TI 35E Photoresist

Thickness Range and Exposure

Film thickness: 2.5 .. 4.0 µm 
UV-sensitivity: i, h, and g-line (310 - 440 µm), broadband and monochromatic
Sales volumes: 250 ml, 500 ml, 1.000 ml, 2500 ml und 5 Liter

General Information

TI 35E is specially designed for the application in the so called "image reversal technology" for wet chemical treatment:

  • Etching of Si1-xNx deposited at 400 °C with PECVD
  • Etching of stoichiometric SiN in BHF (12.5% HF)
  • Etching of thick thermal SiO2 with 20% HF, no visible degradation of resist after 10 min
  • Possible etching in HF conc. (50%) for several minutes
  • Direct mesa grooving without SiO2 masking


AZ® 400K and AZ® 826 MIF Developer

Technical Data Sheet:

For further information please refer to the technical data sheet:
TI 35 E (TDS)

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