AZ® nLOF 2000 Serie
Thermally Stable Negative Resists
Resist-Types, Thickness Range and Exposure
AZ® nLOF 2020: for film thickness 2 µm @ 3000 rpm
AZ® nLOF 2035: for film thickness 3.5 µm @ 3000 rpm
AZ® nLOF 2070: for film thickness 7 µm @ 3000 rpm
UV-sensitivity: i-line (365 nm), NOT g- or h-line sensitive
Sales volumes: 100 ml, 250 ml, 500 ml, 1000 ml, 2,5 L and 3,78 L bottles
Beside the resist types above, MicroChemicals dilutes the AZ® nLOF to different thickness levels.
AZ® nLOF 2000 is a series of negative resists, whereby the exposed resist remainsafter development with an adjustable undercut. The negative profile in combinationwith its high softening point makes AZ® nLOF 2000 a well-suited resist for lift-off aswell as for any other processes requiring resist structures with high to very high thermal stability.
- Very high thermal stability: Almost no rounding of cross-linked resist patterns upto temperatures of 250°C and more.
- High chemical stability: Dependant on process parameters, AZ® nLOF 2000 is stable against many organic solvents as well as strong alkaline media (however, not stable against KOH Si-etches!).
- The e-beam sensitivity of the AZ® nLOF 2000 resists allows the combination of fastUV and high-resolution e-beam lithography. Please contact us for further information!
The recommended developers are AZ® 326 MIF developers such as AZ® 726 MIF or AZ® 826 MIF. Using other developers may prevent development (start) due to an (accidentally) thermally or optically induced partially crosslinked resist surface.
The recommended stripper for the AZ® nLOF 2000 resists is the NMP-free TechniStrip NI555, which is compatible with all common (even alkaline sensitive) substrate materials and can even dissolve (not only peel from the substrate) crosslinked AZ® nLOF 2070 resist films.
Generally, heating these removers up to 60 - 80°C, or/and ultrasonic treatment, might be required to fasten theresist removal in the case of very thick or strongly crosslinked resist films.