AZ® P4000 Positive Resists
AZ® P4110, AZ® P4330, AZ® P4903, AZ® P4620
Outstanding Properties
The AZ® P4000 positive resist series with its members AZ® P4110, AZ® P4330, AZ® P4620 and AZ® P4903 have two main characteristics:
- An improved adhesion to all common substrates for a higher stability for e. g. wet etching or plating
- A lower photo active compound concentration which allows the application of thick and very thick resist films (approx. 3 - 30 µm)
- Steep wall profiles, high aspect ratios
- Sensitive to g-, h-, and i-line
- Recommended developers: KOH-based (e. g. AZ® 400K) or TMAH-based (e. g. AZ® 826 MIF)
- Standard strippers (e. g. AZ® 100 Remover, TechniStrip P1316)
- Thinner and edge bead remover: AZ® EBR Solvent = PGMEA
AZ® P4110
Resist fim thickness range: Approx. 2 - 5 µm.
Sales volumes: 3.78 L (galone), smaller sales volumes on request
AZ® P4330
Resist fim thickness range: Approx. 3 - 8 µm.
Sales volumes: 3.78 L bottles (galone), smaller sales volumes on request
AZ® P4620
Resist fim thickness range: Approx. 6 - 20 µm.
Sales volumes: 250 ml, 500 ml, 1000 ml, 2,5 L and 3,78 L (galone)
- AZ P4620 (15 µm holes at 24 µm film thickness for Au plating)
AZ® P4903
Resist fim thickness range: Approx. 8 - 30 µm
Sales volumes: 3.78 L bottles (galone), smaller sales volumes on request
Maximum Aspect Ratio for 5 - 20 µm Resist Film Thickness required?
For this purpose, we recommend our AZ® 9260
> 30 µm Resist Film Thickness required?
For this purpose, we recommend our chemically amplified AZ® 40XT
Development
AZ® 400K 1:4 or AZ® 826 MIF recommended.
Technical datasheet:
For further information please refer to the technical data sheet:
> AZ P4000 series (TDS)
> AZ P4620 (Additional Information)
> AZ P4000 series (Additional Information)