TI xLift-X Photoresist
former TI xLift
NOTE: The features of the new TI xLift-X are almost identical to the previous TI xLift. There should be no problems with the application.
Thickness Range and Exposure
Film thickness: 4 ... 25 μm
UV-sensitivity: i, h, and g-line (310 - 440 µm), broadband and monochromatic
Sales volumes: 250 ml, 500 ml, 1.000 ml, 2,5 L and 5 L bottles
TI xLift-X is specially designed for the application in the so called "image reversal technology" for subsequent lift-off of thick and very thick deposited layers. For harsh chemical attack, such as direct mesa grooving in HF-HNO3 containing media or etching in high HF-concentrations prefer TI 35 E.
What 'adjustable undercut means' - two examples
Technical Data Sheet:
For further information please refer to the technical data sheet:
> TI xLift-X (TDS)
Lithography Application Notes
Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here:
> application notes