AZ® TFP 650

Outstanding Properties:

The TFP 650F 5 Resist is suitable for spin coat and extrusion coat applications excellent adhesion requirements and / or harsh etching conditions. The TFP 650F-5 is compatible with all commercially available wafer and photomask processing equipment. The main characteristics are:

  • high photospeed
  • low dark film loss
  • optimized resist adhesion
  • easy removal after hardbake
  • high resistance to harsh etchants

Sales volumes: 3,78 L bottles (1 PU = 4 x 3,78 liters)
Shelf Life:
Overview critical shelf lifes

Suited Developers for the TFP 650 F5:

We recommend AZ® 326 MIF Developer or AZ® 726 MIF Developer (this one contains surfactants).


For non cross-linked resist films the AZ® 100 Remover, DMSO or other common organic solvents cab can be used as stripper. If the resist film is crosslinked (e.g. by high temperature steps >140° C, during plasma processes such as dry etching, or during ion implantation), we recommend the NMP-free TechniStrip P1316 as Remover or Technistrip P1331.

Technical Data Sheet:

For further information please refer to the technical data sheet:
AZ TFP 650 F (TDS)
> AZ TFP 650 F (Additional Information)

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