AZ® 125 nXT

Ultra-Thick Negative Resist for Plating

General Information

AZ® 125 nXT is a cross-linking negative resist for resist film thicknesses up to 100 µm with standard parameters, and even more (1 mm resist film thickness realized!) with very steep sidewalls. The high stability and superior adhesion make the AZ® 125 nXT well suited for mostelectroplating applications where very thick films are required. This resist requires neither a post exposure bake nor any delays between the process steps (such as a rehydration step, or a delay for outgassing after exposure).

Sales volumes: 100 ml, 250 ml, 500 ml, 1000 ml, 2,5 L and 3,78 L bottles

Outstanding Properties

  • 30 - 100 µm resist film thickness via single-coating
  • Up to 1 mm resist film thickness possible
  • Aqueous alkaline developers (e. g. AZ® 326/726/826 MIF)
  • No post exposure bake, photo-polymerization during exposure
  • No rehydration required, no N2-formation during exposure
  • Very good adhesion, no underplating
  • Wet stripping processes (e. g. TechniStrip P1316)
  • Optimized for electroplating, wet- and dry etching


We recommend the TMAH-based, ready-to-use AZ® 326 MIF Developer, AZ® 726 MIF Developer or AZ® 826 MIF Developer.

Resist Removal

The recommended stripper for the AZ® 125nXT is the NMP-free TechniStrip P1316, which is compatible with all common (even alkaline sensitive) substrate materials. Solvents such as NMP or the untoxic substitute DMSO are suited removers, if the resist film thickness and degree of crosslinking are not too high. Generally, heating the removers up to 60 - 80°C, or/and ultrasonic treatment, might be required to fasten theresist removal in the case of very thick resist films.

Resist pattern and plated structures attained with a 60 and 120 µm thick AZ® 125 nXT

Technical Data Sheet:

For further information please refer to the technical data sheet:
> AZ®_125nXT (TDS)
> Info AZ® 125nXT (Info)


Lithography Application Notes

Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here:
> application notes

20 µm lines at 60 µm resist film thickness
15 µm holes at 60 µm resist film thickness
80 µm plated CuNi image
All images taken from: AZ® 15 nXT and 125 nXT Product Data Sheet of AZ-EM.
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