TI 35 ES
Image Reversal Resist for Lift-off
! PLEASE NOTE !
We would like to inform you about the necessity to discontinue the Photoresist TI 35 ES in the spring of 2017. Due to the availability of a raw material, the production has to be discontinued.
Of course it is in our highest interest to work with you on a smooth phase out with minimized impact to your ongoing operations. We therefore would like to stay in close contact with you regarding your product usage and demand forecast until end-of-life.
We would be glad to send you a free sample of the alternative photoresists for testing.
Please send your request to: info(at)microchemicals.de
Thickness Range and Exposure
Film thickness: 2.5 ... 5 µm
UV-sensitivity: i-, h-, g-line (310 - 440 nm), broadband or monochromatic
Sales volumes: 250 ml, 500 ml, 1000 ml, 2.5 L, and 5 L
A comparably large process window for a resist profile with undercut as well as a high thermal stability (softening point > 130°C, dependant on process parameters)allows reproducible lift-off of also thick evaporated or sputtered films.If the coated materialshould have a thickness of several 100nm or more, evaporation instead of sputtering is strongly recommended in order toprevent coated resistsidewalls. This allowsa fast and clean liftoff.
Technical Data Sheet:
For further information please refer to the technical data sheet:
> TI 35 ES (TDS)
Lithography Application Notes
Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here:
> application notes
Sales Volumes, Purity Grade and Shipping
Our typical lead time is 1-3 working days within Germany, lead times to other countries on request. On demand, in urgent cases our etchants can be shipped within 24 hours to a destination inside Germany.
Please send us your request.
phone: +49 (0)731 977 343 0
fax: +49 (0)731 977 343 29