TechniEtch™TBR19 Concentrate

Ti, TiW and TiN Etchant

General Information

Low undercut Ti etch chemistry concentrate for Cu bump pillars for self-mixing. TechniEtch™ TBR19 concentrate is compatible with most under bump metallization (UBM) and copper pillar integration materials such as Cu, Al, Ni and alloys, glass, organic substrate and most plastics like polypropylene, HDPE, PFA, PTFE Kalrez, PEEK, PE. The etching rate at 50°C is around 1000 A/min.

Technical Data Sheet:

For further information please refer to the technical data sheet:
> TechniEtch TBR19 Concentrate (TDS)
> TechniEtch TBR19 (mixing)

> TechniEtch TBR19 (SPEC)
>
Wet Etching
> Wet etching metals

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Lithography Application Notes

Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here:
> application notes

Sales Volumes, Purity Grade and Shipping

Available Sales Units:

  • Bottles á 2,5 L (1 PU = 6 x 2,5 liters or single bottles)
  • 30 L or 200 L drums on request

Available Purity Grade:

  • MOS

Our typical lead time is 1-3 working days within Germany, lead times to other countries on request. On demand, in urgent cases our etchants can be shipped within 24 hours to a destination inside Germany.

Please send us your request.

e-mail: sales(at)microchemicals.com
phone: +49 (0)731 977 343 0
fax: +49 (0)731 977 343 29

Thank you very much for your interest!

TBR19 (150°C 180s underetch smaller than 500nm)
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