! AZ 5214E phase out !
The manufacturer Merck informed us, that the photoresist AZ 5214E will be phased out until end of 2021 (official statemant). We also have been informed, that a similar (but not identical) product is already on the market: The Japanese version of the AZ 5214E.
In order to assist you for qualification of the Japanese AZ 5214E, we will be able to provide samples of this resist in near future (probably February/March 2021) as well as technical support in process parameter optimization. Another alternative would be the AZ LNR-003.
Please feel free to contact us!
The following two documents detail the comparison studies of the "old" and Japanese AZ 5214E in both, positive and negative mode:
AZ® 5214 E
Image Reversal Resist for High Resolution
Thickness Range and Exposure
Film thickness: 1.0 ... 2.0 µm
UV-sensitivity: i-, h-line (310 - 420 nm), NOT g-line sensitive
Sales volumes: 250 ml, 500 ml, 1000 ml, 2,5 L and 5 L bottles
This special photoresist is intended forlift-off techniques which call for a negative side wall profile. The reversal bakemoderately cross-links the exposed resist making the developed structuresthermally stable up to approx. 130°C. Due to the comparably low resist filmthickness, the process parameter window for an undercut is rather small thusrequiring some optimizations in the exposure dose and the reversal bake parameters. Therefore, if the resolution required is not in the sub-µm range, a thickerresist such as the TI 35ESx (next section), or the AZ® nLOF 2000 negative resistsmight be a good alternative.
Technical Data Sheet:
For further information please refer to the technical data sheet:
> AZ® 5214 E (TDS)
Lithography Application Notes
Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here:
> application notes