TI xLift-X Photoresist

NOTE: The features of the new TI xLift-X are almost identical to the previous TI xLift. There should be no problems with the application.

Thickness Range and Exposure

Film thickness: 4 ... 25 μm
UV-sensitivity: i, h, and g-line (310 - 440 µm), broadband and monochromatic
Sales volumes: 250 ml, 500 ml, 1.000 ml, 2,5 L and 5 L bottles

General Information

TI xLift-X is specially designed for the application in the so called "image reversal technology" for subsequent lift-off of thick and very thick deposited layers. For harsh chemical attack, such as direct mesa grooving in HF-HNO3 containing media or etching in high HF-concentrations prefer TI 35 E.

Developer

AZ^_® 400K 1:3 ... 1:4
AZ^_® 826 MIF Developer

Technical Data Sheet:

For further information please refer to the technical data sheet:
> TI xLift-X (TDS)

10.5 μm thick metal finger via lift-off with TI xLift