Solvents
Physical Properties
The plot below shows the physical properties flash
point, boiling point and vapour pressure of selected
solvents. These properties impact on the field of
application as well as on operational safety.
The following gives an overview of our available
solvents and their suited fields of application.
Solvents and their Fields of Application
Acetone
Acetone removes organic impurities from substrates
and is wellsuited for greasy/oily contaminations. Its
high evaporation rate, however, requires a subsequent
cleaning step in e. g. isopropyl alcohol in order to
avoid striations on the substrate. Acetone is not
well-suited as lift-off medium due to the high fire
danger when heated and the trend of particles to be
lifted to resorb onto the substrate.
For further information refer Acetone.pdf
Cyclopentanone
Cylcopentanone is often used as solvent in epoxy based resist formulations. Cyclopentanone is also an organic developer for some cross linking resists.
For further information refer Cyclopentanone.pdf
Ethyl Lactate
Ethyl lactate is – besides PGMEA – a suited thinner
for AZ® and TI photoresists due to its high boiling
point.
For further information refer Ethyl
Lactate.pdf
Ethyl Acetate
Ethyl Acetate is a solvent with a boiling point of 77°C. The vapor pressure at roomtemperature 97 hPa. Ethylacetate has the chemical formula is C 4H 8O 2 . It can be easily solved in acetone, and alkohols, but fairly bad in water (80g per Liter).
We sell this material in units of 2.5 Liter in VLSI quality.
For further information refer Ethyl Acetate.pdf
Isopropyl Alcohol
Isopropyl alcohol is well-suited for rinsing
contaminated acetone as well as removing particles from
surfaces. Therefore, this solvent is often used in the
second substrate cleaning step after acetone.
Additionally, isopropyl alcohol is used as additive for
anisotropic Sietching.
For further information refer Isopropyl
Alcohol.pdf
MEK
MEK (methyl ethyl ketone) with its low boiling point can
be used as
MicroChemicals additional thinner for spray coating
resists, which require a fast resist film drying on
the substrate.
For further information refer Methyl
Ethyl Ketone.pdf
Methanol
Methanol can be used as a powerful solvent for
contaminated acetone in a three-step (substrate)
cleaning process (acetone à methanol à isopropyl
alcohol). However, due to its toxicity, its application
should be carefully considered.
For further information refer Methanol.pdf
NMP (1-methyl-2-pyrrolidone)
NMP is a powerful lift-off medium due to its physical
properties: NMP yields a low vapour pressure (no
striation formation), strongly solves organic impurities
as well as resists, keeps solved particles in solution,
and can be heated due to its high boiling point. For the
same reasons, NMP (pure or diluted in H2O) gives a very
well-suited stripper for photoresists processed under
harsh conditions.
For further information refer N-METHYL
2 PYRROLIDONE NMP.pdf
PGMEA (1-methoxy-2-propyl-acetate)/
EBR Solvent
PGMEA is the solvent/thinner of almost all AZ® and TI
photoresists due to its low vapor pressure and its
suppression of
particle formation in the (further diluted) resist.
Additionally, PGMEA is often used for edge bead removal,
since its low vapor pressure prevents further thinning
of the coated resist film.
For further information refer EBR
Solvent.pdf
Purification Grades and Packaging
We supply all solvents listed in the previous section in
VLSI quality. Acetone, isopropyl alcohol, and NMP are
additionally available in ULSI grade. Please contact us
for other solvents in ULSI quality! All solvents listed
are available in 2.5 L or 5 L sales units. Bigger sales
units on request!
Shipping Times and Pricing
Our typical lead time is 3-5 working days within
Germany, lead times to other countries on request. On
demand, in urgent cases our etchants can be shipped
within 24 hours within Germany.
For an offer, please contact us via:
e-mail: sales@microchemicals.com
phone: +49 (0)731 36080 409
fax: +49 (0)731 36080 908
Thank you very much for your interest!
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