MicroChemicals Silizium, Quarz-, Glas- und Fused Silica Wafer Lagerliste (Zuletzt aktualisiert am 11.10.2024 19:12 MEZ)
Andere Wafer-Typen (auch vereinzelte Wafer-Stücke) und technische Details gerne auf Anfrage: info@microchemicals.com
1 Zoll Silizium, Quarz, Quarzglas, Fused Silica und Glas Wafer
| Qual. | Material | Größe (Zoll) | Orien- tierung | Poliert | Dicke (μm) | Dotierung | Widerstand (ohm cm) | Beschichtung | # verfügbar aktuell1/in Bälde2 | Artikel-Nummer (zum WebShop) | |
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| | Borosilicate | 1 | ### | beidseitig | 250 ± 25 | | | | 200 / 200 | WGS10250250XXXXXXNN1 | | | | Borosilicate glass 1 inch, thickness = 250 ± 25 μm, 2-side polished, TTV < 10 μm, packaging units of 100 wafers - no flat | | | Wafer-Preis (netto): € 3.20 (100 Wafer), € 3.00 (300 Wafer), € 2.90 (500 Wafer), € 2.80 (1000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Quartz | 1 | Z-Cut | beidseitig | 500 ± 20 | | | | 200 / 200 | WQC10500200X0000XNN1 | | | | Quartz wafer 1 inch, thickness = 500 ± 20 μm, Z-Cut, 2-side polished, no flat, packaging units of 25 wafers | | | Wafer-Preis (netto): € 18.00 (25 Wafer), € 16.50 (50 Wafer), € 15.00 (100 Wafer), € 14.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 1 | (100) | beidseitig | 150 ± 25 | Bor | 0.008 - 0.02 | | 105 / 105 | WSA10150250B8021XNN1 | | | | Prime CZ-Si wafer 1 inch, thickness = 150 ± 25 μm, (100), 2-side polished, p-type (Boron), 0.008 - 0.02 Ohm cm, no flat | | | Wafer-Preis (netto): € 10.00 (25 Wafer), € 9.00 (50 Wafer), € 8.40 (100 Wafer), € 8.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 5 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Prime | CZ-Si | 1 | (100) | beidseitig | 200 ± 25 | Bor | 1 - 10 | | 97 / 397 | WSA10200250B1314XNN1 | | | | Prime CZ-Si wafer 24.5 +/- 0.3 mm diameter, thickness = 200 ± 25 μm, (100), 2-side polished, p-type (Boron), TTV < 10 μm, 1 - 10 Ohm cm, !! no flat !!, units of 50 wafers stacked in cakeboxes | | | Wafer-Preis (netto): € 6.80 (25 Wafer), € 5.60 (50 Wafer), € 5.00 (100 Wafer), € 4.80 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 22 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Prime | CZ-Si | 1 | (100) | beidseitig | 280 ± 25 | Bor | 1 - 10 | | 509 / 509 | WSA10280250B1314XNN1 | | | | Prime CZ-Si wafer 1 inch, thickness = 280 ± 25 μm, (100), 2-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, no flat, units of 50 wafers stacked in cakeboxes | | | Wafer-Preis (netto): € 6.00 (50 Wafer), € 5.50 (100 Wafer), € 5.00 (200 Wafer), € 4.60 (500 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 1 | (100) | einseitig | 275 ± 25 | Bor | 1 - 20 | | 200 / 200 | WSD10275250B1324XNN1 | | | | Prime CZ-Si wafer 1 inch, thickness = 275 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 20 Ohm cm, 1 flat (8+/-2mm length), units of 25 wafers stacked in blister boxes | | | Wafer-Preis (netto): € 6.00 (25 Wafer), € 5.50 (50 Wafer), € 5.00 (75 Wafer), € 4.80 (100 Wafer), € 4.60 (200 Wafer), € 4.40 (500 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 1 | (100) | einseitig | 280 ± 25 | Arsen | 0.001 - 0.005 | | 141 / 141 | WSD10280250A1050SNN1 | | | | Prime CZ-Si wafer 1 inch, thickness = 280 ± 25 μm, (100), 1-side polished, TTV < 10 μm, 0.001 - 0.005 Ohm cm, no flat | | | Wafer-Preis (netto): € 6.00 (25 Wafer), € 5.50 (50 Wafer), € 5.00 (100 Wafer), € 4.80 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 16 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Prime | CZ-Si | 1 | (100) | einseitig | 280 ± 25 | Bor | 0.001 - 0.05 | | 1229 / 1229 | WSD10280250B1051XNN1 | | | | Prime CZ-Si wafer 1 inch, thickness = 280 ± 25 μm, (100), 1-side polished, p-type (Boron), TTV < 10 μm, 0.001 - 0.05 Ohm cm, no flat | | | Wafer-Preis (netto): € 6.00 (25 Wafer), € 5.50 (50 Wafer), € 5.00 (100 Wafer), € 4.80 (200 Wafer), € 4.40 (500 Wafer), € 4.00 (1000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 4 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Prime | CZ-Si | 1 | (100) | einseitig | 280 ± 25 | Bor | 1 - 20 | | 194 / 194 | WSD10280250B1324SNN1 | | | | Prime CZ-Si wafer 1 inch, thickness = 280 ± 25 μm, (100), 1-side polished, p-type (Boron), 1 - 20 Ohm cm, 1 Flat (8+/-2mm) | | | Wafer-Preis (netto): € 6.00 (25 Wafer), € 5.50 (50 Wafer), € 4.80 (100 Wafer), € 4.60 (200 Wafer), € 4.40 (500 Wafer), € 4.20 (1000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 19 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Prime | CZ-Si | 1 | (100) | einseitig | 625 ± 25 | Bor | 1 - 20 | | 183 / 1183 | WSD10625250B1324XNN1 | | | | Prime CZ-Si wafer 1 inch, thickness = 625 ± 25 μm, (100), 1-side polished, p-type (Boron), TTV < 10 μm, 1 - 20 Ohm cm, no Flat | | | Wafer-Preis (netto): € 6.20 (25 Wafer), € 5.50 (50 Wafer), € 4.50 (100 Wafer), € 4.30 (200 Wafer), € 3.80 (1000 Wafer), € 2.90 (10000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 8 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Dummy3 | CZ-Si | 1 | (100) | einseitig | 275 ± 25 | Bor | 1 - 20 | | 256 / 256 | WSV10275250B1324XNN1 | | | | Dummy CZ-Si wafer 1 inch, thickness = 275 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 20 Ohm cm, no flat, units of 25 wafers, not particle specified (packaging leaves back particles which need to be cleaned before being used in particle-critical applications) | | | Wafer-Preis (netto): auf Anfrage | |
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| Dummy3 | CZ-Si | 1 | (100) | einseitig | 2500 ± 50 | Bor | 1 - 10 | | 225 / 225 | WSV12500500B1314XNN1 | | | | CZ-Si wafer 33 mm diameter, thickness = 2500 ± 50 μm, (100), 1-side polished (optical grade), p-type (Boron), 1 - 10 Ohm cm, no flat | | | Wafer-Preis (netto): € 22.00 (25 Wafer), € 18.00 (50 Wafer), € 12.50 (300 Wafer), € 11.00 (1000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (dry) | 1 | (100) | einseitig | 500 ± 25 | | 20 - 100000 | 20 nm | 2999 / 2999 | WTD10500250X2418S021 | | | | Prime FZ-Si + dry SiO2 wafer 1 inch, thickness = 500 ± 25 μm, (100), 1-side polished, TTV < 10 μm, 20 - 100000 Ohm cm, 25 nm thermal SiO2 (+/- 15 %, with +/- 10 % on best effort) on both sides, primary flat 8 mm, intrinsic/undoped | | | Wafer-Preis (netto): € 9.00 (1000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 1 | ### | beidseitig | 500 ± 25 | | | | 75 / 75 | WUS10500250X0000SNN1 | | | | Fused silica JGS2 wafer 1 inch (!! 25.0 +/- 0.3 mm !!), thickness = 500 ± 25 μm, 2-side polished, 1 Flat | | | Wafer-Preis (netto): € 8.00 (25 Wafer), € 7.50 (50 Wafer), € 7.20 (100 Wafer), € 6.90 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 1 | ### | beidseitig | 500 ± 25 | | | | 769 / 769 | WUS10500250X0000XNN1 | | | | Fused silica JGS2 wafer 1 inch, thickness = 500 ± 25 μm, 2-side polished, TTV < 10 μm, no Flat | | | Wafer-Preis (netto): € 5.50 (75 Wafer), € 5.00 (150 Wafer), € 4.60 (300 Wafer), € 4.40 (600 Wafer), € 4.20 (1200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 1 | ### | beidseitig | 1000 ± 50 | | | | 307 / 307 | WUS11000500X0000SNN1 | | | | Fused silica JGS1 wafer 1 inch, thickness = 1000 ± 50 μm, 2-side polished, TTV < 10 μm, no Flat | | | Wafer-Preis (netto): auf Anfrage | |
Sie wünschen eine Preisauskunft oder ein Angebot? Senden Sie uns eine Nachricht an info@microchemicals.com mit den gewünschten Artikelnummern (die 20-stellige zeichenfolge rechts in der Tabelle) und Stückzahlen, wir melden uns umgehend bei Ihnen!
2 Zoll Silizium, Quarz, Quarzglas, Fused Silica und Glas Wafer
| Qual. | Material | Größe (Zoll) | Orien- tierung | Poliert | Dicke (μm) | Dotierung | Widerstand (ohm cm) | Beschichtung | # verfügbar aktuell1/in Bälde2 | Artikel-Nummer (zum WebShop) | |
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| Prime | FZ-Si | 2 | (100) | beidseitig | 280 ± 10 | | 10000 - 100000 | | 105 / 105 | WFA20280100X1718XNN1 | | | | Prime FZ-Si wafer 2 inch, thickness = 280 ± 10 μm, (100), 2-side polished, TTV < 10 μm, 10000 - 100000 Ohm cm | | | Wafer-Preis (netto): € 27.40 (5 Wafer), € 22.80 (10 Wafer), € 18.00 (25 Wafer), € 17.00 (50 Wafer), € 16.00 (100 Wafer), € 15.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 2 | (100) | beidseitig | 500 ± 15 | Bor | 1000 - 100000 | | 125 / 125 | WFA20500150B1618SNN1 | | | | Prime FZ-Si wafer 2 inch, thickness = 500 ± 15 μm, (100), 2-side polished, p-type (Boron), TTV < 10 μm, 1000 - 100000 Ohm cm | | | Wafer-Preis (netto): € 18.00 (25 Wafer), € 16.00 (50 Wafer), € 14.00 (75 Wafer), € 12.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 2 | (100) | beidseitig | 500 ± 15 | Phosphor | 1000 - 100000 | | 139 / 139 | WFA20500150P1618SNN1 | | | | Prime FZ-Si wafer 2 inch, thickness = 500 ± 15 μm, (100), 2-side polished, n-type (Phosphor), TTV < 10 μm, 1000 - 100000 Ohm cm | | | Wafer-Preis (netto): € 18.00 (25 Wafer), € 16.00 (50 Wafer), € 14.00 (75 Wafer), € 12.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 14 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Prime | FZ-Si | 2 | (100) | beidseitig | 1500 ± 25 | Bor | 3000 - 100000 | | 128 / 128 | WFA21500250B3618SNN1 | | | | Prime FZ-Si wafer 2 inch, thickness = 1500 ± 25 μm, (100), 2-side polished, p-type (Boron), TTV < 10 μm, 2 Flats, 3000 - 100000 Ohm cm | | | Wafer-Preis (netto): € 41.40 (5 Wafer), € 36.80 (10 Wafer), € 32.00 (25 Wafer), € 28.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 2 | (100) | einseitig | 280 ± 25 | | 10000 - 1000000 | | 100 / 100 | WFD20280250X1719XNN1 | | | | Prime FZ-Si wafer 2 inch, thickness = 280 ± 25 μm, (100), 1-side polished, TTV < 10 μm, 10000 - 1000000 Ohm cm, no Flat, units of 25 wafers | | | Wafer-Preis (netto): € 16.00 (25 Wafer), € 14.50 (50 Wafer), € 13.20 (100 Wafer), € 12.80 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 2 | (100) | einseitig | 300 ± 10 | | 5000 - 1000000 | | 147 / 147 | WFD20300105X5619SNN2 | | | | Prime FZ-Si wafer 2 inch, thickness = 300 ± 10 μm, (100), 1-side polished, TTV < 5 μm, 5000 - 1000000 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 23.40 (5 Wafer), € 18.80 (10 Wafer), € 14.00 (25 Wafer), € 13.50 (50 Wafer), € 13.00 (100 Wafer), € 12.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 2 | (100) | einseitig | 1600 ± 25 | Bor | 3000 - 3000 | | 18 / 18 | WFD21600250B3638SNN1 | | | | Prime FZ-Si wafer 2 inch, thickness = 1600 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, > 3000 ohm cm, 2 SEMI Flats, bow/warp < 40 μm | | | Wafer-Preis (netto): € 33.40 (5 Wafer), € 28.80 (10 Wafer), € 24.00 (25 Wafer), € 21.00 (50 Wafer), € 19.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 2 | (100) | einseitig | 1600 ± 25 | Phosphor | 3000 - 3000 | | 27 / 27 | WFD21600250P3638SNN1 | | | | Prime FZ-Si wafer 2 inch, thickness = 1600 ± 25 μm, (100), 1-side polished, n-type (Phosphor TTV < 10 μm, > 3000 ohm cm, 2 SEMI Flats, bow/warp < 40 μm | | | Wafer-Preis (netto): € 33.40 (5 Wafer), € 28.80 (10 Wafer), € 24.00 (25 Wafer), € 21.00 (50 Wafer), € 19.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 2 | (111) | einseitig | 415 ± 15 | | 10000 - 100000 | | 87 / 87 | WFF20415150X1718XNN1 | | | | Prime FZ-Si wafer 2 inch, thickness = 415 ± 15 μm, (111), 1-side polished, TTV < 10 μm, 10000 - 100000 Ohm cm, undoped/intrinsic | | | Wafer-Preis (netto): auf Anfrage | |
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| | Borosilicate | 2 | ### | beidseitig | 500 ± 25 | | | | 600 / 600 | WGS2050025XX0000SNN1 | | | | Borosilicate glass 2 inch glass wafer, thickness = 500 ± 25 μm, 2-side polished, primary flat 16 mm | | | Wafer-Preis (netto): € 7.00 (25 Wafer), € 6.50 (50 Wafer), € 6.00 (100 Wafer), € 5.60 (300 Wafer), € 5.20 (1000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Borosilicate | 2 | ### | beidseitig | 500 ± 25 | | | | 1206 / 1206 | WGS2050025XX0000SNN2 | | | | Borosilicate glass 2 inch glass wafer, thickness = 500 ± 25 μm, 2-side polished, no flat | | | Wafer-Preis (netto): € 16.40 (5 Wafer), € 11.80 (10 Wafer), € 7.00 (25 Wafer), € 6.50 (50 Wafer), € 6.00 (100 Wafer), € 5.60 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Borosilicate | 2 | ### | beidseitig | 2000 ± 25 | | | | 90 / 90 | WGS22000250X0000SNN1 | | | | Borosilicate 2 inch, thickness = 2000 ± 25 μm, 2-side polished, 1 Flat, units of 30 wafers | | | Wafer-Preis (netto): € 16.50 (30 Wafer), € 14.00 (60 Wafer), € 13.00 (120 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Borosilicate | 2 | ### | beidseitig | 2000 ± 25 | | | | 32 / 32 | WGS22000250X0000SNN2 | | | | Borosilicate 2 inch, thickness = 2000 ± 25 μm, 2-side polished, TTV < 10 μm, no flat | | | Wafer-Preis (netto): auf Anfrage | |
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| | Quartz | 2 | Y-Cut | beidseitig | 200 ± 25 | | | | 24 / 74 | WQB20200250X0000SNN1 | | | | Quartz wafer 2 inch (50.8 mm), Y-cut, thickness = 200 ± 25 μm, Y-Cut, 2-side polished, seedless, 1 SEMI Flat | | | Wafer-Preis (netto): € 42.40 (5 Wafer), € 37.80 (10 Wafer), € 33.00 (25 Wafer), € 31.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Quartz | 2 | ST-Cut | beidseitig | 700 ± 25 | | | | 50 / 50 | WQL20700250XXXXXSNN1 | | | | Quartz wafer 2 inch, thickness = 700 ± 25 μm, ST-Cut, 2-side polished, TTV < 10 μm, 1 SEMI Flat | | | Wafer-Preis (netto): € 28.40 (5 Wafer), € 23.80 (10 Wafer), € 19.00 (25 Wafer), € 18.00 (50 Wafer), € 17.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (100) | beidseitig | 200 ± 10 | Bor | 1 - 10 | | 23 / 23 | WSA20200105B1314SNN1 | | | | Prime CZ-Si wafer 2 inch, thickness = 200 ± 10 μm, (100), 2-side polished, p-type (Boron) TTV < 5 μm, 1 - 10 Ohm cm, 1 SEMI flat | | | Wafer-Preis (netto): € 17.40 (5 Wafer), € 12.80 (10 Wafer), € 8.40 (25 Wafer), € 8.10 (50 Wafer), € 7.80 (100 Wafer), € 7.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (100) | beidseitig | 279 ± 20 | Bor | 1 - 10 | | 359 / 359 | WSA20279200B1314SNN1 | | | | Prime CZ-Si-Wafer 2 inch, thickness = 279 ± 20 μm, (100), 2-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 18.40 (5 Wafer), € 13.80 (10 Wafer), € 9.00 (25 Wafer), € 8.50 (50 Wafer), € 8.00 (100 Wafer), € 7.80 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (100) | beidseitig | 500 ± 15 | Bor | 1 - 10 | | 80 / 80 | WSA20500150B1314SNN1 | | | | Prime CZ-Si wafer 2 inch, thickness = 500 ± 15 μm, (100), 2-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 16.40 (5 Wafer), € 11.80 (10 Wafer), € 7.00 (25 Wafer), € 6.80 (50 Wafer), € 6.00 (75 Wafer), € 5.80 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (100) | beidseitig | 500 ± 15 | Phosphor | 1 - 10 | | 100 / 100 | WSA20500150P1314SNN1 | | | | Prime CZ-Si wafer 2 inch, thickness = 500 ± 15 μm, (100), 2-side polished, n-type (Phosphor), TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 8.00 (25 Wafer), € 6.50 (50 Wafer), € 6.00 (75 Wafer), € 5.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (100) | einseitig | 279 ± 20 | Phosphor | 1 - 10 | | 995 / 995 | WSD20279200P1314SNN1 | | | | Prime CZ-Si-Wafer 2 inch, thickness = 279 ± 20 μm, (100), 1-side polished, n-type (Phosphor) TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 16.90 (5 Wafer), € 12.30 (10 Wafer), € 7.50 (25 Wafer), € 7.00 (50 Wafer), € 6.70 (100 Wafer), € 6.50 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (100) | einseitig | 280 ± 10 | Bor | 0.01 - 0.02 | | 25 / 25 | WSD20280100B1121SNN2 | | | | Prime CZ-Si wafer 2 inch, thickness = 280 ± 10 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 0.01 - 0.02 Ohm cm, Flats: 1, [InvP] | | | Wafer-Preis (netto): € 16.40 (5 Wafer), € 11.80 (10 Wafer), € 7.00 (25 Wafer), € 6.80 (50 Wafer), € 6.50 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (100) | einseitig | 280 ± 15 | Arsen | 0.001 - 0.005 | | 311 / 311 | WSD20280150A1050SNN1 | | | | Prime CZ-Si wafer 2 inch, thickness = 280 ± 15 μm, (100), 1-side polished, TTV < 10 μm, n-type (Arsen), 0.001 - 0.005 Ohm cm | | | Wafer-Preis (netto): € 16.40 (5 Wafer), € 11.80 (10 Wafer), € 7.00 (25 Wafer), € 6.50 (50 Wafer), € 6.20 (100 Wafer), € 6.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (100) | einseitig | 280 ± 25 | Bor | 1 - 10 | | 99 / 99 | WSD20280250B1314SNN1 | | | | Prime CZ-Si wafer 2 inch, thickness = 280 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 7.50 (25 Wafer), € 6.80 (50 Wafer), € 6.40 (100 Wafer), € 6.00 (200 Wafer), € 5.70 (500 Wafer), € 5.40 (1000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 24 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Prime | CZ-Si | 2 | (100) | einseitig | 400 ± 25 | Phosphor | 10 - 20 | | 175 / 175 | WSD20400250P1424SNN1 | | | | Prime CZ-Si wafer 2 inch, thickness = 400 ± 25 μm, (100), 1-side polished, n-type (Phosphor), TTV < 10 μm, 10 - 20 Ohm cm | | | Wafer-Preis (netto): € 17.40 (5 Wafer), € 12.80 (10 Wafer), € 8.00 (25 Wafer), € 7.50 (100 Wafer), € 7.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (100) | einseitig | 500 ± 25 | Bor | 1 - 10 | | 620 / 620 | WSD20500250B1314SNN1 | | | | Prime CZ-Si wafer 2 inch, thickness = 500 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 16.60 (5 Wafer), € 12.00 (10 Wafer), € 7.20 (25 Wafer), € 6.50 (50 Wafer), € 6.20 (100 Wafer), € 6.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (100) | einseitig | 775 ± 25 | Bor | 10 - 20 | | 200 / 200 | WSD20775250B1424SNN1 | | | | Prime CZ-Si wafer 2 inch, thickness = 775 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 10 - 20 Ohm cm, 1 SEMI Flat | | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | CZ-Si | 2 | (100) | einseitig | 2000 ± 25 | Bor | 1 - 20 | | 75 / 75 | WSD22000250B1324SNN1 | | | | Prime CZ-Si wafer 2 inch, thickness = 2000 ± 25 μm, (100), 1-side polished, p-type (Boron), 1 - 20 Ohm cm, Flat: SEMI Standard, units of 25 wafers stacked | | | Wafer-Preis (netto): € 16.00 (25 Wafer), € 14.00 (50 Wafer), € 12.50 (100 Wafer), € 12.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (100) | einseitig | 3000 ± 25 | Arsen | 0.001 - 0.005 | | 9 / 9 | WSD23000250A1050SNN1 | | | | Prime CZ-Si wafer 2 inch, thickness = 3000 ± 25 μm, (100) +/- 0.5°, 1-side polished, n-type (Arsen), 0.001 - 0.005 Ohm cm, TTV < 10 μm, Bow/Warp < 30 μm, 1 SEMI Flat | | | Wafer-Preis (netto): € 17.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (100) | einseitig | 3000 ± 25 | Arsen | 0.001 - 0.005 | | 44 / 44 | WSD23000250A1050SNN2 | | | | Prime CZ-Si wafer 2 inch, thickness = 3000 ± 25 μm, (100) off orientation 6° (+/- 0.5°), 1-side polished, n-type (Arsen), 0.001 - 0.005 Ohm cm, TTV < 10 μm, Bow/Warp < 30 μm, 1 SEMI Flat | | | Wafer-Preis (netto): € 23.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (111) | einseitig | 400 ± 25 | Arsen | 0.001 - 0.005 | | 154 / 154 | WSF20400250A1050SNN1 | | | | Prime CZ-Si wafer 2 inch, thickness = 400 ± 25 μm, (111), 1-side polished, n-type Arsenic) TTV < 10 μm, 0.001 - 0.005 Ohm cm | | | Wafer-Preis (netto): € 16.90 (5 Wafer), € 12.30 (10 Wafer), € 7.50 (25 Wafer), € 6.50 (50 Wafer), € 6.20 (100 Wafer), € 6.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (111) | einseitig | 400 ± 25 | Phosphor | 10 - 20 | | 75 / 75 | WSF20400250P1424SNN1 | | | | Prime CZ-Si wafer 2 inch, thickness = 400 ± 25 μm, (111), 1-side polished, n-type (Phosphor), TTV < 10 μm, 10 - 20 Ohm cm | | | Wafer-Preis (netto): € 7.50 (25 Wafer), € 7.00 (50 Wafer), € 6.50 (100 Wafer), € 6.00 (200 Wafer), € 5.80 (500 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (111) | einseitig | 500 ± 15 | Bor | 1 - 10 | | 103 / 103 | WSF20500150B1314SNN1 | | | | Prime CZ-Si wafer 2 inch, thickness = 500 ± 15 μm, (111), 1-side polished, p-type (Boron), 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 4.90 (25 Wafer), € 4.70 (50 Wafer), € 4.60 (75 Wafer), € 4.50 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 3 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Test | CZ-Si | 2 | (100) | einseitig | 279 ± 25 | Bor | 1 - 20 | | 550 / 550 | WSM20279250B1324SNN1 | | | | Test CZ-Si wafer 2 inch, thickness = 279 ± 25 μm, (100), 1-side polished, p-type (Boron), 1 - 20 Ohm cm | | | Wafer-Preis (netto): € 6.50 (25 Wafer), € 6.00 (50 Wafer), € 5.50 (100 Wafer), € 5.20 (300 Wafer), € 5.00 (1000 Wafer), € 4.80 (2000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Test | CZ-Si | 2 | (100) | einseitig | 500 ± 15 | Bor | 1 - 20 | | 550 / 550 | WSM20500150B1324SNN1 | | | | Test CZ-Si wafer 2 inch, thickness = 500 ± 15 μm, (100), 1-side polished, p-type (Boron), TTV < 10 μm, 1 - 20 Ohm cm | | | Wafer-Preis (netto): € 7.60 (25 Wafer), € 6.80 (50 Wafer), € 6.00 (100 Wafer), € 5.50 (200 Wafer), € 5.00 (500 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Dummy3 | CZ-Si | 2 | (100) | einseitig | 500 ± 50 | Bor | 0.001 - 100 | | 1450 / 1450 | WSV20500500B1015XNN2 | | | | Dummy CZ-Si wafer 2 inch, thickness = 500 ± 50 μm, (100), 1-side polished, p-type (Boron), 0.001 - 100 Ohm cm, not particle-specified, units of 25 wafers (carriers) | | | Wafer-Preis (netto): € 5.50 (25 Wafer), € 5.20 (50 Wafer), € 4.80 (100 Wafer), € 4.30 (200 Wafer), € 3.90 (500 Wafer), € 3.60 (1000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (dry) | 2 | (100) | einseitig | 279 ± 20 | Bor | 0.001 - 0.05 | 50 nm | 275 / 275 | WTD20279200B1051S051 | | | | Prime Si + dry SiO2 wafer 2 inch, thickness = 279 ± 20 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 0.001 - 0.05 Ohm cm, 50 +/- 30 nm SiO2 | | | Wafer-Preis (netto): € 21.40 (5 Wafer), € 16.80 (10 Wafer), € 12.00 (25 Wafer), € 10.00 (50 Wafer), € 9.50 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (dry) | 2 | (100) | einseitig | 279 ± 20 | Bor | 1 - 10 | 100 nm | 13 / 213 | WTD20279200B1314S101 | | | | Prime Si + SiO2 (dry)-Wafer 2 inch, thickness = 279 ± 20 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, 100 nm SiO2 | | | Wafer-Preis (netto): € 20.40 (5 Wafer), € 15.80 (10 Wafer), € 11.00 (25 Wafer), € 10.00 (50 Wafer), € 8.00 (150 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (dry) | 2 | (100) | einseitig | 280 ± 20 | Bor | 0.001 - 0.05 | 50 nm | 139 / 139 | WTD20280200B1051S051 | | | | Prime Si + dry SiO2 wafer 2 inch, thickness = 280 ± 20 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 0.001 - 0.05 Ohm cm, 50 +/- 30 nm SiO2 | | | Wafer-Preis (netto): € 21.40 (5 Wafer), € 16.80 (10 Wafer), € 12.00 (25 Wafer), € 11.00 (50 Wafer), € 10.00 (100 Wafer), € 9.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 2 | ### | beidseitig | 200 ± 25 | | | | 51 / 51 | WUA20200250X0000SNN1 | | | | Fused silica JGS2 wafer 2 inch, thickness = 200 ± 25 μm, 2-side polished, No Flat | | | Wafer-Preis (netto): € 23.40 (5 Wafer), € 18.80 (10 Wafer), € 14.00 (25 Wafer), € 12.80 (50 Wafer), € 12.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 2 | ### | beidseitig | 380 ± 25 | | | | 175 / 175 | WUS20380250X0000XNN1 | | | | Fused silica JGS2 wafer 2 inch, thickness = 380 ± 25 μm, 2-side polished, TTV < 10 μm | | | Wafer-Preis (netto): auf Anfrage | |
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| | Fused Silica | 2 | ### | beidseitig | 500 ± 25 | | | | 250 / 250 | WUS20500250X0000SNN1 | | | | Fused silica JGS2 wafer 2 inch, thickness = 500 ± 25 μm, 2-side polished, TTV < 10 μm, 1 flat | | | Wafer-Preis (netto): € 8.80 (25 Wafer), € 8.00 (50 Wafer), € 7.50 (100 Wafer), € 7.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 2 | ### | beidseitig | 500 ± 25 | | | | 940 / 940 | WUS20500250X0000SNN2 | | | | Fused silica JGS1 wafer 2 inch, thickness = 500 ± 25 μm, 2-side polished, TTV < 10 μm, 1 SEMI Flat, !! Units of 10 wafers per cassette | | | Wafer-Preis (netto): € 16.00 (10 Wafer), € 14.00 (20 Wafer), € 12.00 (50 Wafer), € 11.00 (100 Wafer), € 10.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 2 | ### | beidseitig | 500 ± 25 | | | | 559 / 559 | WUS20500250X0000XNN1 | | | | Fused silica JGS2 wafer 2 inch, thickness = 500 ± 25 μm, 2-side polished, no flat | | | Wafer-Preis (netto): € 18.20 (5 Wafer), € 13.60 (10 Wafer), € 8.80 (25 Wafer), € 7.80 (50 Wafer), € 7.00 (100 Wafer), € 6.20 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 2 | ### | beidseitig | 500 ± 25 | | | | 1593 / 1593 | WUS20500250XXXXXSNN1 | | | | Fused silica JGS1 wafer 2 inch, thickness = 500 ± 25 μm, 2-side polished, TTV < 10 μm, 1 SEMI Flat | | | Wafer-Preis (netto): € 23.40 (5 Wafer), € 18.80 (10 Wafer), € 14.00 (25 Wafer), € 12.00 (50 Wafer), € 11.00 (100 Wafer), € 10.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 2 | ### | beidseitig | 700 ± 25 | | | | 900 / 900 | WUS20700250X0000XNN1 | | | | Fused silica JGS2 wafer 2 inch, thickness = 700 ± 25 μm, 2-side polished, TTV < 10 μm, top side Ra < 1 nm, S/D < 40/20, C shape CNC edge grounding, NO FLAT | | | Wafer-Preis (netto): € 8.00 (25 Wafer), € 7.50 (50 Wafer), € 7.10 (100 Wafer), € 6.80 (200 Wafer), € 6.60 (300 Wafer), € 6.20 (400 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 2 | ### | beidseitig | 1000 ± 25 | | | | 150 / 150 | WUS21000250X0000XNN1 | | | | Fused silica JGS2 wafer 2 inch, thickness = 1000 ± 25 μm, 2-side polished, TTV < 10 μm, no flat | | | Wafer-Preis (netto): € 8.00 (25 Wafer), € 7.50 (50 Wafer), € 7.10 (100 Wafer), € 6.80 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 2 | ### | beidseitig | 3600 ± 50 | | | | 4 / 4 | WUS23600500X0000XNN1 | | | | Fused silica JGS2 wafer 2 inch, thickness = 3600 ± 50 μm, 2-side polished, no flat, film packing, units of 5 wafers per bag | | | Wafer-Preis (netto): € 22.00 (5 Wafer), € 20.00 (10 Wafer), € 18.00 (20 Wafer), € 16.00 (50 Wafer), € 15.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 2 | (100) | einseitig | 279 ± 20 | Bor | 1 - 10 | 300 nm | 214 / 214 | WWD20279200B1314S301 | | | | Prime Si + dry/wet/dry SiO2 wafer 2 inch, thickness = 279 ± 20 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, 300 nm SiO2 | | | Wafer-Preis (netto): € 20.40 (5 Wafer), € 15.80 (10 Wafer), € 11.00 (25 Wafer), € 10.00 (50 Wafer), € 9.00 (100 Wafer), € 8.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 2 | (100) | einseitig | 279 ± 25 | Bor | 1 - 10 | 500 nm | 295 / 295 | WWD20279250B1314S501 | | | | Prime Si + wet SiO2 wafer 2 inch, thickness = 279 ± 25 μm, (100), 1-side polished, p-type (Boron), TTV < 10 μm, 1 - 10 Ohm cm, 500 nm dry/wet/dry thermally grown SiO2 | | | Wafer-Preis (netto): € 21.40 (5 Wafer), € 16.80 (10 Wafer), € 12.00 (25 Wafer), € 11.00 (50 Wafer), € 10.50 (100 Wafer), € 10.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 2 | (100) | einseitig | 279 ± 25 | | 1000 - 100000 | 250 nm | 93 / 93 | WWD20279250X1618S251 | | | | Prime Si + dry/wet/dry SiO2 wafer 2 inch, thickness = 279 ± 25 μm, (100), 1-side polished, TTV < 10 μm, undoped, 1000 - 100000 Ohm cm, 250 nm SiO2, 2 Flats | | | Wafer-Preis (netto): € 18.00 (25 Wafer), € 16.00 (50 Wafer), € 15.00 (100 Wafer), € 14.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 18 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Prime | CZ-Si | 2 | (100) | unpoliert | 270 ± 20 | Bor | 0 - 0.05 | | 0 / 1(5) | WSG20270200B0051SNN# | | | | Prime CZ-Si wafer 2 inch, thickness = 270 ± 20 μm, (100), unpolished, p-type (Boron) TTV < 10 μm, 0 - 0.05 Ohm cm, Flats: 1 | | | Wafer-Preis (netto): € 20.00 (5 Wafer), € 14.60 (10 Wafer), € 9.80 (25 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (100) | einseitig | 1000 ± 25 | Bor | 1 - 10 | | 0 / 18(5) | WSD21000250B1314SNN# | | | | Prime CZ-Si wafer 2 inch, thickness = 1000 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, Flats: 1 | | | Wafer-Preis (netto): € 18.60 (5 Wafer), € 13.20 (10 Wafer), € 8.40 (25 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (111) | einseitig | 500 ± 15 | Bor | 1 - 10 | | 0 / 100(5) | WSF20500150B1314SNN# | | | | Prime CZ-Si wafer 2 inch, thickness = 500 ± 15 μm, (111), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, Flats: 1 | | | Wafer-Preis (netto): € 15.10 (5 Wafer), € 9.70 (10 Wafer), € 4.90 (25 Wafer), € 4.70 (50 Wafer), € 4.60 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 2 | (100) | einseitig | 500 ± 15 | Bor | 1 - 10 | | 0 / 25(5) | WSD20500150B1314SNN# | | | | Prime CZ-Si wafer 2 inch, thickness = 500 ± 15 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 15.80 (5 Wafer), € 10.40 (10 Wafer), € 5.60 (25 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 2 | (100) | einseitig | 300 ± 25 | Phosphor | 5000 - 1000000 | | 0 / 100(5) | WFD20300255P5619SNN# | | | | Prime FZ-Si wafer 2 inch, thickness = 300 ± 25 μm, (100), 1-side polished, n-type (Phosphor) TTV < 5 μm, 5000 - 1000000 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 24.20 (5 Wafer), € 18.80 (10 Wafer), € 14.00 (25 Wafer), € 13.50 (50 Wafer), € 13.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 2 | (111) | einseitig | 400 ± 15 | | 5000 - 1000000 | | 0 / 100(5) | WFF20400150X5619SNN# | | | | Prime FZ-Si wafer 2 inch, thickness = 400 ± 15 μm, (111), 1-side polished, TTV < 10 μm, 5000 - 1000000 Ohm cm, Flats: 1 | | | Wafer-Preis (netto): € 24.20 (5 Wafer), € 18.80 (10 Wafer), € 14.00 (25 Wafer), € 13.50 (50 Wafer), € 13.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
Sie wünschen eine Preisauskunft oder ein Angebot? Senden Sie uns eine Nachricht an info@microchemicals.com mit den gewünschten Artikelnummern (die 20-stellige zeichenfolge rechts in der Tabelle) und Stückzahlen, wir melden uns umgehend bei Ihnen!
3 Zoll Silizium, Quarz, Quarzglas, Fused Silica und Glas Wafer
| Qual. | Material | Größe (Zoll) | Orien- tierung | Poliert | Dicke (μm) | Dotierung | Widerstand (ohm cm) | Beschichtung | # verfügbar aktuell1/in Bälde2 | Artikel-Nummer (zum WebShop) | |
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| Prime | FZ-Si | 3 | (100) | beidseitig | 320 ± 10 | | 10000 - 100000 | | 189 / 189 | WFA30320100X1718SNN1 | | | | Prime FZ-Si wafer 3 inch, thickness = 320 ± 10 μm, (100), 2-side polished, TTV < 10 μm, undoped, 10000 - 100000 Ohm cm | | | Wafer-Preis (netto): € 54.00 (5 Wafer), € 49.00 (10 Wafer), € 44.00 (25 Wafer), € 41.00 (50 Wafer), € 38.00 (100 Wafer), € 36.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 3 | (100) | einseitig | 380 ± 10 | | 10000 - 1000000 | | 259 / 259 | WFD30380105X1719SNN2 | | | | Prime FZ-Si wafer 3 inch, thickness = 380 ± 10 μm, (100), 1-side polished, TTV < 5 μm, 10000 - 1000000 Ohm cm, Flats: 2, [InvP]
| | | Wafer-Preis (netto): € 46.00 (5 Wafer), € 40.00 (10 Wafer), € 34.00 (25 Wafer), € 32.00 (50 Wafer), € 30.00 (100 Wafer), € 29.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Borosilicate | 3 | ### | beidseitig | 500 ± 25 | | | | 399 / 399 | WGS3050025XX0000SNN1 | | | | Borosilicate glass 3 inch glass wafer, thickness = 500 ± 25 μm, 2-side polished, primary flat 22 mm | | | Wafer-Preis (netto): € 20.80 (5 Wafer), € 16.00 (10 Wafer), € 11.00 (25 Wafer), € 10.80 (100 Wafer), € 10.50 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Borosilicate | 3 | ### | einseitig | 150 ± 25 | | | | 350 / 350 | WGV30150250X0000SNN1 | | | | Borosilicate 3 inch, thickness = 150 ± 25 μm, 1-side polished, primary flat 22 mm - only box with 50 pieces (cake Box) ! | | | Wafer-Preis (netto): € 14.50 (50 Wafer), € 13.50 (100 Wafer), € 12.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 3 | (100) | beidseitig | 381 ± 25 | Bor | 1 - 10 | 50 nm | 22 / 22 | WNA30381250B1314S051 | | | | Prime Si + Si3N4 wafer 3 inch, thickness = 381 ± 25 μm, (100), 2-side polished, p-type (Boron), 1 - 10 Ohm cm, 50 nm LPCVD Si3N4 on both sides | | | Wafer-Preis (netto): € 38.80 (5 Wafer), € 34.00 (10 Wafer), € 29.00 (25 Wafer), € 27.50 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 3 | (100) | beidseitig | 381 ± 25 | Bor | 1 - 10 | 150 nm | 18 / 18 | WNA30381250B1314S151 | | | | Prime Si + Si3N4 wafer 3 inch, thickness = 381 ± 25 μm, (100), 2-side polished, p-type (Boron), 1 - 10 Ohm cm, 150 nm LPCVD Si3N4 on both sides | | | Wafer-Preis (netto): € 44.00 (5 Wafer), € 39.00 (10 Wafer), € 34.00 (25 Wafer), € 33.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 3 | (100) | beidseitig | 381 ± 25 | Bor | 1 - 10 | 500 nm | 24 / 24 | WNA30381250B1314S501 | | | | Prime Si + Si3N4 wafer 3 inch, thickness = 381 ± 25 μm, (100), 2-side polished, p-type (Boron), 1 - 10 Ohm cm, 500 nm PECVD Si3N4 on one side | | | Wafer-Preis (netto): € 57.80 (5 Wafer), € 53.00 (10 Wafer), € 48.00 (25 Wafer), € 45.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 3 | (100) | beidseitig | 381 ± 25 | Bor | 1 - 10 | 500 nm | 15 / 15 | WNA30381250B1314S502 | | | | Prime Si + Si3N4 (low-stress) wafer 3 inch, thickness = 381 ± 25 μm, (100), 2-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, 500 nm low-stress Si3N4 | | | Wafer-Preis (netto): € 57.80 (5 Wafer), € 53.00 (10 Wafer), € 48.00 (25 Wafer), € 47.00 (50 Wafer), € 46.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 3 | (100) | beidseitig | 381 ± 25 | Bor | 1 - 10 | 1000 nm | 19 / 19 | WNA30381250B1314SXX2 | | | | Prime Si + Si3N4 (low-stress) wafer 3 inch, thickness = 381 ± 25 μm, (100), 2-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, 1000 nm low-stress Si3N4 | | | Wafer-Preis (netto): € 73.80 (5 Wafer), € 69.00 (10 Wafer), € 64.00 (25 Wafer), € 62.50 (50 Wafer), € 61.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Quartz | 3 | Y-Cut | beidseitig | 500 ± 25 | | | | 10 / 10 | WQB30500250XXXXXSNN1 | | | | Quartz wafer 3 inch, thickness = 500 ± 25 μm, Y-Cut, 2-side polished, TTV < 10 μm, SAW grade, Quality factor Q > 2.4M, Etch channel density ECD < 30, inclusion concentration (ID): I grade
| | | Wafer-Preis (netto): € 62.00 (5 Wafer), € 56.00 (10 Wafer), € 48.00 (25 Wafer), € 44.00 (50 Wafer), € 41.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Quartz | 3 | Z-Cut | beidseitig | 200 ± 25 | | | | 63 / 63 | WQC30200250X0000SNN1 | | | | Quartz wafer 3 inch, thickness = 200 ± 25 μm, Z-Cut, 2-side polished, TTV < 10 μm, 1 SEMI Flat | | | Wafer-Preis (netto): € 38.80 (5 Wafer), € 34.00 (10 Wafer), € 29.00 (25 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Quartz | 3 | Z-Cut | beidseitig | 1000 ± 25 | | | | 39 / 39 | WQC31000250X0000SNN1 | | | | Quartz wafer 3 inch, thickness = 1000 ± 25 μm, Z-Cut, 2-side polished, TTV < 10 μm, 1 SEMI Flat | | | Wafer-Preis (netto): € 45.80 (5 Wafer), € 41.00 (10 Wafer), € 36.00 (25 Wafer), € 35.00 (50 Wafer), € 33.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Quartz | 3 | Z-Cut | beidseitig | 1000 ± 25 | | | | 32 / 32 | WQC31000251X0000XNN1 | | | | Quartz wafer 3 inch, thickness = 1000 ± 25 μm, Z-Cut, 2-side polished, TTV < 1 μm, Ra<0.5 nm, no flat | | | Wafer-Preis (netto): € 70.00 (5 Wafer), € 62.00 (10 Wafer), € 52.00 (25 Wafer), € 48.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Quartz | 3 | Z-Cut | beidseitig | 1000 ± 25 | | | | 35 / 35 | WQC31000252X0000XNN1 | | | | Quartz wafer 3 inch, thickness = 1000 ± 25 μm, Z-Cut, 2-side polished, TTV < 2 μm, Ra<0.5 nm, no flat | | | Wafer-Preis (netto): € 70.00 (5 Wafer), € 62.00 (10 Wafer), € 52.00 (25 Wafer), € 48.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (100) | beidseitig | 200 ± 25 | Bor | 1 - 10 | | 208 / 208 | WSA30200250B1314SNN1 | | | | Prime CZ-Si wafer 3 inch, thickness = 200 ± 25 μm, (100), 2-side polished, p-type (Boron), TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 22.80 (5 Wafer), € 17.00 (10 Wafer), € 12.00 (25 Wafer), € 10.50 (50 Wafer), € 9.80 (100 Wafer), € 9.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (100) | beidseitig | 360 ± 25 | Bor | 0.001 - 0.005 | | 186 / 186 | WSA30360250B1050SNN1 | | | | Prime CZ-Si wafer 3 inch, thickness = 360 ± 25 μm, (100), 2-side polished, p-type (Boron), TTV < 10 μm, 0.001 - 0.005 Ohm cm | | | Wafer-Preis (netto): € 24.00 (5 Wafer), € 18.00 (10 Wafer), € 12.00 (25 Wafer), € 11.00 (50 Wafer), € 10.00 (100 Wafer), € 9.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (100) | beidseitig | 380 ± 25 | Bor | 10 - 20 | | 16 / 16 | WSA30380250B1424SNN1 | | | | Prime CZ-Si wafer 3 inch, thickness = 380 ± 25 μm, (100), 2-side polished, p-type (Boron), TTV < 10 μm, 10 - 20 Ohm cm | | | Wafer-Preis (netto): € 24.00 (5 Wafer), € 18.00 (10 Wafer), € 12.00 (25 Wafer), € 11.00 (50 Wafer), € 10.00 (100 Wafer), € 9.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (100) | beidseitig | 381 ± 25 | Bor | 1 - 10 | | 1265 / 1265 | WSA30381250B1314SNN1 | | | | Prime CZ-Si wafer 3 inch, thickness = 381 ± 25 μm, (100), 2-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 21.80 (5 Wafer), € 17.00 (10 Wafer), € 12.00 (25 Wafer), € 11.50 (50 Wafer), € 11.00 (100 Wafer), € 10.50 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (100) | beidseitig | 381 ± 25 | Phosphor | 1 - 10 | | 90 / 90 | WSA30381250P1314SNN1 | | | | Prime CZ-Si wafer 3 inch, thickness = 381 ± 25 μm, (100), 2-side polished, n-type (Phosphor), TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 22.00 (5 Wafer), € 17.00 (10 Wafer), € 12.00 (25 Wafer), € 11.50 (50 Wafer), € 11.00 (100 Wafer), € 10.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (100) | beidseitig | 775 ± 25 | Bor | 10 - 20 | | 125 / 125 | WSA30775250B1424SNN1 | | | | Prime CZ-Si wafer 3 inch, thickness = 775 ± 25 μm, (100), 2-side polished, p-type (Boron), TTV < 10 μm, 10 - 20 Ohm cm | | | Wafer-Preis (netto): € 29.00 (5 Wafer), € 23.00 (10 Wafer), € 17.00 (25 Wafer), € 16.00 (50 Wafer), € 15.00 (100 Wafer), € 14.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (100) | einseitig | 380 ± 25 | Arsen | 0.001 - 0.01 | | 40 / 40 | WSD30380250A1011SNN1 | | | | Prime CZ-Si wafer 3 inch, thickness = 380 ± 25 μm, (100), 1-side polished, n-type (Arsen), TTV < 10 μm, 0.001 - 0.01 Ohm cm | | | Wafer-Preis (netto): € 14.00 (25 Wafer), € 12.00 (50 Wafer), € 11.00 (100 Wafer), € 10.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 15 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Prime | CZ-Si | 3 | (100) | einseitig | 380 ± 25 | Bor | 1 - 50 | | 1800 / 1800 | WSD30380250B1354SNN1 | | | | Prime CZ-Si wafer 3 inch, thickness = 380 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 20 μm, 1 - 50 Ohm cm, in units of 25 wafers (cassette package) | | | Wafer-Preis (netto): € 9.00 (25 Wafer), € 8.50 (50 Wafer), € 8.00 (100 Wafer), € 7.60 (200 Wafer), € 7.20 (500 Wafer), € 6.80 (1000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (100) | einseitig | 381 ± 20 | Bor | 1 - 10 | | 1835 / 1835 | WSD30381200B1314SNN1 | | | | Prime CZ-Si wafer 3 inch, thickness = 381 ± 20 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm
| | | Wafer-Preis (netto): € 19.80 (5 Wafer), € 15.00 (10 Wafer), € 10.00 (25 Wafer), € 9.60 (50 Wafer), € 9.20 (100 Wafer), € 8.50 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (100) | einseitig | 381 ± 25 | Phosphor | 1 - 10 | | 199 / 199 | WSD30381250P1314SNN1 | | | | Prime CZ-Si wafer 3 inch, thickness = 381 ± 25 μm, (100), 1-side polished, n-type (Phosphor), TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 19.80 (5 Wafer), € 15.00 (10 Wafer), € 10.00 (25 Wafer), € 9.60 (50 Wafer), € 9.20 (100 Wafer), € 8.80 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (100) | einseitig | 450 ± 10 | Bor | 1 - 20 | | 5 / 5 | WSD30450100B1324SNN1 | | | | Prime CZ-Si wafer 3 inch (76,2 mm +/- 0.3 mm), thickness = 450 ± 10 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 20 Ohm cm, Bow/Warp < 30 μm, Ra< 1 nm, 1 Flat [mm] 22 ± 1 mm, Edge Rounding 0.25 mmR | | | Wafer-Preis (netto): € 19.40 (5 Wafer), € 14.60 (10 Wafer), € 9.60 (25 Wafer), € 8.80 (50 Wafer), € 8.00 (100 Wafer), € 7.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (100) | einseitig | 640 ± 25 | Phosphor | 1 - 10 | | 1061 / 1061 | WSD30640250P1314SNN1 | | | | Prime CZ-Si wafer 3 inch, thickness = 640 ± 25 μm, (100), 1-side polished, n-type (Phosphor) TTV < 10 μm, 1 - 10 Ohm cm, 2 flats, surface roughness < 1 nm | | | Wafer-Preis (netto): € 23.80 (5 Wafer), € 19.00 (10 Wafer), € 14.00 (25 Wafer), € 13.00 (50 Wafer), € 12.00 (100 Wafer), € 11.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (111) | einseitig | 380 ± 25 | Phosphor | 1 - 10 | | 103 / 103 | WSF30380250P1314SNN1 | | | | Prime CZ-Si wafer 3 inch, thickness = 380 ± 25 μm, (111), 1-side polished, n-type (Phosphor) TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 19.80 (5 Wafer), € 15.00 (10 Wafer), € 10.00 (25 Wafer), € 9.20 (100 Wafer), € 8.50 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Test | CZ-Si | 3 | (100) | einseitig | 381 ± 25 | Bor | 1 - 20 | | 394 / 444 | WSM30381250B1324SNN1 | | | | Test CZ-Si wafer 3 inch, thickness = 381 ± 25 μm, (100), 1-side polished, p-type (Boron), 1 - 20 Ohm cm | | | Wafer-Preis (netto): € 9.00 (25 Wafer), € 8.50 (50 Wafer), € 8.00 (100 Wafer), € 7.20 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 19 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Dummy3 | CZ-Si | 3 | (100) | einseitig | 380 ± 25 | Bor | 0.001 - 100 | | 400 / 400 | WSV30380250B1015SNN1 | | | | Dummy CZ-Si wafer 3 inch, thickness = 380 ± 25 μm, (100), 1-side polished, p-type (Boron), 0.001 - 100 Ohm cm, not particle specified, tiny scratches possible, units of 25 wafers in standard boxes with carriers | | | Wafer-Preis (netto): € 7.00 (25 Wafer), € 6.20 (50 Wafer), € 6.00 (100 Wafer), € 5.50 (200 Wafer), € 5.00 (500 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Dummy3 | CZ-Si | 3 | (100) | einseitig | 380 ± 25 | Bor | 0.001 - 100 | | 700 / 700 | WSV30380250B1015SNN2 | | | | Dummy CZ-Si wafer 3 inch, thickness = 380 ± 25 μm, (100), 1-side polished, p-type (Boron), 0.001 - 100 Ohm cm, not particle specified, tiny scratches possible, units of 100 wafers stacked in cakeboxes | | | Wafer-Preis (netto): € 5.00 (100 Wafer), € 4.50 (200 Wafer), € 4.00 (500 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Dummy3 | CZ-Si | 3 | (111) | einseitig | 420 ± 25 | Bor | 0.001 - 1 | | 1500 / 1500 | WSY30420250B1013XNN1 | | | | Dummy CZ-Si wafer 3 inch, thickness = 420 ± 25 μm, (111), 1-side polished, p-type (Boron), 0.001 - 1 Ohm cm, units of 125 wafers in cakeboxes, not particle-specified, tiny scratches possible | | | Wafer-Preis (netto): € 4.80 (125 Wafer), € 4.20 (250 Wafer), € 3.90 (500 Wafer), € 3.60 (1000 Wafer), € 3.50 (2000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (dry) | 3 | (100) | beidseitig | 200 ± 25 | | 10000 - 100000 | 300 nm | 124 / 124 | WTA30200250X1718S301 | | | | Prime FZ-Si + dry SiO2 wafer 3 inch, thickness = 200 ± 25 μm, (100), 2-side polished, TTV < 10 μm, 10000 - 100000 Ohm cm, (> 10.000), 300 nm SiO2, 2 SEMI flats | | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | Si + SiO2 (dry) | 3 | (100) | einseitig | 200 ± 25 | Bor | 1 - 10 | 300 nm | 58 / 58 | WTD30200250B1314S301 | | | | Prime Si + dry SiO2 wafer 3 inch, thickness = 200 ± 25 μm, (100), 1-side polished, p-type (Boron), 1 - 10 Ohm cm, 300 nm SiO2, 2 SEMI flats | | | Wafer-Preis (netto): € 25.80 (5 Wafer), € 21.00 (10 Wafer), € 16.00 (25 Wafer), € 15.00 (50 Wafer), € 14.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (dry) | 3 | (100) | einseitig | 380 ± 10 | | 5000 - 50000 | 200 nm | 107 / 107 | WTD30380100X5617S201 | | | | Prime Si + dry SiO2 wafer 3 inch, thickness = 380 ± 10 μm, (100), 1-side polished, intrinsic (undoped), 5000 - 50000 Ohm cm, 200 nm thermal dry SiO2 | | | Wafer-Preis (netto): € 49.80 (5 Wafer), € 45.00 (10 Wafer), € 39.50 (25 Wafer), € 36.00 (50 Wafer), € 34.00 (100 Wafer), € 32.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (dry) | 3 | (100) | einseitig | 380 ± 25 | Bor | 1 - 10 | 100 nm | 70 / 270 | WTD30380250B1314S101 | | | | Prime Si + dry SiO2 wafer 3 inch, thickness = 380 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, 100 nm SiO2, 1 Flat | | | Wafer-Preis (netto): € 24.80 (5 Wafer), € 20.00 (10 Wafer), € 15.00 (25 Wafer), € 14.00 (50 Wafer), € 13.50 (100 Wafer), € 13.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 3 | ### | beidseitig | 320 ± 10 | | | | 26 / 26 | WUA30320100X0000SNN1 | | | | Fused silica JGS2 wafer 3 inch, thickness = 320 ± 10 μm, 2-side polished, TTV < 10 μm | | | Wafer-Preis (netto): € 22.00 (5 Wafer), € 17.00 (10 Wafer), € 12.00 (25 Wafer), € 11.00 (50 Wafer), € 10.00 (100 Wafer), € 9.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 3 | ### | beidseitig | 380 ± 20 | | | | 99 / 99 | WUA30380200X0000SNN1 | | | | Fused silica JGS2 wafer 3 inch, thickness = 380 ± 20 μm, 2-side polished, TTV < 10 μm | | | Wafer-Preis (netto): € 22.00 (5 Wafer), € 17.00 (10 Wafer), € 12.00 (25 Wafer), € 11.00 (50 Wafer), € 10.00 (100 Wafer), € 9.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 3 | ### | beidseitig | 500 ± 25 | | | | 203 / 203 | WUS30500250X0000SNN2 | | | | Fused silica JGS2 wafer 3 inch, thickness = 500 ± 25 μm, 2-side polished, TTV < 10 μm, roughness Ra < 1 nm, 1 Flat (22.5+/-2.5mm) | | | Wafer-Preis (netto): € 24.80 (5 Wafer), € 20.00 (10 Wafer), € 15.00 (25 Wafer), € 14.00 (50 Wafer), € 13.00 (100 Wafer), € 12.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 3 | ### | beidseitig | 500 ± 25 | | | | 25 / 25 | WUS30500250X0000SNN4 | | | | Dummy Fused silica JGS2 wafer 3 inch, thickness = 500 ± 25 μm, 2-side polished, TTV < 10 μm, roughness Ra < 1 nm, not particle specified (box already opened) | | | Wafer-Preis (netto): auf Anfrage | |
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| | Fused Silica | 3 | ### | beidseitig | 1000 | | | | 8 / 8 | WUS31000000X0000SNN1 | | | | Corning 7980 glass wafer circular (diameter 75 mm +0/-0,1 mm), thickness = 1 mm +0/-0,1 mm, 2-side P3 polished, 1 SEMI Flat | | | Wafer-Preis (netto): € 32.00 (25 Wafer), € 29.00 (50 Wafer), € 28.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 8 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| | Fused Silica | 3 | ### | beidseitig | 1000 ± 25 | | | | 100 / 100 | WUS31000250X0000SNN1 | | | | Fused silica JGS2 wafer 3 inch, thickness = 1000 ± 25 μm, 2-side polished, TTV < 10 μm, roughness 1 nm, 1 SEMI Flat | | | Wafer-Preis (netto): € 26.80 (5 Wafer), € 22.00 (10 Wafer), € 17.00 (25 Wafer), € 16.00 (50 Wafer), € 15.00 (100 Wafer), € 14.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 3 | (100) | einseitig | 380 ± 25 | Bor | 1 - 10 | 90 nm | 25 / 25 | WWD30380250B1314S092 | | | | Dummy Si + SiO2 wafer 3 inch, thickness = 380 ± 25 μm, (100), 1-side polished, p-type (Boron), TTV < 10 μm, 1 - 10 Ohm cm, 90 nm SiO2, 1 SEMI flat, not particle-specified | | | Wafer-Preis (netto): € 10.00 (25 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 3 | (100) | einseitig | 380 ± 25 | Bor | 1 - 10 | 300 nm | 164 / 164 | WWD30380250B1314S301 | | | | Prime Si + wet SiO2 wafer 3 inch, thickness = 380 ± 25 μm, (100), 1-side polished, p-type (Boron), 1 - 10 Ohm cm, 300 nm SiO2 | | | Wafer-Preis (netto): € 24.80 (5 Wafer), € 20.00 (10 Wafer), € 15.00 (25 Wafer), € 13.60 (50 Wafer), € 13.20 (100 Wafer), € 12.80 (250 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 3 | (100) | einseitig | 380 ± 25 | Bor | 1 - 10 | 1000 nm | 195 / 195 | WWD30380250B1314SXX1 | | | | Prime Si + dry/wet/dry SiO2 wafer 3 inch, thickness = 380 ± 25 μm, (100), 1-side polished, p-type (Boron), TTV < 10 μm, 1 - 10 Ohm cm, 1000 nm SiO2, 1 SEMI flat | | | Wafer-Preis (netto): € 27.30 (5 Wafer), € 22.50 (10 Wafer), € 17.50 (25 Wafer), € 16.50 (50 Wafer), € 16.00 (100 Wafer), € 15.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 3 | (100) | einseitig | 381 ± 25 | Bor | 1 - 10 | 3000 nm | 25 / 25 | WWD30381250B1314SXX1 | | | | Prime Si + wet SiO2 wafer 3 inch, thickness = 381 ± 25 μm, (100), 1-side polished, p-type (Boron), TTV < 10 μm, 1 - 10 Ohm cm, 3000 nm SiO2 | | | Wafer-Preis (netto): € 41.80 (5 Wafer), € 37.00 (10 Wafer), € 32.00 (25 Wafer), € 28.00 (50 Wafer), € 26.00 (100 Wafer), € 25.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (111) | einseitig | 380 ± 15 | Bor | 0.001 - 0.005 | | 0 / 15(5) | WSF30380150B1050SNN# | | | | Prime CZ-Si wafer 3 inch, thickness = 380 ± 15 μm, (111), 1-side polished, p-type (Boron) TTV < 10 μm, 0.001 - 0.005 Ohm cm, Flats: 1 | | | Wafer-Preis (netto): € 19.00 (5 Wafer), € 13.20 (10 Wafer), € 8.40 (25 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (100) | beidseitig | 450 ± 20 | Phosphor | 20 - 50 | | 0 / 100(5) | WSA30450200P2454SNN# | | | | Prime CZ-Si wafer 3 inch, thickness = 450 ± 20 μm, (100), 2-side polished, n-type (Phosphor) TTV < 10 μm, 20 - 50 Ohm cm, Flats: 0 | | | Wafer-Preis (netto): € 20.40 (5 Wafer), € 14.60 (10 Wafer), € 9.80 (25 Wafer), € 9.40 (50 Wafer), € 9.10 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (100) | einseitig | 380 ± 15 | | 0.001 - 0.005 | | 0 / 191(5) | WSD30380150X1050SNN# | | | | Prime CZ-Si wafer 3 inch, thickness = 380 ± 15 μm, (100), 1-side polished, TTV < 10 μm, 0.001 - 0.005 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 19.00 (5 Wafer), € 13.20 (10 Wafer), € 8.40 (25 Wafer), € 8.10 (50 Wafer), € 7.80 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (100) | einseitig | 430 ± 25 | Phosphor | 20 - 50 | | 0 / 11(5) | WSD30430250P2454SNN# | | | | Prime CZ-Si wafer 3 inch, thickness = 430 ± 25 μm, (100), 1-side polished, n-type (Phosphor) TTV < 10 μm, 20 - 50 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 19.00 (5 Wafer), € 13.20 (10 Wafer), € 8.40 (25 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (111) | unpoliert | 240 ± 10 | Phosphor | 15 - 20 | | 0 / 20(5) | WSI30240100P1424SNN# | | | | Prime CZ-Si wafer 3 inch, thickness = 240 ± 10 μm, (111), unpolished, n-type (Phosphor) TTV < 10 μm, 15 - 20 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 14.80 (5 Wafer), € 9.00 (10 Wafer), € 4.20 (25 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 3 | (111) | beidseitig | 105 | | 0 - 100 | | 0 / 5(5) | WSC30105000X0015SNN# | | | | Prime CZ-Si wafer 3 inch, thickness = 105 ± 0 μm, (111), 2-side polished, TTV < 10 μm, 0 - 100 Ohm cm, Flats: 0 | | | Wafer-Preis (netto): € 31.60 (5 Wafer), € 25.80 (10 Wafer), € 21.00 (25 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 3 | (111) | beidseitig | 380 ± 10 | | 10000 - 1000000 | | 0 / 181(5) | WFC30380105X1719SNN# | | | | Prime FZ-Si wafer 3 inch, thickness = 380 ± 10 μm, (111), 2-side polished, TTV < 5 μm, 10000 - 1000000 Ohm cm, Flats: 1 | | | Wafer-Preis (netto): € 45.60 (5 Wafer), € 39.80 (10 Wafer), € 35.00 (25 Wafer), € 33.80 (50 Wafer), € 32.50 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 3 | (100) | einseitig | 380 ± 10 | | 10000 - 1000000 | | 0 / 91(5) | WFD30380105X1719SNN# | | | | Prime FZ-Si wafer 3 inch, thickness = 380 ± 10 μm, (100), 1-side polished, TTV < 5 μm, 10000 - 1000000 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 45.60 (5 Wafer), € 39.80 (10 Wafer), € 35.00 (25 Wafer), € 33.80 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
Sie wünschen eine Preisauskunft oder ein Angebot? Senden Sie uns eine Nachricht an info@microchemicals.com mit den gewünschten Artikelnummern (die 20-stellige zeichenfolge rechts in der Tabelle) und Stückzahlen, wir melden uns umgehend bei Ihnen!
4 Zoll Silizium, Quarz, Quarzglas, Fused Silica und Glas Wafer
| Qual. | Material | Größe (Zoll) | Orien- tierung | Poliert | Dicke (μm) | Dotierung | Widerstand (ohm cm) | Beschichtung | # verfügbar aktuell1/in Bälde2 | Artikel-Nummer (zum WebShop) | |
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| Prime | FZ-Si | 4 | (100) | beidseitig | 200 ± 10 | | 10000 - 1000000 | | 483 / 483 | WFA40200105X1719XNN1 | | | | Prime FZ-Si wafer 4 inch, thickness = 200 ± 10 μm, (100), 2-side polished, TTV < 5 μm, 10000 - 1000000 Ohm cm | | | Wafer-Preis (netto): € 57.20 (5 Wafer), € 51.60 (10 Wafer), € 46.00 (25 Wafer), € 44.00 (50 Wafer), € 43.00 (100 Wafer), € 42.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 4 | (100) | beidseitig | 280 ± 10 | Bor | 2000 - 8000 | | 250 / 250 | WFA40280100B2686SNN1 | | | | Prime FZ-Si wafer 4 inch, thickness = 280 ± 10 μm, (100), 2-side polished, p-type (Boron) TTV < 10 μm, 2000 - 8000 Ohm cm, 1 SEMI flat | | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | FZ-Si | 4 | (100) | beidseitig | 290 ± 10 | Bor | 2000 - 8000 | | 2 / 2 | WFA40290100B2686SNN1 | | | | Prime FZ-Si wafer 4 inch, thickness = 290 ± 10 μm, (100), 2-side polished, p-type (Boron) TTV < 10 μm, 2000 - 8000 Ohm cm, 2 flats | | | Wafer-Preis (netto): € 55.20 (5 Wafer), € 49.60 (10 Wafer), € 44.00 (25 Wafer), € 42.00 (50 Wafer), € 41.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 4 | (100) | beidseitig | 400 ± 10 | Phosphor | 3000 - 1000000 | | 87 / 87 | WFA40400105P3619SNN1 | | | | Prime FZ-Si wafer 4 inch, thickness = 400 ± 10 μm, (100), 2-side polished, n-type (Phosphor) TTV < 5 μm, 3000 - 1000000 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 50.00 (5 Wafer), € 44.00 (10 Wafer), € 38.00 (25 Wafer), € 36.00 (50 Wafer), € 34.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 4 | (100) | beidseitig | 500 ± 15 | Bor | 3000 - 100000 | | 55 / 55 | WFA40500150B3618SNN1 | | | | Prime FZ-Si wafer 4 inch, thickness = 500 ± 15 μm, (100), 2-side polished, p-type (Boron) TTV < 10 μm, 3000 - 100000 Ohm cm | | | Wafer-Preis (netto): € 57.20 (5 Wafer), € 51.60 (10 Wafer), € 46.00 (25 Wafer), € 44.00 (50 Wafer), € 42.50 (100 Wafer), € 41.20 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 4 | (100) | beidseitig | 525 ± 10 | | 10000 - 100000 | | 297 / 297 | WFA40525105X1718XNN1 | | | | Prime FZ-Si wafer 4 inch, thickness = 525 ± 10 μm, (100), 2-side polished, TTV < 5 μm, undoped/intrinsic, 10000 - 100000 Ohm cm, 1 SEMI Flat | | | Wafer-Preis (netto): € 56.00 (5 Wafer), € 50.00 (10 Wafer), € 44.00 (25 Wafer), € 42.00 (50 Wafer), € 41.00 (100 Wafer), € 40.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 4 | (111) | beidseitig | 300 ± 25 | | 10000 - 100000 | | 52 / 52 | WFC40300250X1718SNN1 | | | | Prime FZ-Si wafer 4 inch, thickness = 300 ± 25 μm, (111) +/- 0.5°, 2-side polished, TTV < 10 μm, 10000 - 100000 Ohm cm (intrinsic), Bow/Warp < 30 μm | | | Wafer-Preis (netto): € 59.20 (5 Wafer), € 53.60 (10 Wafer), € 50.00 (25 Wafer), € 49.00 (50 Wafer), € 48.00 (100 Wafer), € 42.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 4 | (111) | beidseitig | 525 ± 15 | Phosphor | 2000 - 1000000 | | 49 / 49 | WFC40525155P2619SNN1 | | | | Prime FZ-Si wafer 4 inch, thickness = 525 ± 15 μm, (111), 2-side polished, n-type (Phosphor) TTV < 5 μm, 2000 - 1000000 Ohm cm, Flats: 2, [InvP] | | | Wafer-Preis (netto): € 54.80 (5 Wafer), € 47.60 (10 Wafer), € 42.00 (25 Wafer), € 40.50 (50 Wafer), € 39.00 (100 Wafer), € 37.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 4 | (111) | einseitig | 300 ± 15 | | 10000 - 1000000 | | 171 / 171 | WFF40300155X1719SNN1 | | | | Prime FZ-Si wafer 4 inch, thickness = 300 ± 15 μm, (111), 1-side polished, TTV < 5 μm, 10000 - 1000000 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 60.20 (5 Wafer), € 54.60 (10 Wafer), € 49.00 (25 Wafer), € 47.20 (50 Wafer), € 45.50 (100 Wafer), € 42.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Borosilicate | 4 | ### | beidseitig | 175 ± 20 | | | | 100 / 100 | WGS40175200X0000SNN1 | | | | Borosilicate 4 inch, thickness = 175 ± 20 μm, 2-side polished, TTV < 10 μm | | | Wafer-Preis (netto): € 44.00 (5 Wafer), € 36.00 (10 Wafer), € 26.00 (25 Wafer), € 24.00 (50 Wafer), € 22.50 (100 Wafer), € 21.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Borosilicate | 4 | ### | beidseitig | 200 ± 20 | | | | 120 / 120 | WGS40200200X0000SNN2 | | | | Borosilicate glass wafer 4 inch, thickness = 200 μm, 2-side polished - 1 SEMI Flat | | | Wafer-Preis (netto): € 37.20 (5 Wafer), € 31.60 (10 Wafer), € 26.00 (25 Wafer), € 24.50 (50 Wafer), € 23.60 (100 Wafer), € 22.80 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Borosilicate | 4 | ### | beidseitig | 500 ± 25 | | | | 536 / 536 | WGS40500250XXXXXSNN1 | | | | Borosilicate 4 inch, thickness = 500 ± 25 μm, 2-side polished, 1 SEMI flat | | | Wafer-Preis (netto): € 27.70 (5 Wafer), € 22.10 (10 Wafer), € 16.50 (25 Wafer), € 15.50 (50 Wafer), € 14.50 (100 Wafer), € 14.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Borosilicate | 4 | ### | beidseitig | 700 ± 20 | | | | 137 / 137 | WGS40700200X0000SNN2 | | | | Borosilicate Glas wafer 4 inch, thickness = 700 μm, 2-side polished, 1 Semi Flat | | | Wafer-Preis (netto): € 27.20 (5 Wafer), € 21.60 (10 Wafer), € 16.00 (25 Wafer), € 15.00 (50 Wafer), € 14.00 (100 Wafer), € 13.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Borosilicate | 4 | ### | beidseitig | 900 ± 30 | | | | 630 / 630 | WGS40900300X0000SNN1 | | | | Borosilicate 4 inch, thickness = 900 ± 30 μm, 2-side polished, TTV < 10 μm, 1 Flat | | | Wafer-Preis (netto): € 29.20 (5 Wafer), € 23.60 (10 Wafer), € 18.00 (25 Wafer), € 17.00 (50 Wafer), € 16.00 (100 Wafer), € 15.20 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Borosilicate | 4 | ### | beidseitig | 1000 ± 20 | | | | 735 / 735 | WGS41000200X0000SNN1 | | | | Borosilicate 4 inch, thickness = 1000 ± 20 μm, 2-side polished, primary flat 32.5 mm | | | Wafer-Preis (netto): € 29.20 (5 Wafer), € 23.60 (10 Wafer), € 18.00 (25 Wafer), € 17.00 (50 Wafer), € 16.00 (100 Wafer), € 15.20 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Borosilicate | 4 | ### | beidseitig | 2000 ± 25 | | | | 110 / 110 | WGS42000250X0000SNN1 | | | | Borosilicate glass 4 inch, thickness = 2000 ± 25 μm, 2-side polished, 1 Flat, units of 10 wafers | | | Wafer-Preis (netto): € 28.00 (10 Wafer), € 25.00 (20 Wafer), € 23.50 (40 Wafer), € 22.00 (80 Wafer), € 21.00 (160 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Borosilicate | 4 | ### | einseitig | 700 ± 20 | | | | 143 / 143 | WGV40700200X0000SNN1 | | | | Borosilicate Glas wafer 4 inch, thickness = 700 μm, 1-side polished | | | Wafer-Preis (netto): € 26.70 (5 Wafer), € 21.10 (10 Wafer), € 15.50 (25 Wafer), € 15.00 (50 Wafer), € 14.00 (100 Wafer), € 13.20 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 4 | (100) | beidseitig | 200 ± 10 | Bor | 1 - 10 | 60 nm | 69 / 69 | WNA40200105B1314S061 | | | | Prime Si + Si3N4 wafer 4 inch, thickness = 200 ± 10 μm, (100), 2-side polished, p-type (Boron), TTV < 5 μm, 1 - 10 Ohm cm, 60 nm low-stress LPCVD Si3N4 (50 - 70 nm) | | | Wafer-Preis (netto): € 64.00 (5 Wafer), € 58.00 (10 Wafer), € 50.00 (25 Wafer), € 48.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 4 | (100) | beidseitig | 200 ± 10 | Bor | 1 - 10 | 200 nm | 9 / 9 | WNA40200105B1314S202 | | | | Prime Si + Si3N4 wafer 4 inch, thickness = 200 ± 10 μm, (100), 2-side polished, p-type (Boron) TTV < 5 μm, 1 - 10 Ohm cm, 200 nm low-stress LPCVD Si3N4 on both sides | | | Wafer-Preis (netto): € 68.00 (5 Wafer), € 62.00 (10 Wafer), € 52.00 (25 Wafer), € 50.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 4 | (100) | beidseitig | 260 ± 10 | | 10000 - 100000 | 80 nm | 23 / 23 | WNA40260100X1718S081 | | | | Prime FZ-Si + Si3N4 wafer 4 inch, thickness = 260 ± 10 μm, (100), 2-side polished, TTV < 10 μm, Bow/Warp < 30 μm, intrinsic/undoped, 10000 - 100000 Ohm cm, 80 +/- 20 nm (> 50 nm) LPCVD low-stress Si3N4 on both sides | | | Wafer-Preis (netto): € 74.00 (5 Wafer), € 66.00 (10 Wafer), € 62.00 (25 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 4 | (100) | beidseitig | 380 ± 15 | Bor | 1 - 10 | 50 nm | 7 / 7 | WNA40380155B1314S051 | | | | Prime Si + Si3N4 (low-stress) wafer 4 inch, thickness = 380 ± 15 μm, (100), 2-side polished, p-type (Boron). TTV < 5 μm, 1 - 10 Ohm cm, 50 nm low-stress LPCVD Si3N4 on both sides | | | Wafer-Preis (netto): € 53.20 (5 Wafer), € 47.60 (10 Wafer), € 42.00 (25 Wafer), € 40.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 4 | (100) | beidseitig | 380 ± 15 | Bor | 1 - 10 | 70 nm | 48 / 48 | WNA40380155B1314S071 | | | | Prime Si + LPCVD Si3N4 wafer 4 inch, thickness = 380 ± 15 μm, (100), 2-side polished, p-type (Boron), TTV < 5 μm, 1 - 10 Ohm cm, 75 nm Si3N4 | | | Wafer-Preis (netto): € 57.00 (5 Wafer), € 52.00 (10 Wafer), € 46.00 (25 Wafer), € 44.50 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 4 | (100) | beidseitig | 380 ± 15 | Bor | 1 - 10 | 150 nm | 44 / 44 | WNA40380155B1314S151 | | | | Prime CZ-Si + Si3N4 wafer 4 inch, thickness = 380 ± 15 μm, (100), 2-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, 145 nm LPCVD Si3N4 on both sides | | | Wafer-Preis (netto): € 52.00 (5 Wafer), € 46.00 (10 Wafer), € 40.00 (25 Wafer), € 38.00 (50 Wafer), € 37.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 4 | (100) | beidseitig | 380 ± 15 | Bor | 1 - 10 | 400 nm | 18 / 18 | WNA40380155B1314S401 | | | | Prime Si + Si3N4 wafer 4 inch, thickness = 380 ± 15 μm, (100), 2-side polished, p-type (Boron), TTV < 5 μm, 1 - 10 Ohm cm, 400 nm LPCVD low-stress Si3N4 on both sides | | | Wafer-Preis (netto): € 58.00 (5 Wafer), € 52.00 (10 Wafer), € 46.00 (25 Wafer), € 44.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 4 | (100) | beidseitig | 380 ± 15 | Bor | 1 - 10 | 1000 nm | 28 / 28 | WNA40380155B1314SXX1 | | | | Prime CZ-Si + Si3N4 wafer 4 inch, thickness = 380 ± 15 μm, (100), 2-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, 1000 nm LPCVD low-stress Si3N4 on both sides | | | Wafer-Preis (netto): € 83.00 (5 Wafer), € 78.00 (10 Wafer), € 72.00 (25 Wafer), € 70.00 (50 Wafer), € 68.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 4 | (100) | beidseitig | 525 ± 15 | Bor | 1 - 10 | 30 nm | 6 / 6 | WNA40525155B1314S031 | | | | Prime Si + Si3N4 wafer 4 inch, thickness = 525 ± 15 μm, (100), 2-side polished, p-type (Boron) TTV < 5 μm, 1 - 10 Ohm cm, 30 nm low-stress LPCVD Si3N4 on both wafer sides | | | Wafer-Preis (netto): € 53.20 (5 Wafer), € 47.60 (10 Wafer), € 42.00 (25 Wafer), € 40.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 4 | (100) | beidseitig | 525 ± 15 | Bor | 1 - 10 | 100 nm | 75 / 75 | WNA40525155B1314S102 | | | | Prime Si + Si3N4 wafer 4 inch, thickness = 525 ± 15 μm, (100), 2-side polished, p-type (Boron), TTV < 5 μm, 1 - 10 Ohm cm, 100 nm low-stress LPCVD Si3N4 on both sides | | | Wafer-Preis (netto): € 52.00 (5 Wafer), € 45.00 (10 Wafer), € 38.00 (25 Wafer), € 36.00 (50 Wafer), € 34.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 4 | (100) | beidseitig | 525 ± 15 | Bor | 1 - 10 | 500 nm | 57 / 57 | WNA40525155B1314S501 | | | | Prime Si + Si3N4 wafer 4 inch, thickness = 525 ± 15 μm, (100), 2-side polished, p-type (Boron) TTV < 5 μm, 1 - 10 Ohm cm, 500 nm low-stress LPCVD Si3N4 on both sides | | | Wafer-Preis (netto): € 66.00 (5 Wafer), € 59.00 (10 Wafer), € 52.00 (25 Wafer), € 50.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 4 | (100) | beidseitig | 525 ± 25 | Bor | 1 - 10 | 40 nm | 11 / 11 | WNA40525255B1314S041 | | | | Prime Si + Si3N4 wafer 4 inch, thickness = 525 ± 25 μm, (100), 2-side polished, p-type (Boron), TTV < 5 μm, 1 - 10 Ohm cm, 40 nm low-stress Si3N4 | | | Wafer-Preis (netto): € 54.20 (5 Wafer), € 48.60 (10 Wafer), € 43.00 (25 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 4 | (100) | beidseitig | 525 ± 25 | Bor | 1 - 10 | 300 nm | 55 / 55 | WNA40525255B1314S301 | | | | Prime Si + Si3N4 wafer 4 inch, thickness = 525 ± 25 μm, (100), 2-side polished, p-type (Boron) TTV < 5 μm, 1 - 10 Ohm cm, 300 nm LPCVD Si3N4 on both sides | | | Wafer-Preis (netto): € 56.00 (5 Wafer), € 50.00 (10 Wafer), € 44.00 (25 Wafer), € 42.00 (50 Wafer), € 39.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 4 | (100) | beidseitig | 525 ± 25 | Bor | 1 - 10 | 450 nm | 9 / 9 | WNA40525255B1314S451 | | | | Prime Si + Si3N4 wafer 4 inch, thickness = 525 ± 25 μm, (100), 2-side polished, p-type (Boron) TTV < 5 μm, 1 - 10 Ohm cm, 450 nm low-stress LPCVD Si3N4 on both sides | | | Wafer-Preis (netto): € 68.00 (5 Wafer), € 64.00 (10 Wafer), € 58.00 (25 Wafer), € 56.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 4 | (100) | einseitig | 325 ± 25 | Bor | 1 - 10 | 80 nm | 25 / 25 | WND40325250B1314S081 | | | | Prime Si + Si3N4 wafer 4 inch, thickness = 325 ± 25 μm, (100), 1-side polished, p-type (Boron), TTV < 10 μm, 1 - 10 Ohm cm, 80 nm stoichiometric LPCVD Si3N4 on both sides | | | Wafer-Preis (netto): € 53.20 (5 Wafer), € 47.60 (10 Wafer), € 42.00 (25 Wafer), € 40.00 (50 Wafer), € 39.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + Si3N4 | 4 | (100) | einseitig | 525 ± 25 | Bor | 1 - 10 | 2000 nm | 0 / 15 | WND40525250B1314SNN1 | | | | Prime Si + dry/wet/dry SiO2 + Si3N4 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron), 1 - 10 Ohm cm, 2000 nm SiO2 + 300 nm stoichiometric LPCVD Si3N4 on both sides | | | Wafer-Preis (netto): € 110.00 (10 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Dummy3 | Si + Si3N4 | 4 | (100) | beidseitig | 500 ± 25 | | | 50 nm | 10 / 10 | WNS40500250X0000S051 | | | | Fused Silica JGS2 + Si3N4 wafer 4 inch, thickness = 500 ± 25 μm, (100), 2-side polished, + 50 nm low-stress LPCVD Si3N4 on both sides | | | Wafer-Preis (netto): € 62.00 (5 Wafer), € 54.00 (10 Wafer), € 46.00 (25 Wafer), € 44.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Quartz | 4 | X-Cut | beidseitig | 200 ± 25 | | | | 100 / 100 | WQA40200250XXXXXSNN1 | | | | Quartz wafer 4 inch, thickness = 200 ± 25 μm, X-Cut, 2-side polished, 1 SEMI Flat 32.5 +/-2.0 mm on X | | | Wafer-Preis (netto): € 82.00 (5 Wafer), € 76.00 (10 Wafer), € 70.00 (25 Wafer), € 68.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Quartz | 4 | Z-Cut | beidseitig | 1500 ± 50 | | | | 41 / 41 | WQC41500500X0000SNN1 | | | | Quartz wafer 4 inch, thickness = 1500 ± 50 μm, Z-Cut,seedless, 2-side polished, primary flat 32 mm on -X, top side Ra < 1 nm | | | Wafer-Preis (netto): € 79.60 (10 Wafer), € 74.00 (25 Wafer), € 68.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Quartz | 4 | ST-Cut | beidseitig | 500 ± 25 | | | | 93 / 93 | WQL40500250X0000SNN1 | | | | Quartz wafer 4 inch, thickness = 500 ± 25 μm, ST-Cut, 2-side polished, TTV < 10 μm, warp < 30 μm, primary flat 32.5 mm | | | Wafer-Preis (netto): € 51.00 (5 Wafer), € 45.00 (10 Wafer), € 39.00 (25 Wafer), € 37.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Dummy3 | CZ-Si | 4 | ### | einseitig | 500 ± 50 | Bor | 0.001 - 100 | | 1080 / 1080 | WS440500500B1015XNN1 | | | | Dummy CZ-Si wafer 4 inch, thickness = 500 ± 50 μm, any crystal orientation (not defined), 1-side polished, n- or p-type (mixed), 0.001 - 100 Ohm cm, not particle specified, each 40 pcs in vacuum sealed cassette package | | | Wafer-Preis (netto): € 7.00 (40 Wafer), € 6.00 (80 Wafer), € 5.50 (200 Wafer), € 5.00 (480 Wafer), € 4.70 (1000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 100 ± 10 | Bor | 0.001 - 0.01 | | 394 / 394 | WSA40100105B1011SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 100 ± 10 μm, (100), 2-side polished, p-type (Boron), TTV < 5 μm, 0.001 - 0.01 Ohm cm, Flats: 1, packed in single shippers, units of 10 wafers | | | Wafer-Preis (netto): € 54.00 (10 Wafer), € 50.00 (20 Wafer), € 48.00 (50 Wafer), € 46.00 (100 Wafer), € 44.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 100 ± 10 | Bor | 0.001 - 0.01 | | 70 / 70 | WSA40100105B1011SNN2 | | | | Prime CZ-Si wafer 4 inch, thickness = 100 ± 10 μm, (100), 2-side polished, p-type (Boron), TTV < 5 μm, 0.001 - 0.01 Ohm cm, 2 SEMI Flats, packed in single shippers, units of 10 wafers | | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 100 ± 20 | Bor | 0.001 - 0.01 | | 626 / 626 | WSA40100205B1011SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 100 ± 20 μm, (100), 2-side polished, p-type (Boron), TTV < 5 μm, 0.001 - 0.01 Ohm cm, Flats: 1, packed in single shippers, units of 10 wafers | | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 185 ± 10 | Bor | 1 - 10 | | 339 / 339 | WSA40185105B1314SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 200 ± 10 μm, (100), 2-side polished, p-type (Boron) TTV < 5 μm, 1 - 10 Ohm cm, Bow/Warp < 30 μm | | | Wafer-Preis (netto): € 31.20 (5 Wafer), € 25.60 (10 Wafer), € 20.00 (25 Wafer), € 19.60 (50 Wafer), € 19.20 (100 Wafer), € 19.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 200 ± 10 | Bor | 1 - 10 | | 500 / 500 | WSA40200105B1314SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 200 ± 10 μm, (100), 2-side polished, p-type (Boron) TTV < 5 μm, 1 - 10 Ohm cm, Bow/Warp < 30 μm | | | Wafer-Preis (netto): € 31.20 (5 Wafer), € 25.60 (10 Wafer), € 20.00 (25 Wafer), € 19.60 (50 Wafer), € 19.20 (100 Wafer), € 19.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 200 ± 25 | Bor | 1 - 10 | | 100 / 100 | WSA40200250B1314SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 200 ± 25 μm, (100), 2-side polished, p-type (Boron), TTV < 10 μm, 1 - 10 Ohm cm, back side laser marking: S1XXX (XXX = 001 ... 200) | | | Wafer-Preis (netto): € 25.00 (25 Wafer), € 23.50 (50 Wafer), € 22.00 (100 Wafer), € 21.00 (200 Wafer), € 20.00 (500 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 300 ± 5 | Phosphor | 2 - 10 | | 67 / 67 | WSA40300053P2314SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 300 ± 05 μm, (100) +/- 0.3°, 2-side polished, n-type (Phosphor) TTV < 3 μm, Bow/Warp < 25 μm, 2 - 10 Ohm cm, Laser-marking SEMI M13, 1.8-2 mm height, code: 100-Nxxxx-YYY (xxxx = consecutive number, YYY = fixed number defined by customer) | | | Wafer-Preis (netto): € 29.00 (25 Wafer), € 27.00 (50 Wafer), € 25.50 (100 Wafer), € 24.00 (250 Wafer), € 22.80 (500 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 17 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 300 ± 5 | Phosphor | 2 - 10 | | 3 / 3 | WSA40300055P2314SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 300 ± 05 μm, (100) +/- 0.3°, 2-side polished, n-type (Phosphor) TTV < 5 μm, Bow/Warp < 25 μm, 2 - 10 Ohm cm, Laser-marking SEMI M13, 1.8-2 mm height, code: 100-Nxxxx-236 (xxxx = consecutive number) | | | Wafer-Preis (netto): € 34.00 (5 Wafer), € 27.00 (10 Wafer), € 21.00 (25 Wafer), € 19.50 (50 Wafer), € 18.00 (100 Wafer), € 17.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 300 ± 5 | Phosphor | 2 - 10 | | 48 / 48 | WSA40300055P2314SNN2 | | | | Prime CZ-Si wafer 4 inch, thickness = 300 ± 05 μm, (100) +/- 0.3°, 2-side polished, n-type (Phosphor) TTV < 5 μm, Bow/Warp < 25 μm, 2 - 10 Ohm cm, Laser-marking SEMI M13, 1.8-2 mm height, code: 100-Nxxxx-YYY (xxxx = consecutive number, YYY = fixed number defined by customer) | | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 300 ± 25 | Phosphor | 0.1 - 1 | | 170 / 170 | WSA40300250P1213SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 300 ± 25 μm, (100), 2-side polished, n-type (Phosphor), TTV < 10 μm, 0.1 - 1 Ohm cm | | | Wafer-Preis (netto): € 31.20 (5 Wafer), € 25.60 (10 Wafer), € 20.00 (25 Wafer), € 19.00 (50 Wafer), € 18.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 300 ± 25 | Phosphor | 0.02 - 0.05 | | 170 / 170 | WSA40300250P2151SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 300 ± 25 μm, (100), 2-side polished, n-type (Phosphor), TTV < 10 μm, 0.02 - 0.05 Ohm cm | | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 380 ± 15 | Bor | 1 - 10 | | 1295 / 1295 | WSA40380155B1314SNN2 | | | | Prime CZ-Si wafer 4 inch, thickness = 380 ± 15 μm, (100), 2-side polished, p-type (Boron) TTV < 5 μm, 1 - 10 Ohm cm, Bow/Warp < 30μm | | | Wafer-Preis (netto): € 30.00 (5 Wafer), € 24.00 (10 Wafer), € 18.00 (25 Wafer), € 17.00 (50 Wafer), € 16.00 (100 Wafer), € 15.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 380 ± 15 | Bor | 1 - 10 | | 100 / 600 | WSA40380155B1314SNN3 | | | | Prime CZ-Si wafer 4 inch, thickness = 380 ± 15 μm, (100), 2-side polished, p-type (Boron), TTV < 5 μm, 1 - 10 Ohm cm, Bow/Warp < 30 μm, Laser-marking: B0001-xxxMSCC (xxx = 000 - 999, MS = vendor code, CC = check code), top of characters towards edge, Font SEMI OCR, height 1.0 +/- 0.025 mm, width 0.5 +/- 0.025 mm, spacing 0.875 +/- 0.025 mm, dot matrix density (W x H) 5x9, distance to edge 1.1 +/- 0.3 mm, laser mark depth < 50 μm, on front side in the middle of the long flat | | | Wafer-Preis (netto): € 30.00 (5 Wafer), € 24.00 (10 Wafer), € 18.00 (25 Wafer), € 17.00 (50 Wafer), € 16.00 (100 Wafer), € 15.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 380 ± 15 | Bor | 20 - 100 | | 7 / 7 | WSA40380155B2415SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 380 ± 15 μm, (100), 2-side polished, p-type (Boron), TTV < 5 μm, 20 - 100 Ohm cm, Bow < 20 μm, Warp < 25 μm | | | Wafer-Preis (netto): € 29.20 (5 Wafer), € 23.60 (10 Wafer), € 18.00 (25 Wafer), € 17.00 (50 Wafer), € 16.00 (100 Wafer), € 15.60 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 400 ± 15 | Bor | 0.1 - 1 | | 70 / 70 | WSA40400155B1213SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 400 ± 15 μm, (100), 2-side polished, p-type (Boron), TTV < 5 μm, 0.1 - 1 Ohm cm | | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 400 ± 25 | Phosphor | 1 - 10 | | 165 / 165 | WSA40400250P1314SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 400 ± 25 μm, (100), 2-side polished, n-type (Phosphor), TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 27.00 (5 Wafer), € 21.00 (10 Wafer), € 15.00 (25 Wafer), € 14.00 (50 Wafer), € 13.50 (100 Wafer), € 13.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 525 ± 15 | Bor | 1 - 10 | | 188 / 688 | WSA40525155B1314SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 15 μm, (<100>+/-0.3°), 2-side polished, p-type (Boron) TTV < 5 μm, 1 - 10 Ohm cm, 2 SEMI standard Flats
| | | Wafer-Preis (netto): € 27.00 (5 Wafer), € 21.40 (10 Wafer), € 15.80 (25 Wafer), € 15.20 (50 Wafer), € 14.60 (100 Wafer), € 14.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 525 ± 15 | Bor | 1 - 10 | | 10 / 10 | WSA40525155B1314SNN2 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 15 μm, (100), 2-side polished, p-type (Boron) TTV < 5 μm, 1 - 10 Ohm cm, laser marking on frontside: P42XXX | | | Wafer-Preis (netto): € 28.00 (5 Wafer), € 22.40 (10 Wafer), € 16.80 (25 Wafer), € 16.20 (50 Wafer), € 15.60 (100 Wafer), € 15.20 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 525 ± 25 | Bor | 0.1 - 1 | | 183 / 183 | WSA40525250B1213SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (100), 2-side polished, p-type (Boron), TTV < 10 μm, 0.1 - 1 Ohm cm | | | Wafer-Preis (netto): € 28.70 (5 Wafer), € 23.10 (10 Wafer), € 17.50 (25 Wafer), € 16.60 (50 Wafer), € 15.00 (100 Wafer), € 14.20 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 525 ± 25 | Phosphor | 2 - 10 | | 408 / 408 | WSA40525255P2314SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 10 μm, (100) +/- 0.3°, 2-side polished, n-type (Phosphor) TTV < 5 μm, Bow/Warp < 25 μm, 2 - 10 Ohm cm, Laser-marking SEMI M13, 1.8-2 mm height, code: 100-Nxxxx-237 (xxxx = consecutive number) | | | Wafer-Preis (netto): € 34.00 (5 Wafer), € 27.00 (10 Wafer), € 21.00 (25 Wafer), € 19.50 (50 Wafer), € 18.00 (100 Wafer), € 17.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 600 ± 25 | Phosphor | 1 - 10 | | 78 / 78 | WSA40600250P1314SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 600 ± 25 μm, (100), 2-side polished, n-type (Phosphor) TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 28.00 (5 Wafer), € 22.40 (10 Wafer), € 16.80 (25 Wafer), € 16.00 (50 Wafer), € 15.60 (100 Wafer), € 15.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 800 ± 25 | Bor | 1 - 10 | | 247 / 247 | WSA40800250B1314SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 800 ± 25 μm, (100), 2-side polished, p-type (Boron), 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 32.20 (5 Wafer), € 26.60 (10 Wafer), € 21.00 (25 Wafer), € 20.00 (50 Wafer), € 19.00 (199 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 1000 ± 25 | Bor | 1 - 50 | | 75 / 75 | WSA41000250B1354SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 1000 ± 25 μm, (100), 2-side polished, p-type (Boron), TTV < 10 μm, 1 - 50 Ohm cm, < 20 particles @ 0,3 μm, 2 SEMI flats | | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 1500 ± 25 | Bor | 1 - 10 | | 170 / 170 | WSA41500250B1314SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 1500 ± 25 μm, (100), 2-side polished, p-type (Boron), 1 - 10 Ohm cm, carriers with 23 wafers each | | | Wafer-Preis (netto): € 39.20 (5 Wafer), € 33.60 (10 Wafer), € 28.00 (23 Wafer), € 27.00 (46 Wafer), € 26.00 (92 Wafer), € 25.00 (184 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 4000 ± 25 | Bor | 1 - 10 | | 0 / 25 | WSA44000250B1314SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 4000 ± 25 μm, (100), 2-side polished, p-type (Boron), 1 - 10 Ohm cm, 2 flats (SEMI standard), units of 25 wafers, wafers separated by paper sheet, not particle specified | | | Wafer-Preis (netto): € 40.00 (25 Wafer), € 38.00 (50 Wafer), € 36.50 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (111) | beidseitig | 525 ± 25 | Bor | 0.1 - 1 | | 240 / 240 | WSC40525250B1213SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (111), 2-side polished, p-type (Boron), TTV < 10 μm, 0.1 - 1 Ohm cm | | | Wafer-Preis (netto): € 29.20 (5 Wafer), € 23.60 (10 Wafer), € 18.00 (25 Wafer), € 17.00 (50 Wafer), € 16.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 300 ± 25 | Bor | 1 - 10 | | 10 / 10 | WSD40300250B1314SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 300 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 27.20 (5 Wafer), € 21.00 (10 Wafer), € 15.00 (25 Wafer), € 13.00 (50 Wafer), € 12.50 (100 Wafer), € 12.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 300 ± 25 | Phosphor | 1 - 10 | | 21 / 21 | WSD40300250P1314SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 300 ± 25 μm, (100), 1-side polished, n-type (Phosphor), TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 23.80 (5 Wafer), € 18.20 (10 Wafer), € 13.60 (25 Wafer), € 12.80 (50 Wafer), € 12.00 (100 Wafer), € 11.60 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 325 ± 25 | Bor | 1 - 10 | | 249 / 249 | WSD40325250B1314SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 325 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 27.20 (5 Wafer), € 21.60 (10 Wafer), € 16.00 (25 Wafer), € 15.00 (50 Wafer), € 14.50 (100 Wafer), € 14.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 525 ± 15 | Arsen | 0.001 - 0.005 | | 115 / 115 | WSD40525150A1050SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 15 μm, (100), 1-side polished, n-type (Arsenic) TTV < 10 μm, 0.001 - 0.005 Ohm cm, Flats: 1 SEMI Flat | | | Wafer-Preis (netto): € 23.80 (5 Wafer), € 18.20 (10 Wafer), € 12.60 (25 Wafer), € 12.20 (50 Wafer), € 11.70 (100 Wafer), € 11.20 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 525 ± 15 | Bor | 10 - 20 | | 175 / 175 | WSD40525155B1424SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 15 μm, (100), 1-side polished, p-type (Boron) TTV < 5 μm, 10 - 20 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 25.80 (5 Wafer), € 20.20 (10 Wafer), € 14.60 (25 Wafer), € 14.20 (50 Wafer), € 13.70 (100 Wafer), € 13.20 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 525 ± 20 | Bor | 1 - 20 | | 29 / 29 | WSD40525205B1324SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 20 μm, (100), 1-side polished, p-type (Boron), TTV < 5 μm, 1 - 20 Ohm cm, Laser-marking on polished side: CEITEC-MC01-XXX (xxx = 000 ... 999) | | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 525 ± 20 | Bor | 1 - 20 | | 221 / 221 | WSD40525205B1324SNN2 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 20 μm, (100), 1-side polished, p-type (Boron), TTV < 5 μm, 1 - 20 Ohm cm, Laser-marking on polished side: MC02-XXX (xxx = 000 ... 999) | | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 525 ± 25 | Bor | 0.001 - 0.005 | | 210 / 210 | WSD40525250B1050SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron), 0.001 - 0.005 Ohm cm | | | Wafer-Preis (netto): € 26.20 (5 Wafer), € 19.00 (10 Wafer), € 15.00 (25 Wafer), € 14.60 (50 Wafer), € 14.20 (100 Wafer), € 13.90 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 525 ± 25 | Bor | 1 - 10 | | 768 / 768 | WSD40525250B1314SNN2 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, 1 flat | | | Wafer-Preis (netto): € 23.80 (5 Wafer), € 18.20 (10 Wafer), € 13.60 (25 Wafer), € 12.80 (50 Wafer), € 12.20 (100 Wafer), € 12.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 525 ± 25 | Bor | 1 - 10 | | 70 / 70 | WSD40525250B1314SNN4 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron), TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 26.00 (5 Wafer), € 20.00 (10 Wafer), € 14.60 (25 Wafer), € 13.60 (50 Wafer), € 12.80 (100 Wafer), € 12.20 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 525 ± 25 | Bor | 1 - 10 | | 0 / 892 | WSD40525250B1314SNN5 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, Bow/Warp < 30 μm Laser-marking: B0001-xxxMSCC (xxx = 000 - 999, MS = vendor code, CC = check code), top of characters towards edge, Font SEMI OCR, height 1.0 +/- 0.025 mm, width 0.5 +/- 0.025 mm, spacing 0.875 +/- 0.025 mm, dot matrix density (W x H) 5x9, distance to edge 1.1 +/- 0.3 mm, laser mark depth < 50 μm, on front side in the middle of the long flat | | | Wafer-Preis (netto): € 26.00 (5 Wafer), € 20.00 (10 Wafer), € 14.60 (25 Wafer), € 13.60 (50 Wafer), € 12.80 (100 Wafer), € 12.20 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 525 ± 25 | Bor | 5 - 10 | | 511 / 511 | WSD40525250B5314SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron), TTV < 10 μm, 5 - 10 Ohm cm | | | Wafer-Preis (netto): , € 14.00 (25 Wafer), € 13.50 (50 Wafer), € 13.20 (100 Wafer), € 12.80 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 525 ± 25 | Phosphor | 0.01 - 0.1 | | 144 / 144 | WSD40525250P1112SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, n-type (Phosphor), TTV < 10 μm, 0.01 - 0.1 Ohm cm | | | Wafer-Preis (netto): € 26.00 (5 Wafer), € 20.00 (10 Wafer), € 14.20 (25 Wafer), € 13.60 (50 Wafer), € 12.80 (100 Wafer), € 12.40 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 525 ± 25 | Phosphor | 0.1 - 1 | | 270 / 270 | WSD40525250P1213SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, n-type (Phosphor), TTV < 10 μm, 0.1 - 1 Ohm cm | | | Wafer-Preis (netto): € 26.00 (5 Wafer), € 20.00 (10 Wafer), € 14.20 (25 Wafer), € 13.60 (50 Wafer), € 12.80 (100 Wafer), € 12.80 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 525 ± 25 | Phosphor | 1 - 10 | | 165 / 165 | WSD40525250P1314XNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, n-type (Phosphor) TTV < 10 μm, 1 - 10 Ohm cm, ! no flat ! | | | Wafer-Preis (netto): € 26.00 (5 Wafer), € 20.00 (10 Wafer), € 14.20 (25 Wafer), € 13.80 (50 Wafer), € 13.20 (100 Wafer), € 12.80 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 525 ± 25 | Phosphor | 1 - 10 | | 71 / 71 | WSD40525250P1314XNN2 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, n-type (Phosphor) TTV < 10 μm, 1 - 10 Ohm cm, 2 SEMI Flats | | | Wafer-Preis (netto): € 24.80 (5 Wafer), € 19.20 (10 Wafer), € 13.60 (25 Wafer), € 13.20 (50 Wafer), € 12.80 (100 Wafer), € 12.50 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 2000 ± 25 | Bor | 1 - 20 | | 206 / 206 | WSD42000250B1324SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 2000 ± 25 μm, (100), 1-side polished, p-type (Boron), 1 - 20 Ohm cm, Flat: SEMI Standard, units of 25 wafers stacked | | | Wafer-Preis (netto): € 32.00 (25 Wafer), € 28.00 (50 Wafer), € 26.00 (100 Wafer), € 24.50 (200 Wafer), € 23.00 (400 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 6 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Prime | CZ-Si | 4 | (100) | einseitig | 3000 ± 25 | Bor | 1 - 20 | | 134 / 134 | WSD43000250B1324SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 3000 ± 25 μm, (100), 1-side polished, p-type (Boron), 1 - 20 Ohm cm | | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | CZ-Si | 4 | (110) | einseitig | 525 ± 25 | Bor | 1 - 10 | | 137 / 137 | WSE40525250B1314SNN1 | | | | Prime CZ-Si-Wafer 4 inch, thickness = 525 ± 25 μm, (110), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, 2 SEMI Flats (Primary Flat @ [111], S Flat @ [111] 109.5° CW from PF) | | | Wafer-Preis (netto): € 43.20 (5 Wafer), € 37.60 (10 Wafer), € 32.00 (25 Wafer), € 28.00 (50 Wafer), € 25.00 (100 Wafer), € 23.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (111) | einseitig | 450 ± 25 | | 0.01 - 0.05 | | 145 / 145 | WSF40450250X1151SNN1 | | | | Prime CZ-Si wafer 4 inch, thickness = 450 ± 25 μm, (111) +4° tilt, 1-side polished n-type (Antimon, Sb), TTV < 10 μm, 0.01 - 0.05 Ohm cm | | | Wafer-Preis (netto): € 26.20 (5 Wafer), € 20.60 (10 Wafer), € 15.00 (25 Wafer), € 14.00 (50 Wafer), € 13.60 (100 Wafer), € 13.20 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (111) | einseitig | 525 ± 25 | Bor | 1 - 10 | | 773 / 773 | WSF40525250B1314SNN2 | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (111), 1-side polished, p-type (Boron), TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 24.30 (5 Wafer), € 18.70 (10 Wafer), € 14.10 (25 Wafer), € 13.30 (50 Wafer), € 12.50 (100 Wafer), € 12.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Test | CZ-Si | 4 | (100) | einseitig | 525 ± 25 | Bor | 1 - 20 | | 18 / 18 | WSM40525250B1324SNN3 | | | | Test CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, Bow < 40 μm, 1 - 20 Ohm cm, SEMI Flat 32.5 mm. Laser-marking class 100
"LAAS 2021 TESTXXXX" | | | Wafer-Preis (netto): € 8.40 (1000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Test | CZ-Si | 4 | (100) | einseitig | 525 ± 25 | Phosphor | 1 - 20 | | 500 / 500 | WSM40525250P1324XNN1 | | | | Test CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, n-type (Phosphor), 1 - 20 Ohm cm, 1 Flat | | | Wafer-Preis (netto): € 11.00 (25 Wafer), € 10.70 (50 Wafer), € 10.50 (100 Wafer), € 10.00 (300 Wafer), € 9.50 (500 Wafer), € 9.00 (1000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Test | CZ-Si | 4 | (100) | einseitig | 525 ± 25 | Bor | 1 - 10 | | 975 / 3975 | WSM4052525XB1314SNN1 | | | | Test CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron), 1 - 10 Ohm cm, 2 SEMI flats | | | Wafer-Preis (netto): € 12.60 (25 Wafer), € 11.80 (50 Wafer), € 11.00 (100 Wafer), € 10.50 (300 Wafer), € 10.00 (500 Wafer), € 9.50 (1000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Test | CZ-Si | 4 | (100) | einseitig | 625 ± 25 | Bor | 1 - 10 | | 175 / 175 | WSM4062525XB1314SNN1 | | | | Test CZ-Si wafer 4 inch, thickness = 625 ± 25 μm, (100), 1-side polished, p-type (Boron), 1 - 10 Ohm cm, 2 SEMI flats | | | Wafer-Preis (netto): € 12.00 (25 Wafer), € 11.00 (50 Wafer), € 10.70 (100 Wafer), € 10.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Dummy3 | CZ-Si | 4 | (100) | beidseitig | 525 ± 25 | Bor | 1 - 10 | | 25 / 25 | WSS40525250B1314SNN2 | | | | Dummy CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (100), 2-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm. Wafers have been nitride-coated, nitride has been etched back, remaining Si surface shows some haze. No particle specification. 1 Carrier with 25 wafers available. | | | Wafer-Preis (netto): auf Anfrage | |
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| Dummy3 | CZ-Si | 4 | (111) | beidseitig | 500 ± 25 | Phosphor | 5 - 100 | | 175 / 175 | WSU40500250P5315XNN1 | | | | Dummy CZ-Si wafer 4 inch, thickness = 500 ± 25 μm, (111), 2-side polished, n-type (Phosphor), 5 - 100 Ohm cm, packed in units of 25 wafers in carriers, 1 Flat, tiny scratches possible, not particle-specified | | | Wafer-Preis (netto): € 8.50 (25 Wafer), € 8.00 (50 Wafer), € 7.50 (100 Wafer), € 7.00 (200 Wafer), € 6.50 (400 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Dummy3 | CZ-Si | 4 | (100) | einseitig | 325 ± 25 | Bor | 1 - 10 | | 23 / 23 | WSV40325250B1314SNN1 | | | | Dummy CZ-Si wafer 4 inch, thickness = 325 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, not particle specified | | | Wafer-Preis (netto): auf Anfrage | |
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| Dummy3 | CZ-Si | 4 | (100) | einseitig | 500 ± 50 | Bor | 0.001 - 100 | | 332 / 332 | WSV40500500B1015XNN1 | | | | Dummy CZ-Si wafer 4 inch, thickness = 500 ± 50 μm, (100), 1-side polished, p-type (Boron), 0.001 - 100 Ohm cm, not particle-specified, tiny scratches possible, units of 50 wafers (cake-box) | | | Wafer-Preis (netto): € 7.00 (50 Wafer), € 6.50 (100 Wafer), € 5.50 (200 Wafer), € 5.20 (500 Wafer), € 5.00 (1000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Dummy3 | CZ-Si | 4 | (100) | einseitig | 500 ± 50 | Bor | 0.001 - 100 | | 850 / 850 | WSV4050050XB1015XNN1 | | | | Dummy CZ-Si wafer 4 inch, thickness = 500 ± 50 μm, (100), 1-side polished, p-type (Boron), 0.001 - 100 Ohm cm, not particle-specified, units of 25 wafers (carriers) | | | Wafer-Preis (netto): € 8.00 (25 Wafer), € 7.50 (50 Wafer), € 7.00 (100 Wafer), € 6.40 (200 Wafer), € 6.00 (500 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Dummy3 | CZ-Si | 4 | (100) | einseitig | 525 ± 25 | Bor | 1 - 10 | | 24 / 24 | WSV40525250B1314SNN2 | | | | Dummy CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron), TTV < 10 μm, 1 - 10 Ohm cm, Bow/Warp < 30 μm Laser-marking: A0001-xxxMSCC, not particle-specified (one wafer in the box was broken) | | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | Si + SiO2 (dry) | 4 | (100) | einseitig | 525 ± 20 | Bor | 0.001 - 0.005 | 290 nm | 225 / 225 | WTD40525205B1050S291 | | | | Prime Si + dry SiO2 wafer 4 inch, thickness = 525 ± 20 μm, (100), 1-side polished, p-type (Boron), TTV < 5 μm, Bow/Warp < 30 μm, 0.001 - 0.005 Ohm cm, 290 nm SiO2 (+/- 7 %), particles: <10 @ 0.5 μm | | | Wafer-Preis (netto): € 36.00 (5 Wafer), € 30.00 (10 Wafer), € 23.00 (25 Wafer), € 21.50 (50 Wafer), € 20.00 (100 Wafer), € 19.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (dry) | 4 | (100) | einseitig | 525 ± 20 | Bor | 0.001 - 0.005 | 290 nm | 25 / 25 | WTD40525205B1050S293 | | | | Si + dry SiO2 wafer 4 inch, thickness = 525 ± 20 μm, (100), 1-side polished, p-type (Boron), TTV < 5 μm, Bow/Warp < 30 μm, 0.001 - 0.005 Ohm cm, 290 nm SiO2 (+/- 7 %), !! surface shows some kind of "haze" which can be cleaned !! | | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | Si + SiO2 (dry) | 4 | (100) | einseitig | 525 ± 20 | Bor | 0.001 - 0.005 | 290 nm | 13 / 13 | WTD40525205B1050S294 | | | | Prime Si + dry SiO2 wafer 4 inch, thickness = 525 ± 20 μm, (100), 1-side polished, p-type (Boron) TTV < 5 μm, 0.001 - 0.005 Ohm cm, 290 nm SiO2, Metallized: Ti: 10 nm and Pt: 100 nm, small individual defects in the layer possible but not mandatory
| | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | Si + SiO2 (dry) | 4 | (100) | einseitig | 525 ± 25 | Arsen | 0.001 - 0.005 | 200 nm | 23 / 23 | WTD40525250A1050S201 | | | | Prime Si + dry SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, n-type (Arsenic) TTV < 10 μm, 0.001 - 0.005 Ohm cm, 200 nm SiO2 | | | Wafer-Preis (netto): € 33.00 (5 Wafer), € 27.00 (10 Wafer), € 21.00 (25 Wafer), € 20.00 (50 Wafer), € 19.00 (100 Wafer), € 18.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (dry) | 4 | (100) | einseitig | 525 ± 25 | Bor | 0.001 - 0.005 | 90 nm | 76 / 76 | WTD40525250B1050S091 | | | | Prime Si + dry SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 0.001 - 0.005 Ohm cm, 90 nm SiO2 +/- 20 %, laser marking on polished side (MCPHD002-XXX, XXX = 001-999) | | | Wafer-Preis (netto): € 36.00 (5 Wafer), € 30.00 (10 Wafer), € 23.50 (25 Wafer), € 22.00 (50 Wafer), € 20.00 (150 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (dry) | 4 | (100) | einseitig | 525 ± 25 | Bor | 0.001 - 0.005 | 280 nm | 271 / 271 | WTD40525250B1050S281 | | | | Prime Si + dry SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 0.001 - 0.005 Ohm cm, 285 nm SiO2 +/- 5 %, laser marking on polished side (MCPHD004-XXX, XXX = 001-999) | | | Wafer-Preis (netto): € 37.00 (5 Wafer), € 31.00 (10 Wafer), € 24.50 (25 Wafer), € 23.00 (50 Wafer), € 21.00 (150 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (dry) | 4 | (100) | einseitig | 525 ± 25 | Bor | 1 - 10 | 100 nm | 220 / 220 | WTD40525250B1314S102 | | | | Prime Si + dry SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, 100 nm SiO2 | | | Wafer-Preis (netto): € 33.20 (5 Wafer), € 27.60 (10 Wafer), € 22.00 (25 Wafer), € 20.00 (50 Wafer), € 19.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (dry) | 4 | (100) | einseitig | 525 ± 25 | Bor | 1 - 10 | 200 nm | 401 / 401 | WTD40525250B1314S201 | | | | Prime Si + dry SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, 200 nm SiO2 | | | Wafer-Preis (netto): € 32.00 (5 Wafer), € 26.00 (10 Wafer), € 20.00 (25 Wafer), € 19.00 (50 Wafer), € 18.00 (100 Wafer), € 17.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (dry) | 4 | (100) | einseitig | 525 ± 25 | Phosphor | 1 - 10 | 100 nm | 74 / 74 | WTD40525250P1314S101 | | | | Prime Si + dry SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, n-type (Phosphor) TTV < 10 μm, 1 - 10 Ohm cm, 100 nm SiO2 | | | Wafer-Preis (netto): € 32.00 (5 Wafer), € 26.00 (10 Wafer), € 20.00 (25 Wafer), € 19.00 (50 Wafer), € 18.00 (100 Wafer), € 17.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (dry) | 4 | (100) | einseitig | 525 ± 25 | Bor | 0.001 - 0.01 | 90 nm | 103 / 103 | WTD40525255B1011S091 | | | | Prime Si + dry SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 5 μm, 0.001 - 0.01 Ohm cm, 90 nm SiO2 | | | Wafer-Preis (netto): € 34.00 (5 Wafer), € 28.00 (10 Wafer), € 22.00 (25 Wafer), € 21.00 (50 Wafer), € 20.00 (100 Wafer), € 19.50 (150 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Test | Si + SiO2 (dry) | 4 | (100) | einseitig | 525 ± 25 | Bor | 0.001 - 0.005 | 280 nm | 25 / 25 | WTM40525250B1050S281 | | | | Test Si + dry SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 0.001 - 0.005 Ohm cm, 285 nm SiO2 +/- 10 %, laser marking on polished side (MCPHD003-XXX, XXX = 001-999), box has already been opened in clean room for SiO2 thickness measurements | | | Wafer-Preis (netto): auf Anfrage | |
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| Dummy3 | Si + SiO2 (dry) | 4 | (100) | einseitig | 525 ± 25 | Bor | 0.001 - 0.005 | 280 nm | 234 / 234 | WTV40525250B1050S281 | | | | Dummy Si + dry SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 0.001 - 0.005 Ohm cm, 285 nm SiO2 +/- 5 %, laser marking on polished side (MCPHD003-XXX, XXX = 001-999), not-particle-specified, tiny defects in the SiO2 film | | | Wafer-Preis (netto): € 20.00 (25 Wafer), € 18.00 (50 Wafer), € 16.00 (100 Wafer), € 14.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 9 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| | Fused Silica | 4 | ### | beidseitig | 380 ± 20 | | | | 211 / 211 | WUA40380200X0000SNN1 | | | | Fused silica JGS2 wafer 4 inch, thickness = 380 ± 20 μm, 2-side polished, TTV < 10 μm | | | Wafer-Preis (netto): € 29.00 (5 Wafer), € 23.00 (10 Wafer), € 17.00 (25 Wafer), € 16.00 (50 Wafer), € 15.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 4 | ### | beidseitig | 500 ± 25 | | | | 167 / 167 | WUA40500250X0000SNN1 | | | | Fused silica JGS1 wafer 4 inch, thickness = 500 ± 25 μm, 2-side polished, primary flat 32.5 +/- 2 mm | | | Wafer-Preis (netto): € 47.20 (5 Wafer), € 41.60 (10 Wafer), € 36.00 (25 Wafer), € 34.00 (50 Wafer), € 32.00 (100 Wafer), € 30.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 4 | ### | beidseitig | 250 ± 25 | | | | 159 / 159 | WUS40250250XXXXXSNN1 | | | | Fused silica JGS2 wafer 4 inch, thickness = 250 ± 25 μm, 2-side polished | | | Wafer-Preis (netto): € 31.20 (5 Wafer), € 25.60 (10 Wafer), € 20.00 (25 Wafer), € 18.00 (50 Wafer), € 16.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 4 | ### | beidseitig | 350 ± 25 | | | | 140 / 140 | WUS40350250XXXXXXNN1 | | | | Fused silica JGS2 wafer 4 inch, thickness = 350 ± 25 μm, 2-side polished, TTV < 10 μm, 1 SEMI Flat | | | Wafer-Preis (netto): € 33.00 (5 Wafer), € 27.40 (10 Wafer), € 21.80 (25 Wafer), € 21.20 (50 Wafer), € 20.80 (100 Wafer), € 20.20 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 4 | ### | beidseitig | 500 ± 25 | | | | 486 / 486 | WUS40500250X0000SNN2 | | | | Fused silica JGS2 wafer 4 inch, thickness = 500 ± 25 μm, 2-side polished, TTV < 10 μm - 1 SEMI Flat | | | Wafer-Preis (netto): € 33.70 (5 Wafer), € 28.10 (10 Wafer), € 22.50 (25 Wafer), € 21.00 (50 Wafer), € 19.00 (100 Wafer), € 17.50 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 4 | ### | beidseitig | 500 ± 25 | | | | 69 / 69 | WUS40500250X0000SNN4 | | | | Fused silica JGS3 wafer 4 inch, thickness = 500 ± 25 μm, 2-side polished, 1 flat | | | Wafer-Preis (netto): € 64.00 (5 Wafer), € 56.00 (10 Wafer), € 48.00 (25 Wafer), € 46.00 (50 Wafer), € 44.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 4 | ### | beidseitig | 1000 ± 25 | | | | 265 / 265 | WUS41000250X0000SNN1 | | | | Fused silica JGS1 wafer 4 inch +/- 0.3 mm, thickness = 1000 ± 25 μm, 2-side polished, TTV < 10 μm, primary flat 32.50mm, Bow/Warp < 40 μm, S/D 40/20 | | | Wafer-Preis (netto): € 53.20 (5 Wafer), € 47.60 (10 Wafer), € 42.00 (25 Wafer), € 40.00 (50 Wafer), € 38.00 (100 Wafer), € 37.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 4 | ### | beidseitig | 1000 ± 25 | | | | 243 / 243 | WUS41000250X0000SNN2 | | | | Fused silica JGS2 wafer 4 inch +/- 0.2 mm, thickness = 1000 ± 25 μm, 2-side polished, TTV < 10 μm, primary flat 32.50mm +/- 2.50 mm, OH content < 300 ppm
| | | Wafer-Preis (netto): € 35.20 (5 Wafer), € 29.60 (10 Wafer), € 24.00 (25 Wafer), € 23.00 (50 Wafer), € 22.00 (100 Wafer), € 21.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 4 | (100) | beidseitig | 525 ± 15 | Bor | 1 - 10 | 300 nm | 65 / 65 | WWA40525150B1314SNN2 | | | | Prime Si + dry/wet/dry SiO2 wafer 4 inch, thickness = 525 ± 15 μm, (100), 2-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, 300 nm SiO2 | | | Wafer-Preis (netto): € 35.20 (5 Wafer), € 29.60 (10 Wafer), € 24.00 (25 Wafer), € 23.00 (50 Wafer), € 22.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 4 | (100) | beidseitig | 525 ± 25 | Phosphor | 1 - 10 | 5000 nm | 117 / 117 | WWA40525250P1314SXX1 | | | | Prime Si + wet SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 2-side polished, n-type (Phosphor), 1 - 10 Ohm cm, 5000 nm SiO2 | | | Wafer-Preis (netto): € 83.20 (5 Wafer), € 77.60 (10 Wafer), € 72.00 (25 Wafer), € 60.00 (50 Wafer), € 59.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 4 | (100) | einseitig | 525 ± 25 | Arsen | 0.001 - 0.005 | 300 nm | 175 / 175 | WWD40525250A1050S301 | | | | Prime Si + dry/wet/dry SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, n-type (Arsenic), 0.001 - 0.005 Ohm cm, 300 nm SiO2 | | | Wafer-Preis (netto): € 32.20 (5 Wafer), € 26.60 (10 Wafer), € 21.00 (25 Wafer), € 20.00 (50 Wafer), € 19.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 4 | (100) | einseitig | 525 ± 25 | Bor | 1 - 10 | 300 nm | 336 / 336 | WWD40525250B1314S302 | | | | Prime Si + dry/wet/dry SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, 300 nm SiO2 | | | Wafer-Preis (netto): € 32.00 (5 Wafer), € 26.00 (10 Wafer), € 20.00 (25 Wafer), € 19.00 (50 Wafer), € 18.00 (100 Wafer), € 17.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 4 | (100) | einseitig | 525 ± 25 | Bor | 1 - 10 | 500 nm | 361 / 361 | WWD40525250B1314S501 | | | | Prime Si + dry/wet/dry SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, 500 nm SiO2 | | | Wafer-Preis (netto): € 31.20 (5 Wafer), € 25.60 (10 Wafer), € 20.00 (25 Wafer), € 18.00 (50 Wafer), € 17.00 (100 Wafer), € 16.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 4 | (100) | einseitig | 525 ± 25 | Bor | 1 - 10 | 1000 nm | 205 / 205 | WWD40525250B1314SXX1 | | | | Prime Si + SiO2 (dry/wet/dry)-Wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, 1000 nm SiO2 | | | Wafer-Preis (netto): € 37.20 (5 Wafer), € 31.60 (10 Wafer), € 26.00 (25 Wafer), € 24.00 (50 Wafer), € 22.00 (100 Wafer), € 20.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 4 | (100) | einseitig | 525 ± 25 | Bor | 1 - 10 | 1500 nm | 243 / 243 | WWD40525250B1314SXX3 | | | | Prime Si + wet SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron), 1 - 10 Ohm cm, 1500 nm SiO2 | | | Wafer-Preis (netto): € 39.20 (5 Wafer), € 33.60 (10 Wafer), € 28.00 (25 Wafer), € 27.00 (50 Wafer), € 26.00 (100 Wafer), € 25.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 4 | (100) | einseitig | 525 ± 25 | Bor | 1 - 10 | 2000 nm | 170 / 170 | WWD40525250B1314SXX6 | | | | Prime Si + dry/wet/dry SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron), 1 - 10 Ohm cm, 2000 nm SiO2 | | | Wafer-Preis (netto): € 47.20 (5 Wafer), € 41.60 (10 Wafer), € 36.00 (25 Wafer), € 34.50 (50 Wafer), € 33.00 (100 Wafer), € 32.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 4 | (100) | einseitig | 525 ± 25 | Bor | 1 - 10 | 5000 nm | 68 / 68 | WWD40525250B1314SXX8 | | | | Prime Si + wet SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron), TTV < 10 μm, 1 - 10 Ohm cm, 5000 nm SiO2 | | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | Si + SiO2 (wet) | 4 | (100) | einseitig | 525 ± 25 | Phosphor | 1 - 10 | 1000 nm | 25 / 225 | WWD40525250P1314SXX1 | | | | Prime Si + wet SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, n-type (Phosphor), 1 - 10 Ohm cm, 1000 nm SiO2 | | | Wafer-Preis (netto): € 39.20 (5 Wafer), € 33.60 (10 Wafer), € 28.00 (25 Wafer), € 26.00 (50 Wafer), € 24.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 4 | (100) | einseitig | 525 ± 25 | Phosphor | 1 - 10 | 2280 nm | 50 / 50 | WWD40525250P1314SXX2 | | | | Prime Si + dry/wet/dry SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, n-type (Phosphor), TTV < 10 μm, 1 - 10 Ohm cm, 2280 nm SiO2 +/- 5 % | | | Wafer-Preis (netto): € 61.00 (5 Wafer), € 55.00 (10 Wafer), € 49.00 (25 Wafer), € 46.00 (50 Wafer), € 44.00 (100 Wafer), € 42.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 4 | (100) | einseitig | 525 ± 25 | | 1000 - 100000 | 300 nm | 87 / 87 | WWD40525250X1618S301 | | | | Prime FZ Si + wet SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (100), 1-side polished, TTV < 10 μm, intrinsic (undoped) 1000 - 100000 Ohm cm, 300 nm thermal SiO2 dry/wet/dry | | | Wafer-Preis (netto): € 69.20 (5 Wafer), € 63.60 (10 Wafer), € 58.00 (25 Wafer), € 54.00 (50 Wafer), € 50.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 4 | (100) | einseitig | 625 ± 25 | Phosphor | 10 - 20 | 1000 nm | 149 / 149 | WWD40625250P1424SXX1 | | | | Prime Si + dry/wet/dry SiO2 wafer 4 inch, thickness = 625 ± 25 μm, (100), 1-side polished, n-type (Phosphor) TTV < 10 μm, 10 - 20 Ohm cm, 1000 nm SiO2 +/- 10 %, single flat 32,5 +/- 2,5 mm, no second flat | | | Wafer-Preis (netto): € 38.50 (5 Wafer), € 32.50 (10 Wafer), € 26.50 (25 Wafer), € 24.50 (50 Wafer), € 22.50 (100 Wafer), € 18.50 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 4 | (111) | einseitig | 525 ± 25 | Phosphor | 1 - 10 | 1000 nm | 1 / 1 | WWF40525250P1314SXX1 | | | | Prime Si + wet SiO2 wafer 4 inch, thickness = 525 ± 25 μm, (111), 1-side polished, n-type (Phosphor) TTV < 10 μm, 1 - 10 Ohm cm, 1000 nm SiO2 | | | Wafer-Preis (netto): € 37.20 (5 Wafer), € 31.60 (10 Wafer), € 26.00 (25 Wafer), € 24.00 (50 Wafer), € 22.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 300 ± 10 | | 0.002 - 0.004 | | 0 / 84(5) | WSA40300105X2040SNN# | | | | Prime CZ-Si wafer 4 inch, thickness = 300 ± 10 μm, (100), 2-side polished, TTV < 5 μm, 0.002 - 0.004 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 29.60 (5 Wafer), € 22.40 (10 Wafer), € 16.80 (25 Wafer), € 16.20 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 100 ± 5 | Bor | 0 - 0.01 | | 0 / 25(5) | WSA40100055B0011SNN# | | | | Prime CZ-Si wafer 4 inch, thickness = 100 ± 5 μm, (100), 2-side polished, p-type (Boron) TTV < 5 μm, 0 - 0.01 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 68.80 (5 Wafer), € 61.60 (10 Wafer), € 56.00 (25 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 380 ± 15 | Phosphor | 2 - 10 | | 0 / 340(5) | WSA40380155P2314SNN# | | | | Prime CZ-Si wafer 4 inch, thickness = 380 ± 15 μm, (100), 2-side polished, n-type (Phosphor) TTV < 5 μm, 2 - 10 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 29.60 (5 Wafer), € 22.40 (10 Wafer), € 16.80 (25 Wafer), € 16.20 (50 Wafer), € 15.60 (100 Wafer), € 15.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 525 ± 25 | Phosphor | 1 - 10 | | 0 / 50(5) | WSA40525250P1314SNN# | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 25 μm, (100), 2-side polished, n-type (Phosphor) TTV < 10 μm, 1 - 10 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 29.60 (5 Wafer), € 22.40 (10 Wafer), € 16.80 (25 Wafer), € 16.20 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 1000 ± 25 | Phosphor | 0 - 0.005 | | 0 / 15(5) | WSA41000250P0050SNN# | | | | Prime CZ-Si wafer 4 inch, thickness = 1000 ± 25 μm, (100), 2-side polished, n-type (Phosphor) TTV < 10 μm, 0 - 0.005 Ohm cm, Flats: 1 | | | Wafer-Preis (netto): € 33.80 (5 Wafer), € 26.60 (10 Wafer), € 21.00 (25 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (100) | beidseitig | 800 ± 20 | Bor | 1 - 10 | | 0 / 145(5) | WSA40800200B1314SNN# | | | | Prime CZ-Si wafer 4 inch, thickness = 800 ± 20 μm, (100), 2-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 32.40 (5 Wafer), € 25.20 (10 Wafer), € 19.60 (25 Wafer), € 18.90 (50 Wafer), € 18.20 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 4 | (110) | einseitig | 525 ± 15 | Bor | 5 - 8 | | 0 / 100(5) | WSE40525155B5383SNN# | | | | Prime CZ-Si wafer 4 inch, thickness = 525 ± 15 μm, (110), 1-side polished, p-type (Boron) TTV < 5 μm, 5 - 8 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 40.80 (5 Wafer), € 33.60 (10 Wafer), € 28.00 (25 Wafer), € 27.00 (50 Wafer), € 26.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| X | CZ-Si | 4 | ### | ### | 525 ± 15 | Bor | 1 - 10 | | 0 / 75(5) | WSX40525150B1314SNN# | | | | X CZ-Si wafer 4 inch, thickness = 525 ± 15 μm, , p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm, Flats: 1 | | | Wafer-Preis (netto): € 26.80 (5 Wafer), € 19.60 (10 Wafer), € 14.00 (25 Wafer), € 13.50 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 4 | (100) | beidseitig | 300 ± 20 | Bor | 1 - 5 | | 0 / 35(5) | WFA40300205B1353SNN# | | | | Prime FZ-Si wafer 4 inch, thickness = 300 ± 20 μm, (100), 2-side polished, p-type (Boron) TTV < 5 μm, 1 - 5 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 47.80 (5 Wafer), € 40.60 (10 Wafer), € 35.00 (25 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 4 | (111) | einseitig | 300 ± 15 | | 10000 - 1000000 | | 0 / 125(5) | WFF40300155X1719SNN# | | | | Prime FZ-Si wafer 4 inch, thickness = 300 ± 15 μm, (111), 1-side polished, TTV < 5 μm, 10000 - 1000000 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 61.80 (5 Wafer), € 54.60 (10 Wafer), € 49.00 (25 Wafer), € 47.20 (50 Wafer), € 45.50 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 4 | (111) | beidseitig | 300 ± 10 | Phosphor | 5000 - 1000000 | | 0 / 298(5) | WFC40300105P5619SNN# | | | | Prime FZ-Si wafer 4 inch, thickness = 300 ± 10 μm, (111), 2-side polished, n-type (Phosphor) TTV < 5 μm, 5000 - 1000000 Ohm cm, Flats: 1 | | | Wafer-Preis (netto): € 61.80 (5 Wafer), € 54.60 (10 Wafer), € 49.00 (25 Wafer), € 47.20 (50 Wafer), € 45.50 (100 Wafer), € 43.80 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 4 | (100) | einseitig | 525 ± 10 | Bor | 2000 - 4000 | | 0 / 115(5) | WFD40525105B2646SNN# | | | | Prime FZ-Si wafer 4 inch, thickness = 525 ± 10 μm, (100), 1-side polished, p-type (Boron) TTV < 5 μm, 2000 - 4000 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 61.80 (5 Wafer), € 54.60 (10 Wafer), € 49.00 (25 Wafer), € 47.20 (50 Wafer), € 45.50 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 4 | (111) | beidseitig | 525 ± 15 | Phosphor | 2000 - 1000000 | | 0 / 260(5) | WFC40525155P2619SNN# | | | | Prime FZ-Si wafer 4 inch, thickness = 525 ± 15 μm, (111), 2-side polished, n-type (Phosphor) TTV < 5 μm, 2000 - 1000000 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 54.80 (5 Wafer), € 47.60 (10 Wafer), € 42.00 (25 Wafer), € 40.50 (50 Wafer), € 39.00 (100 Wafer), € 37.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 4 | (100) | beidseitig | 300 ± 10 | Bor | 150 - 500 | | 0 / 44(5) | WFA40300100B1555SNN# | | | | Prime FZ-Si wafer 4 inch, thickness = 300 ± 10 μm, (100), 2-side polished, p-type (Boron) TTV < 10 μm, 150 - 500 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 54.80 (5 Wafer), € 47.60 (10 Wafer), € 42.00 (25 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
|
| Prime | FZ-Si | 4 | (100) | einseitig | 525 ± 10 | | 10000 - 1000000 | | 0 / 76(5) | WFD40525105X1719SNN# | | | | Prime FZ-Si wafer 4 inch, thickness = 525 ± 10 μm, (100), 1-side polished, TTV < 5 μm, 10000 - 1000000 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 61.80 (5 Wafer), € 54.60 (10 Wafer), € 49.00 (25 Wafer), € 47.20 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | FZ-Si | 4 | (111) | beidseitig | 525 ± 10 | | 20000 - 1000000 | | 0 / 152(5) | WFC40525105X2719SNN# | | | | Prime FZ-Si wafer 4 inch, thickness = 525 ± 10 μm, (111), 2-side polished, TTV < 5 μm, 20000 - 1000000 Ohm cm, Flats: 1 | | | Wafer-Preis (netto): € 68.80 (5 Wafer), € 61.60 (10 Wafer), € 56.00 (25 Wafer), € 54.00 (50 Wafer), € 52.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
|
| Prime | FZ-Si | 4 | (100) | beidseitig | 400 ± 10 | Phosphor | 3000 - 1000000 | | 0 / 150(5) | WFA40400105P3619SNN# | | | | Prime FZ-Si wafer 4 inch, thickness = 400 ± 10 μm, (100), 2-side polished, n-type (Phosphor) TTV < 5 μm, 3000 - 1000000 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 61.80 (5 Wafer), € 54.60 (10 Wafer), € 49.00 (25 Wafer), € 47.20 (50 Wafer), € 45.50 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
|
| Prime | FZ-Si | 4 | (100) | beidseitig | 200 ± 10 | | 10000 - 1000000 | | 0 / 100(5) | WFA40200105X1719SNN# | | | | Prime FZ-Si wafer 4 inch, thickness = 200 ± 10 μm, (100), 2-side polished, TTV < 5 μm, 10000 - 1000000 Ohm cm, Flats: 2 | | | Wafer-Preis (netto): € 68.80 (5 Wafer), € 61.60 (10 Wafer), € 56.00 (25 Wafer), € 54.00 (50 Wafer), € 52.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
Sie wünschen eine Preisauskunft oder ein Angebot? Senden Sie uns eine Nachricht an info@microchemicals.com mit den gewünschten Artikelnummern (die 20-stellige zeichenfolge rechts in der Tabelle) und Stückzahlen, wir melden uns umgehend bei Ihnen!
5 Zoll Silizium, Quarz, Quarzglas, Fused Silica und Glas Wafer
| Qual. | Material | Größe (Zoll) | Orien- tierung | Poliert | Dicke (μm) | Dotierung | Widerstand (ohm cm) | Beschichtung | # verfügbar aktuell1/in Bälde2 | Artikel-Nummer (zum WebShop) | |
|
| Prime | CZ-Si | 5 | (100) | beidseitig | 600 ± 15 | Phosphor | 1 - 10 | | 153 / 153 | WSA50600155P1314SNN1 | | | | Prime CZ-Si wafer 5 inch, thickness = 600 ± 15 μm, (100), 2-side polished (dsp), n-type (Phosphor) TTV < 5 μm, 1 - 10 Ohm cm, Flats: 2, Laser-marking [InvP] | | | Wafer-Preis (netto): € 29.80 (5 Wafer), € 24.00 (10 Wafer), € 18.20 (25 Wafer), € 17.60 (50 Wafer), € 17.00 (100 Wafer), € 16.60 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 5 | (100) | einseitig | 525 ± 25 | Bor | 1 - 10 | | 211 / 211 | WSD50525250B1314SNN1 | | | | Prime CZ-Si wafer 5 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron), TTV < 10 μm, 1 - 10 Ohm cm, 2 SEMI flats | | | Wafer-Preis (netto): € 28.60 (5 Wafer), € 22.80 (10 Wafer), € 17.00 (25 Wafer), € 16.00 (50 Wafer), € 15.50 (100 Wafer), € 15.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Test | CZ-Si | 5 | (100) | einseitig | 525 ± 25 | Bor | 1 - 10 | | 150 / 150 | WSM50525250B1314SNN1 | | | | Test CZ-Si wafer 5 inch, thickness = 525 ± 25 μm, (100), 1-side polished, p-type (Boron), TTV < 10 μm, 1 - 10 Ohm cm, 2 SEMI flats | | | Wafer-Preis (netto): € 16.00 (25 Wafer), € 15.00 (50 Wafer), € 14.50 (100 Wafer), € 14.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Dummy3 | CZ-Si | 5 | (100) | einseitig | 525 ± 50 | Phosphor | 0.001 - 100 | | 200 / 200 | WSV50525500P1015SNN1 | | | | Dummy CZ-Si wafer 5 inch, thickness = 525 ± 50 μm, (100), 1-side polished, n-type (Phosphor), 0.001 - 100 Ohm cm, not particle-specified, units of 25 wafers (carriers) | | | Wafer-Preis (netto): € 10.00 (25 Wafer), € 9.20 (50 Wafer), € 8.50 (100 Wafer), € 8.00 (200 Wafer), € 7.50 (500 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
Sie wünschen eine Preisauskunft oder ein Angebot? Senden Sie uns eine Nachricht an info@microchemicals.com mit den gewünschten Artikelnummern (die 20-stellige zeichenfolge rechts in der Tabelle) und Stückzahlen, wir melden uns umgehend bei Ihnen!
6 Zoll Silizium, Quarz, Quarzglas, Fused Silica und Glas Wafer
| Qual. | Material | Größe (Zoll) | Orien- tierung | Poliert | Dicke (μm) | Dotierung | Widerstand (ohm cm) | Beschichtung | # verfügbar aktuell1/in Bälde2 | Artikel-Nummer (zum WebShop) | |
|
| Prime | FZ-Si | 6 | (100) | beidseitig | 300 ± 10 | | 10000 - 100000 | | 123 / 123 | WFA60300100X1718SNN1 | | | | Prime FZ-Si wafer 6 inch, thickness = 300 ± 10 μm, (100), 2-side polished, 10000 - 100000 Ohm cm, 1 SEMI Flat, Laser-marking on rear side “BacksideXXX”, xx = 001 – 999 | | | Wafer-Preis (netto): auf Anfrage | |
|
| Prime | FZ-Si | 6 | (100) | beidseitig | 380 ± 10 | | 10000 - 100000 | | 112 / 112 | WFA60380100X1718SNN1 | | | | Prime FZ-Si wafer 6 inch, thickness = 380 ± 10 μm, (100), 2-side polished, TTV < 10 μm, 10000 - 100000 Ohm cm | | | Wafer-Preis (netto): € 128.00 (5 Wafer), € 118.00 (10 Wafer), € 105.00 (25 Wafer), € 98.00 (50 Wafer), € 95.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Borosilicate | 6 | ### | beidseitig | 700 ± 20 | | | | 269 / 269 | WGS60700200X0000SNN1 | | | | Borosilicate Glas wafer 6 inch, thickness = 700 μm, 2-side polished, TTV<10um, Bow/Warp<40um, 1 SEMI Flat, Ra<1 nm | | | Wafer-Preis (netto): € 46.00 (5 Wafer), € 38.00 (10 Wafer), € 30.00 (25 Wafer), € 29.00 (50 Wafer), € 28.00 (100 Wafer), € 27.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Borosilicate | 6 | ### | beidseitig | 700 ± 20 | | | | 216 / 216 | WGS60700200X0000XNN1 | | | | Borosilicate Glas wafer 6 inch, thickness = 700 μm, 2-side polished, TTV < 10 μm, Bow/Warp < 40 μm, Ra < 1 nm, no Flat | | | Wafer-Preis (netto): € 43.00 (5 Wafer), € 36.40 (10 Wafer), € 30.00 (25 Wafer), € 29.00 (50 Wafer), € 28.00 (100 Wafer), € 27.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Borosilicate | 6 | ### | einseitig | 700 ± 25 | | | | 87 / 87 | WGV60700250X0000SNN2 | | | | Dummy Borosilicate 6 inch, thickness = 700 ± 25 μm, 1-side polished, not particle-specified (stock with 1x2 pcs, 1x15, 1x22, 3x25) | | | Wafer-Preis (netto): € 15.00 (25 Wafer), € 14.00 (50 Wafer), € 13.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 12 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Dummy3 | CZ-Si | 6 | ### | einseitig | 650 ± 50 | Bor | 0.001 - 100 | | 550 / 550 | WS460650500B1015XNN1 | | | | Dummy CZ-Si wafer 6 inch, thickness = 650 ± 50 μm, any crystal orientation (not defined), 1-side polished, n- or p-type (mixed), 0.001 - 100 Ohm cm, not particle specified, each 50 pcs in vacuum sealed cassette package | | | Wafer-Preis (netto): € 9.00 (50 Wafer), € 8.00 (100 Wafer), € 7.50 (200 Wafer), € 7.00 (500 Wafer), € 6.50 (1000 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 6 | (100) | beidseitig | 381 ± 15 | Bor | 1 - 10 | | 397 / 397 | WSA60381150B1314SNN1 | | | | Prime CZ-Si wafer 6 inch, thickness = 381 ± 15 μm, (100), 2-side polished, p-type (Boron), TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 36.00 (25 Wafer), € 34.00 (50 Wafer), € 32.00 (100 Wafer), € 30.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 22 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
|
| Prime | CZ-Si | 6 | (100) | beidseitig | 400 ± 10 | Bor | 10 - 20 | | 46 / 46 | WSA60400107B1424XNN1 | | | | Prime CZ-Si wafer 6 inch, thickness = 400 ± 10 μm, (100), 2-side polished, p-type (Boron), TTV < 7 μm, 10 - 20 Ohm cm, Bow/Warp < 30 μm, 1 Primary Flat SEMI Standard | | | Wafer-Preis (netto): auf Anfrage | |
|
| Prime | CZ-Si | 6 | (100) | beidseitig | 525 ± 25 | Bor | 1 - 10 | | 105 / 105 | WSA60525255B1314SNN1 | | | | Prime CZ-Si wafer 6 inch, thickness = 525 ± 25 μm, (100), 2-side polished, p-type (Boron), TTV < 5 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 46.00 (5 Wafer), € 39.40 (10 Wafer), € 33.00 (25 Wafer), € 31.50 (50 Wafer), € 30.00 (100 Wafer), € 29.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 6 | (100) | beidseitig | 675 ± 25 | Bor | 1 - 10 | | 488 / 488 | WSA60675250B1314SNN1 | | | | Prime CZ-Si wafer 6 inch, thickness = 675 ± 25 μm, (100), 2-side polished, p-type (Boron), 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 44.00 (5 Wafer), € 37.40 (10 Wafer), € 31.00 (25 Wafer), € 30.00 (50 Wafer), € 29.20 (100 Wafer), € 28.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 6 | (100) | einseitig | 675 ± 20 | Bor | 1 - 10 | | 333 / 333 | WSD60675200B1314XNN1 | | | | Prime CZ-Si wafer 6 inch, thickness = 675 ± 20 μm, (100), 1-side polished, p-type (Boron), TTV < 10 μm, 1 - 10 Ohm cm, Bow/Warp < 40 μm, JEIDA flat 47.5 +/- 2.5 mm on <110>+/- 1 deg | | | Wafer-Preis (netto): € 41.00 (5 Wafer), € 34.00 (10 Wafer), € 27.50 (25 Wafer), € 26.00 (50 Wafer), € 24.50 (100 Wafer), € 23.50 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 6 | (100) | einseitig | 675 ± 20 | Bor | 100 - 150 | | 77 / 77 | WSD60675200B1515XNN1 | | | | Prime CZ-Si wafer 6 inch, thickness = 675 ± 20 μm, (100) +/- 1°, 1-side polished, p-type (Boron), TTV < 10 μm, Bow/Warp < 40 μm, 100 - 150 Ohm cm | | | Wafer-Preis (netto): auf Anfrage | |
|
| Prime | CZ-Si | 6 | (100) | einseitig | 675 ± 25 | Bor | 1 - 10 | | 241 / 241 | WSD60675250B1314SNN1 | | | | Prime CZ-Si wafer 6 inch, thickness = 675 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 36.00 (5 Wafer), € 30.00 (10 Wafer), € 23.00 (25 Wafer), € 22.00 (50 Wafer), € 21.00 (100 Wafer), € 20.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 6 | (100) | einseitig | 675 ± 25 | Bor | 1 - 20 | | 75 / 75 | WSD60675250B1324SNN1 | | | | Prime CZ-Si wafer 6 inch, thickness = 675 ± 25 μm, (100), 1-side polished, p-type (Boron) TTV < 10 μm, 1 - 20 Ohm cm, Flats: 1, [InvP] | | | Wafer-Preis (netto): € 41.00 (5 Wafer), € 34.40 (10 Wafer), € 28.00 (25 Wafer), € 27.10 (50 Wafer), € 26.20 (100 Wafer), € 25.30 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 6 | (100) | einseitig | 675 ± 25 | | 0.01 - 0.02 | | 0 / 125 | WSD60675250X1121XNN1 | | | | Prime CZ-Si wafer 6 inch, thickness = 675 ± 25 μm, (100), 1-side polished, n-type (Sb) 0.01 - 0.02 Ohm cm, 1 SEMI Flat | | | Wafer-Preis (netto): auf Anfrage | |
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| Prime | CZ-Si | 6 | (100) | einseitig | 675 ± 25 | Bor | 1 - 10 | | 100 / 100 | WSD60675255B1314SNN1 | | | | Prime CZ-Si wafer 6 inch, thickness = 675 ± 25 μm, (100) +/- 1°, 1-side polished, p-type (Boron) TTV < 15 μm, 1 - 10 Ohm cm, Bow < 50 μm | | | Wafer-Preis (netto): € 41.00 (5 Wafer), € 34.40 (10 Wafer), € 28.00 (25 Wafer), € 26.00 (50 Wafer), € 25.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 6 | (100) | einseitig | 1000 ± 25 | Bor | 3 - 10 | | 1 / 1 | WSD61000250B3314SNN1 | | | | Prime CZ-Si wafer 6 inch, thickness = 1000 ± 25 μm, (100), 1-side polished, p-type (Boron), 3 - 10 Ohm cm | | | Wafer-Preis (netto): € 53.00 (5 Wafer), € 46.40 (10 Wafer), € 40.00 (25 Wafer), € 38.00 (50 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Test | CZ-Si | 6 | (100) | einseitig | 675 ± 10 | Bor | 1 - 10 | | 125 / 125 | WSM60675100B1314SNN1 | | | | Test CZ-Si wafer 6 inch, thickness = 675 ± 10 μm, (100), 1-side polished, p-type (Boron), 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 23.00 (25 Wafer), € 22.00 (50 Wafer), € 21.00 (100 Wafer), € 20.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Test | CZ-Si | 6 | (100) | einseitig | 675 ± 25 | Bor | 1 - 10 | | 363 / 363 | WSM6067525XB1314SNN1 | | | | Test CZ-Si wafer 6 inch, thickness = 675 ± 25 μm, (100), 1-side polished, p-type (Boron) 1 - 10 Ohm cm | | | Wafer-Preis (netto): € 22.00 (25 Wafer), € 21.00 (50 Wafer), € 20.00 (100 Wafer), € 19.00 (200 Wafer), € 18.00 (300 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 13 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Dummy3 | CZ-Si | 6 | (100) | einseitig | 650 ± 50 | Phosphor | 0.001 - 100 | | 100 / 100 | WSV60650500P1015XNN1 | | | | Dummy CZ-Si wafer 6 inch, thickness = 650 ± 50 μm, (100), 1-side polished, n-type (Phosphor), 0.001 - 100 Ohm cm, not particle specified, each 50 wafers stacked in cakeboxes | | | Wafer-Preis (netto): € 9.00 (50 Wafer), € 8.50 (100 Wafer), € 8.00 (200 Wafer), € 7.50 (500 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Dummy3 | CZ-Si | 6 | (100) | einseitig | 650 ± 50 | | 0.001 - 100 | | 550 / 550 | WSV60650500X1015XNN1 | | | | Dummy CZ-Si wafer 6 inch, thickness = 650 ± 50 μm, (100), 1-side polished, p-type and n-type mixed, 0.001 - 100 Ohm cm, not particle specified, each 50 wafers stacked in cakeboxes | | | Wafer-Preis (netto): € 8.00 (50 Wafer), € 7.50 (100 Wafer), € 7.00 (200 Wafer), € 6.50 (500 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Dummy3 | CZ-Si | 6 | (100) | einseitig | 650 ± 50 | Bor | 0.001 - 100 | | 550 / 550 | WSV6065050XB1015XNN1 | | | | Dummy CZ-Si wafer 6 inch, thickness = 650 ± 50 μm, (100), 1-side polished, p-type (Boron), 0.001 - 100 Ohm cm, not particle specified, each 25 wafers stacked in cakeboxes | | | Wafer-Preis (netto): € 9.00 (50 Wafer), € 8.50 (100 Wafer), € 8.00 (200 Wafer), € 7.50 (500 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Dummy3 | CZ-Si | 6 | (100) | einseitig | 650 ± 50 | Bor | 0.001 - 100 | | 241 / 241 | WSV6065050XB1015XNN2 | | | | Dummy CZ-Si wafer 6 inch, thickness = 650 ± 50 μm, (100), 1-side polished, p-type (Boron), 0.001 - 100 Ohm cm, not particle specified, each 25 pcs in carriers | | | Wafer-Preis (netto): € 15.00 (25 Wafer), € 14.00 (50 Wafer), € 13.50 (100 Wafer), € 13.20 (200 Wafer), € 12.00 (500 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten). Ein mit 16 Wafern bestückter Carrier ist ebenfalls verfägbar. | |
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| Prime | Si + SiO2 (dry) | 6 | (100) | einseitig | 675 ± 25 | Bor | 1 - 10 | 100 nm | 0 / 165 | WTD60675250B1314S101 | | | | Prime Si + dry SiO2 wafer 6 inch, thickness = 675 ± 25 μm, (100), 1-side polished, p-type (Boron), 1 - 10 Ohm cm, 100 nm thermal SiO2 on both sides | | | Wafer-Preis (netto): € 43.00 (5 Wafer), € 36.40 (10 Wafer), € 30.00 (25 Wafer), € 29.00 (50 Wafer), € 28.50 (100 Wafer), € 28.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 6 | ### | beidseitig | 700 ± 25 | | | | 20 / 20 | WUS60700250X0000SNN1 | | | | Fused silica JGS2 wafer 6 inch, thickness = 700 ± 25 μm, 2-side polished, TTV < 10 μm, S/D 40/20, Bow < 25 μm, Warp < 30 μm, 1 SEMI Flat | | | Wafer-Preis (netto): € 61.00 (5 Wafer), € 54.40 (10 Wafer), € 48.00 (25 Wafer), € 44.00 (50 Wafer), € 41.00 (100 Wafer), € 38.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 6 | ### | beidseitig | 1000 ± 25 | | | | 51 / 51 | WUS61000250X0000SNN1 | | | | Fused silica JGS2 wafer 6 inch, thickness = 1000 ± 25 μm, 2-side polished, 1 Flat | | | Wafer-Preis (netto): € 59.00 (5 Wafer), € 52.00 (10 Wafer), € 44.00 (25 Wafer), € 41.00 (50 Wafer), € 38.00 (100 Wafer), € 36.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 6 | ### | beidseitig | 1000 ± 25 | | | | 75 / 75 | WUS61000250X0000SNN2 | | | | Fused silica JGS1 wafer 6 inch, thickness = 1000 ± 25 μm, 2-side polished, 1 flat | | | Wafer-Preis (netto): € 80.00 (5 Wafer), € 72.00 (10 Wafer), € 64.00 (25 Wafer), € 62.00 (50 Wafer), € 60.00 (100 Wafer), € 58.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 6 | ### | beidseitig | 1000 ± 25 | | | | 128 / 128 | WUS61000250XXXXXXNN1 | | | | Fused silica JGS2 wafer 6 inch, thickness = 1000 ± 25 μm, 2-side polished, TTV < 10 μm, Bow < 25 μm, Warp < 30 μm, no flat | | | Wafer-Preis (netto): € 66.00 (5 Wafer), € 56.00 (10 Wafer), € 48.00 (25 Wafer), € 46.00 (50 Wafer), € 44.00 (100 Wafer), € 42.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| | Fused Silica | 6 | ### | beidseitig | 1000 ± 25 | | | | 20 / 20 | WUS61000250XXXXXXNN2 | | | | Dummy Fused silica JGS2 wafer 6 inch, thickness = 1000 ± 25 μm, 2-side polished, TTV < 10 μm, Bow < 25 μm, Warp < 30 μm, no flat, not particle-specified | | | Wafer-Preis (netto): € 32.00 (20 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 6 | (100) | einseitig | 675 ± 25 | Bor | 1 - 10 | 300 nm | 80 / 80 | WWD60675250B1314S301 | | | | Prime Si + dry/wet/dry SiO2 wafer 6 inch, thickness = 675 ± 25 μm, (100), 1-side polished, p-type (Boron), 1 - 10 Ohm cm, 300 nm dry/wet/dry SiO2 (thermal grown on both sides) | | | Wafer-Preis (netto): € 43.00 (5 Wafer), € 36.40 (10 Wafer), € 30.00 (25 Wafer), € 29.00 (50 Wafer), € 28.00 (100 Wafer), € 27.00 (200 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 6 | (100) | einseitig | 675 ± 25 | Bor | 1 - 10 | 1000 nm | 50 / 50 | WWD60675250B1314SXX1 | | | | Prime Si + wet SiO2 wafer 6 inch, thickness = 675 ± 25 μm, (100), 1-side polished, p-type (Boron), 1 - 10 Ohm cm, 1000 nm +/- 10 % thermally grown SiO2 on both sides, with laser-marking on non-polished side, code: MCN-XXX (XXX = 001 - 999) | | | Wafer-Preis (netto): € 54.00 (5 Wafer), € 44.00 (10 Wafer), € 34.00 (25 Wafer), € 32.00 (50 Wafer), € 30.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | Si + SiO2 (wet) | 6 | (100) | einseitig | 675 ± 25 | Phosphor | 1 - 10 | 1000 nm | 33 / 33 | WWD6067525XP1314SXX1 | | | | Prime Si + wet SiO2 wafer 6 inch, thickness = 675 ± 25 μm, (100), 1-side polished, n-type (Phosphor), 1 - 10 Ohm cm, 1000 nm +/- 10 % thermally grown SiO2 on both sides, no second flat | | | Wafer-Preis (netto): € 45.00 (5 Wafer), € 38.40 (10 Wafer), € 32.00 (25 Wafer), € 30.50 (50 Wafer), € 29.00 (100 Wafer) (ggfalls. zzgl. Verpackungs- und Versandkosten) | |
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| Prime | CZ-Si | 6 | (100) | einseitig | 625 ± 10 | Bor | 12 - 18 | | 0 / 12(5) | WSD60625105B1414SNN# | | | | Prime CZ-Si wafer 6 inch, thickness = 625 ± 10 μm, (100), 1-side polished, p-type (Boron) TTV < 5 μm, 12 - 18 Ohm cm, Flats: 1 | | | Wafer-Preis (netto): € 43.40 ( | |