AZ® TFP 650
The TFP 650F 5 Resist is suitable for spin coat and extrusion coat applications excellent adhesion requirements and / or harsh etching conditions. The TFP 650F-5 is compatible with all commercially available wafer and photomask processing equipment. The main characteristics are:
- high photospeed
- low dark film loss
- optimized resist adhesion
- easy removal after hardbake
- high resistance to harsh etchants
Sales volumes: 3,78 L bottles (1 PU = 4 x 3,78 liters)
Suited Developers for the TFP 650 F5:
For non cross-linked resist films the AZ® 100 Remover, DMSO or other common organic solvents cab can be used as stripper. If the resist film is crosslinked (e.g. by high temperature steps >140° C, during plasma processes such as dry etching, or during ion implantation), we recommend the NMP-free TechniStrip P1316 as Remover or Technistrip P1331.
Technical Data Sheet:
For further information please refer to the technical data sheet:
> AZ TFP 650 F (TDS)
Lithography Application Notes
Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here:
> application notes
Sales Volumes, Purity Grade and Shipping
Our typical lead time is 1-3 working days within Germany, lead times to other countries on request. On demand, in urgent cases our etchants can be shipped within 24 hours to a destination inside Germany.
Please send us your request.
phone: +49 (0)731 977 343 0
fax: +49 (0)731 977 343 29