purity Grade and Shipping

Our typical lead time is 1-3 working days within Germany, lead times to other countries on request. On demand, in urgent cases our etchants can be shipped within 24 hours to a destination inside Germany.

Please send us your request.

e-mail: sales(at)microchemicals.com
phone: +49 (0)731 977 343 0
fax: +49 (0)731 977 343 29

Thank you very much for your interest!

10.5 μm thick metal finger via lift-off with TI xLift
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