Products       Downloads       Support        News        Company       Contact                     US+Asia contact

TI Prime

TI Prime
The TI PRIME adhesion promoter improves resist adhesion on substrates such as Si or glass
Processing the TI PRIME
Substrate preparation: After (optional, but recommended) cleaning the substrate with acetone and subsequently isopropyle, put the substrate on the hotplate at a minimum temperature of 120 °C for 10 minutes to remove adsorbed water from the substrates surface. Alternatively, you can use a furnace at same temperature for 30 min.
Spin coat the TI PRIME at approx. 2000-4000 U/min for approx. 20 seconds. After spin-coating, no residual drops or film of TI PRIME should be visible.
Bake the substrate at 120°C for 2 minutes on the hotplate (when using a furnace, 130°C for 10 min is recommended)
Proceed with spin-coating the resist immediately and proceed as usual.

For further information refer MicroChemicals^®TI_Prime.pdf