PGMEA = EBR Solvent

1-methoxy-2-propyl-acetate

Typical Fields of Application of PGMEA

PGMEA is the solvent/thinner of almost all AZ® and TI photoresists due to its low vapor pressure and its suppression of particle formation in the (further diluted) resist. Additionally, PGMEA is often used for edge bead removal, since its low vapor pressure prevents further thinning of the coated resist film.

Technical Data Sheet:

For further information please refer to the technical data sheet:
> EBR Solvent (TDS)
> Solvents: Theory and Application

 

Lithography Application Notes

Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here:
> application notes

Sales Volumes, Purity Grade and Shipping

Available Sales Units:

  • Bottles á 5 L (1 PU = 4 x 5 liters or single bottles)
  • 30 L or 200 L drums on request

Available Purity Grade:

  • VLSI

Our typical lead time is 1-3 working days within Germany, lead times to other countries on request. On demand, in urgent cases our etchants can be shipped within 24 hours to a destination inside Germany.

Please send us your request.

e-mail: sales(at)microchemicals.com
phone: +49 (0)731 977 343 0
fax: +49 (0)731 977 343 29

Thank you very much for your interest!

Physical Properties of PGMEA:

Density
Melting point
Boiling point
Flash point
Vapour pressure @ 20°C

0.97 g/cm3
-66°C
125°C
45°C
5 hPa

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