TiW etch 100

General Information

TiW etch 100 is applied as etchant for titanium-for the wet-chemical patterning of TiWlayers with selectivity to metals like Au, Pt, Ni, Cr, Sn. Usual applications are found in the semiconductor or microsystem technology field for etching adhesion layers or diffusion barriers.

Properties

• Low undercut (in the range of the layer thickness), minimum feature size < 1μm
• Selectivity to many materials, e.g. common metals used in electroplating industry
• Compatible to resist masking

Selectivity

TiW etch 100 is compatible/etches selective to following materials:

• Resists: common Novolak as masking resist (e.g. AZ^_® Photoresist)
• Metals: no attack on Au, Cr, Ni, Sn; Cu impact at prolonged exposition
• Semiconductor materials: Si, SiO2, Si3N4
  (further information on request)

Etching rate

Under normal condition, the etching rate is around 1nm/sec (at room temperature). The mixed etching solution is stable over time and can be used multiple times depending on the requirements of application. It is recommended to dispose the solution at the latest, when the etching rate has changed by 20%.

Technical Data Sheet:

For further information please refer to the technical data sheet:
> TiW etch 100 (TDS)
> Wet Etching
> Wet etching metals

Sales Volumes, Purity Grade and Shipping

Available Sales Units:

• Bottles á 5 L or 1 L 

Our typical lead time is 1-3 working days within Germany, lead times to other countries on request. On demand, in urgent cases our etchants can be shipped within 24 hours to a destination inside Germany.

Please send us your request.

e-mail: sales(at)microchemicals.com
phone: +49 (0)731 977 343 0
fax: +49 (0)731 977 343 29

Thank you very much for your interest!