TI Prime

The TI Prime adhesion promoter improves resist adhesion on substrates such as Si or glass. TI Prime contains Titanium, for this reason TI Prime should not be used where a contamination with Titanium could be a problem.

In contrast to HMDS, TI Prime is applied via spincoating, where a sub-mono layer is adsorbed onto the surface. In a subsequent ... the surface is activated. After cooling down the fusion should be applied.

> For further information please refer to the Technical Datasheet TI Prime or Substrate Cleaning Adhesion Photoresist.

 


Lithography Application Notes

Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here: application notes.

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