AZ® 5214 E
Image Reversal Resist for High Resolution
Thickness Range and Exposure
Film thickness: 1.0 ... 2.0 µm
UV-sensitivity: i-, h-line (310 - 420 nm), NOT g-line sensitive
Sales volumes: 250 ml, 500 ml, 1000 ml, 2,5 L and 5 L bottles
This special photoresist is intended forlift-off techniques which call for a negative side wall profile. The reversal bakemoderately cross-links the exposed resist making the developed structuresthermally stable up to approx. 130°C. Due to the comparably low resist filmthickness, the process parameter window for an undercut is rather small thusrequiring some optimizations in the exposure dose and the reversal bake parameters. Therefore, if the resolution required is not in the sub-µm range, a thickerresist such as the TI 35ESx (next section), or the AZ® nLOF 2000 negative resistsmight be a good alternative.
Technical Data Sheet:
For further information please refer to the technical data sheet:
> AZ® 5214 E (TDS)
Lithography Application Notes
Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here:
> application notes
Sales Volumes, Purity Grade and Shipping
Our typical lead time is 1-3 working days within Germany, lead times to other countries on request. On demand, in urgent cases our etchants can be shipped within 24 hours to a destination inside Germany.
Please send us your request.
phone: +49 (0)731 977 343 0
fax: +49 (0)731 977 343 29