Remover / Stripper
AZ Kwik Strip
AZ® Kwik Strip® remover is a high performance photoresist stripper containing safer solvents that allow for cleaner substrate surfaces and exceptional removal of novolac resins and other organic contaminants. This remover has a neutral pH and will not damage underlying layers of metal. The material is engineered to remove photoresist that has been hard baked up to 170°C. AZ Kwik Strip remover is completely water rinsable and compatible with processes involving automatic wet stripping equipment. The recommended process is double immersion with agitation at room temperature to 90°C. For most applications, fi ve to ten minutes at 60°C is more than suffi cient. AZ Kwik Strip remover is a high purity material fi ltered to 0.2 µm and produced with trace metals controlled to < 50 ppb.
Some Features are:
Amine free, Non-corrosive to Cu, Gatts, and Cu/Al alloys..., biodegradable.
For further information refer AZ Kwik Strip.pdf
AZ 100 Remover
AZ® 100 Remover is based on solvent and amine. AZ® 100
Remover is used for photoresist stripping with low
attack to aluminium. Low hazard is achieved by avoiding
use of ethanol amine.
Low evaporation rate allows for use at elevated
temperatures (up to 80°C), high efficiency (>3000
wafer per litre) helps saving costs. Where attack to
aluminium is of no concern, it may even be diluted with
water.
For further information refer AZ
100 Remover.pdf
NMP (1-methyl-2-pyrrolidone)
NMP is a powerful lift-off medium due to its
physical properties: NMP yields a low vapour pressure
(no striation formation), strongly solves organic
impurities as well as resists, keeps solved particles in
solution, and can be heated due to its high boiling
point.
For the same reasons, NMP (pure or diluted in H2O) gives a very well-suited stripper for photoresists
processed under harsh conditions.
For further information refer NMP.pdf
®AZ, the AZ logo, BARLi , Aquatar and
Kallista are registered trademarks of AZ Electronic
Materials.
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