AZ® 15 nXT (115CPS)

Thick Negative Resist for Plating

We offer two types of AZ® 15nXT (AZ® 15nXT (450CPS) and AZ® 15nXT (115CPS)). The main differnece between the two types is the viscosity.

Here the direct comparison:

Thickness Range and Exposure

AZ® 15nXT (450CPS)

Substrate: Si wafer for photospeed testing; Cu wafer for imagesFilm
10 µm
Softbake: 110°C / 180 sec.
i-line (Dose = 400 ± 50 mJ/cm²; Focus: 1 ± 0,5 µm
PEB: 120°C / 60 sec.
Sales volumes: 100 ml, 250 ml, 500 ml, 1000 ml, 2.5 L, 3.78 L (gallon)

AZ® 15nXT (115 CPS)

Substrate: Si wafer for photospeed testing; Cu wafer for images
Thickness: 6 µm
Softbake: 110°C / 120 sec.
UV-sensitivity: i-line (Dose = 300 ±50 mJ/cm²; Focus: 1 ± 0,5 µm
PEB: 120°C / 60 sec.
Sales volumes: on request

General Information

AZ® 15 nXT is a cross-linking negative resist for resist film thicknesses up to approx. 30 µm. The high stability and superior adhesion make the AZ® 15 nXT well suited formost electroplating applications. The resist sidewalls are very steep up to a film thickness of approx. 10 µm, towards higher resist film thicknesses the resist profile becomes more and more negative allowing the electro-deposition of structures whichnarrow from bottom to top.

Outstanding Properties

  • 5 ... 20 µm resist film thickness via single-coating
  • Aqueous alkaline developers
  • Excellent adhesion, no underplating
  • Wide substrate compatibility: Cu, Au, Ti, NiFe, …
  • Wide plating compatibility: Cu, Ni, Au, …
  • Standard wet stripping processes


We recommend the TMAH-based, ready-to-use AZ® 326 MIF Developer, AZ® 726 MIF Developer or AZ® 826 MIF Developer.

Resist Removal

The recommended stripper for the AZ® 15 nXT is the NMP-free, nontoxic TechniStrip NI555, which is compatible with all common (even alkaline sensitive) substrate materials and can even dissolve (not only peel from the substrate) crosslinked AZ® 15 nXT resist films.

Solvents such as NMP or the untoxic substitute DMSO are suited removers, if the resist film thickness and degree of crosslinking are not too high.

Generally, heating these removers up to 60 - 80°C, or/and ultrasonic treatment, might be required to fasten theresist removal in the case of very thick or strongly crosslinked resist films.

Technical Data Sheet

For further information please refer to the Technical Datasheet:
> AZ® 15 nXT (450 CPS)

AZ® 15 nXT (115 CPS)
AZ® 15nXT (450CPS) (Info)


Lithography Application Notes

Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here:
> application notes

5 µm lines at 10 µm resist film thickness
5 µm holes at 10 µm resist film thickness
5 µm plated CuNi image
3.6 µm plated CuNi image
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