Ti, TiW and TiN Etchant
Low undercut Ti etch chemistry concentrate for Cu bump pillars for self-mixing. TechniEtch™ TBR19 concentrate is compatible with most under bump metallization (UBM) and copper pillar integration materials such as Cu, Al, Ni and alloys, glass, organic substrate and most plastics like polypropylene, HDPE, PFA, PTFE Kalrez, PEEK, PE. The etching rate at 50°C is around 1000 A/min.
Technical Data Sheet:
For further information please refer to the technical data sheet:
> TechniEtch TBR19 Concentrate (TDS)
> TechniEtch TBR19 (mixing)
> TechniEtch TBR19 (SPEC)
> Wet Etching
> Wet etching metals
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Sales Volumes, Purity Grade and Shipping
Available Sales Units:
- 2,5L bottles (1 PU = 6 x 2,5L or single bottles)
- 20L drums on request
Available Purity Grade:
Our typical lead time is 1-3 working days within Germany, lead times to other countries on request. On demand, in urgent cases our etchants can be shipped within 24 hours to a destination inside Germany.
Please send us your request.
phone: +49 (0)731 977 343 0
fax: +49 (0)731 977 343 29