AZ® 15 nXT (115CPS)
Thick Negative Resist for Plating
We offer two types of AZ® 15nXT (AZ® 15nXT (450CPS) and AZ® 15nXT (115CPS)). The main differnece between the two types is the viscosity.
Here the direct comparison:
Thickness Range and Exposure
AZ® 15nXT (450CPS)
Substrate: Si wafer for photospeed testing; Cu wafer for imagesFilm
Thickness: 10 µm
Softbake: 110°C / 180 sec.
UV-sensitivity: i-line (Dose = 400 ± 50 mJ/cm²; Focus: 1 ± 0,5 µm
PEB: 120°C / 60 sec.
Sales volumes: 100 ml, 250 ml, 500 ml, 1000 ml, 2.5 L, 3.78 L (gallon)
AZ® 15nXT (115 CPS)
Substrate: Si wafer for photospeed testing; Cu wafer for images
Thickness: 6 µm
Softbake: 110°C / 120 sec.
UV-sensitivity: i-line (Dose = 300 ±50 mJ/cm²; Focus: 1 ± 0,5 µm
PEB: 120°C / 60 sec.
Sales volumes: on request
AZ® 15 nXT is a cross-linking negative resist for resist film thicknesses up to approx. 30 µm. The high stability and superior adhesion make the AZ® 15 nXT well suited formost electroplating applications. The resist sidewalls are very steep up to a film thickness of approx. 10 µm, towards higher resist film thicknesses the resist profile becomes more and more negative allowing the electro-deposition of structures whichnarrow from bottom to top.
- 5 ... 20 µm resist film thickness via single-coating
- Aqueous alkaline developers
- Excellent adhesion, no underplating
- Wide substrate compatibility: Cu, Au, Ti, NiFe, …
- Wide plating compatibility: Cu, Ni, Au, …
- Standard wet stripping processes
The recommended stripper for the AZ® 15 nXT is the NMP-free, nontoxic TechniStrip NI555, which is compatible with all common (even alkaline sensitive) substrate materials and can even dissolve (not only peel from the substrate) crosslinked AZ® 15 nXT resist films.
Generally, heating these removers up to 60 - 80°C, or/and ultrasonic treatment, might be required to fasten theresist removal in the case of very thick or strongly crosslinked resist films.
Technical Data Sheet
Lithography Application Notes
Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here:
> application notes