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NEWS


Stay up to date and be informed about news, product changes or other announcements from MicroChemicals.

End of Production: PL 177

July 2024


Unfortunately, the manufacturer has informed us that this product will be phased out in March 2025. We have the option for a last order in early 2025, which will allow us to deliver this product in 2025 while stocks last. 

We apologize for any inconvenience caused by this decision, which is not in our responsibility, and we ask you forward this information to the employees who work with this resist and are responsible for its use. 

We will do our best to help you switching to an alternative product, please contact us for this task.

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Product Change: AZ® Barli II-90 and AZ® Barli II-200

July 2024


Merck, the manufacturer of this bottom-layer anti-reflectioce coating informed us, that by end of 2024, they will stop producing certain organic raw materials and source these from a trusted supplier. This change will impact various BARC product families. Merck has thoroughly tested and qualified raw materials from the new external sources, and they do not observe any performance or quality differences in their products.

If you need more information or the Qualification Data Package, please contact us.

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PGMEA - 5.00 l - ULSI
MPGU1050
PGMEA 1-methoxy-2-propyl-acetate   General Information PGMEA is the main solvent/thinner of almost all AZ® and TI photoresists due to its low vapour pressure and its suppression of particle formation in the (further diluted) resist. Additionally, PGMEA is often used for edge bead removal, since its low vapour pressure prevents further thinning of the coated resist film. Product Properties Density: 0.97 g/cm3 Melting point: -66°C Boiling point: 125°C Flash point: 45°C Vapour pressure @ 20°C: 5 hPa   PGMEA Molecule Further Information MSDS: Safety Data Sheet PGMEA (ULSI) english Sicherheitsdatenblatt PGMEA (ULSI) german Specs: Specs PGMEA (ULSI) Application Notes: Solvents: Theory and Application english Lösemittel: Theorie und Anwendung german Further Information about Processing

PGMEA from MicroChemicals

January 2022


Our solvents are now joined by our MicroChemicals PGMEA in ULSI quality. This high-purity solvent is available in 5 litre containers and can be ordered as a single bottle or in a packaging unit of 4 x 5 litres.

> Specs PGMEA (ULSI)
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MEK from MicroChemicals

July 2021


Our solvents acetone, isopropanol and DMSO are now joined by our MicroChemicals MEK in ULSI quality. This high-purity substance is available in 2.5 litre containers and can be ordered as a single bottle or in a packaging unit of 4 x 2.5 litres.

> Specs MEK (ULSI)
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MEK - 2.50 l - ULSI - EVE/EUD!
MMEU1025
MEK Methyl Ethyl Ketone   General Information MEK (methyl ethyl ketone) with its low boiling point can be used as MicroChemicals additional thinner for spray coating resists, which require a fast resist film drying on the substrate. Product Properties Density: 0.81 g/cm3 Melting point: -86°C Boiling point: 80°C Flash point: -4°C Vapour pressure @ 20°C: 105 hPa   MEK Molecule Further Information MSDS: Safety Data Sheet MEK (ULSI) english Sicherheitsdatenblatt MEK (ULSI) german Specs: Specs MEK (ULSI) Application Notes: Solvents: Theory and Application english Lösemittel: Theorie und Anwendung german Further Information about Processing

End of Production: Ordyl FP 700

July 2021


Unfortunately, the manufacturer has informed us that the production of Ordyl FP 700 dry film will be discontinued . We recommend the Ordyl FP 400 dry film as an alternative.

We very much regret this decision by the manufacturer and will do our best to ensure a smooth transfer of your processes to an alternative coating.


support@microchemicals.com

End of Production: AZ® 520D

February 2021


With the attached PCN, Merck regretfully informed us that the production of the AZ® 520 D protective coating will end by the end of 2021 at the latest

. Basically, the AZ® 520 D is a photoresist without photoinitiator, which should make it easy to find a suitable alternative. We would be pleased if you contact us to discuss your requirements for a protective coating and to find another resist from our portfolio, which can be either a cost-effective standard photoresist or another PAC-free coating.

We very much regret this decision by the manufacturer and will do our best to enable a smooth transfer of your processes to an alternative coating


support@microchemicals.com

End of Production: AZ® 5215E

January 2021


The manufacturer Merck informed us that production of the AZ ® 5214 E will be discontinued by the end of 2021(PCN). We have also been informed that a similar (but not identical) product is already on the market: the Japanese version of the AZ ® 5214E.

To support you in qualifying the Japanese AZ® 5214E, we can provide samples of this resist in the near future (expected February / March 2021) and support you technically in optimising the process parameters.


support@microchemicals.com
> Sample request

New Products

January 2021


We have added some AZ® products to our product portfolio. If you are interested in a consultation, a technical exchange or a sample enquiry, please do not hesitate to contact us.

support@microchemicals.com
> Sample enquiry

AZ 2033 MIF Developer - 5.00 l
1002033
AZ® 2033 MIF Developer Metal Ion-free Developers   General Information AZ® 300 MIF, AZ® 326 MIF, AZ® 726 MIF and AZ® 2026 MIF Developers are developer formulations with 2.38 % TMAH (tetramethylammoniumhydroxide) in H2O. The AZ® 726 MIF Developer contains additionally a surfactant for better wetting and easy to settle up of puddle development. Additionally to the wetting agent of the AZ® 726 MIF the AZ® 2026 MIF contains a scum remover for complete and scum-free removal of resist layers on the price of a slightly higher dark erosion ratio. However, for our negative resists, such as AZ® nLof 2000 series, AZ® 15nXT series, AZ® 125nXT resists this developer shows outstanding performance. Even for a positive resist like AZ® 10XT resist it significantly reduces t-topping if this problem occurs. AZ® 2033 MIF is 3.00 % TMAH in H2O with surfactants added for fast and homogeneous substrate wetting and further additives for removal of resist residuals (residues in certain lacquer families), but at the cost of a higher dark removal. Compared to the AZ® 2026 MIF, the normality is not 0.26 but 0.33. Thus the development rate is higher with the AZ® 2033 MIF Developer. Further Information MSDS: Safety Data Sheet AZ® 2033 MIF Developer english Sicherheitsdatenblatt AZ® 2033 MIF Entwickler german TDS: Technical Data Sheet AZ® 2033 MIF Developer english Application Notes: Development of Photoresist english Entwicklung von Fotolack german
AZ 400 K Dev 1:4 - 5.00 l
1004145
AZ® 400K Developer 1:4 Inorganic Developers   General Information In addition to the concentrate, a pre-diluted AZ® 400K 1:4 version is now also available, other dilution ratios on request. AZ® 400K MIC Developer is based on buffered KOH and typically used in a 1:3 to 1:4 dilution (1 part of concentrate and 4 parts of DI-water) and can be used especially for our thicker resist types, such as AZ® 4562, AZ® 10XT, and AZ® 40XT. Further Information MSDS: Safety Data Sheet AZ® 400K 1:4 Developer english Sicherheitsdatenblatt AZ® 400K 1:4 Entwickler german TDS: Technical Data Sheet AZ® 400K 1:4 Developer english Information AZ® 400K 1:4 Developer english Application Notes: Development of Photoresist english Entwicklung von Fotolack german
AZ P4K-AP Coating - 3.785L
10P4KAP
Bottle size: 3.785 l
AZ® P4K-AP Protective Coating   General Information AZ® P4K-AP is a cost-effective coating for the protection of device surfaces during operations such as back-lap or backside etch. It is based on Novolak resin and is resistant to most etchants. The thickness of this coating is 6.8 µm at 4000 rpm spin speed. Please note, that the protective coating AZ® P4K-AP is not stable in KOH-etches typically used for silicon etching. Product Properties AZ® P4K-AP is a blend of resin and solvent components typical of fully formulated photoresists. The AZ® P4K-AP Protective Coating excludes the photoactive component of a fully formulated photoresist, thus removing material and QA related costs for applications where photolithographic performance in unnecessary. AZ® P4K-AP uses the same base materials as the industry standard AZ® P4620 photoresist. It offers: Superior adhesion to a wide variety of substrates Compatible with many wet chemistries, both etch and plating Good coating properties Standard photoresist coating processes are used The AZ® P4K-AP can be used in: Dry etch processes Wet etch processes Plating processes The AZ® P4K-AP is removed/stripped in standard wet or dry photoresist removal processes. Developers AZ® P4K-AP is not a photoresist, therefore there is no developer required. Removers AZ® P4K-AP can be removed with all common photoresist strippers such as: Acetone, alkaline solutions, AZ® 100 Remover, DMSO, AZ® 920 Remover and TechniStrip P1316. Thinning/ Edge Bead Removal We recommend for thinning and edge bead removal PGMEA and AZ® EBR Solvent. Further Information MSDS: Safety Data Sheet AZ® P4K-AP Photoresist english Sicherheitsdatenblatt AZ® P4K-AP Fotolack german TDS: Technical Data Sheet AZ® P4K-AP Photoresist english Application Notes: Further Information about Photoresist Processing
AZ Remover 920 - 5.00 l
1000920
AZ® Remover 920 Organic Solvent Based Remover   General Information AZ® Remover 920 is designed for fast delamination and dissolution of photoresist patterns while maintaining broad compatibility with device substrates and metal films. Merck’s proprietary solvent and additive blend is environmentally friendly and fully compliant with the European Union’s REACH regulatory code. Compatible with most AZ® positive resists (complete dissolution) and most AZ® negative resists (dissolution or delamination depending on degree of cross-linking). Product Properties Flashpoint: 84.4°C Viscosity (20°C): 1.84 cSt Boiling point: 188°C Density (at 25°C): 1.084 g/cm3 Compatibility Metals: no attack on Al, Cu, Ti, W, TiW, TiN, Sn, Ni Substrates: Si, SiO2, GaAs Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details. Main Features Fast delamination of photoresist patterns Broad compatibility Environmentally friendly Some Applications Bulk Photoresist Removal Metal Lift-off Lithography Cu Pillar Metallization Cleans RDL Metallization Cleans Delamination of Heavily Cured Photoresist Patterns & Organic Residues Further Information MSDS: Safety Data Sheet AZ® Remover 920 english Sicherheitsdatenblatt AZ® Remover 920 german TDS: Technical Data Sheet AZ® Remover 920 english Application Notes: Photoresist Removal english Entfernen von Fotolack german

End of Production: NMP

December 2020


For some years now, NMP has been classified as toxic to reproduction and the use of NMP has been increasingly restricted and has been on the EU's list of substances of very high concern for several years. The EU has now further tightened up the use of NMP so that after 9 May 2020, NMP can only be used under special precautions.

Technic France, our current sole supplier of NMP, has decided to discontinue the production of NMP completely.

We have some products that can replace NMP in the programme, and many of our customers have already qualified for NMP alternatives in the past due to the increasingly problematic situation.

We would be happy to provide you with samples of possible alternatives; it is best to briefly describe the process and the (substrate) materials involved so that we can work with you to find the best alternatives.


support@microchemicals.com
> Sample request

AZ Remover 920 - 5.00 l
1000920
AZ® Remover 920 Organic Solvent Based Remover   General Information AZ® Remover 920 is designed for fast delamination and dissolution of photoresist patterns while maintaining broad compatibility with device substrates and metal films. Merck’s proprietary solvent and additive blend is environmentally friendly and fully compliant with the European Union’s REACH regulatory code. Compatible with most AZ® positive resists (complete dissolution) and most AZ® negative resists (dissolution or delamination depending on degree of cross-linking). Product Properties Flashpoint: 84.4°C Viscosity (20°C): 1.84 cSt Boiling point: 188°C Density (at 25°C): 1.084 g/cm3 Compatibility Metals: no attack on Al, Cu, Ti, W, TiW, TiN, Sn, Ni Substrates: Si, SiO2, GaAs Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details. Main Features Fast delamination of photoresist patterns Broad compatibility Environmentally friendly Some Applications Bulk Photoresist Removal Metal Lift-off Lithography Cu Pillar Metallization Cleans RDL Metallization Cleans Delamination of Heavily Cured Photoresist Patterns & Organic Residues Further Information MSDS: Safety Data Sheet AZ® Remover 920 english Sicherheitsdatenblatt AZ® Remover 920 german TDS: Technical Data Sheet AZ® Remover 920 english Application Notes: Photoresist Removal english Entfernen von Fotolack german

AZ® Remover 920 Remover based on Organic Solvents

October 2020


The AZ ® Remover 920 photoresist remover is based on organic solvents and has been developed for the rapid delamination and dissolution of photoresists while offering broad compatibility with substrate materials and metals. The blend of solvents and additives developed by Merck is environmentally friendly and fully compliant with the European Union's REACH legislation.


support@microchemicals.com
> Sample request

Product Change: AZ® MIR701

July 2020


The manufacturer of the photoresist AZ® 701 MIR (14 and 29 cPs) has informed us about a planned product change notification (PCN) regarding a PFOA ingredient.

As the qualification document(14CPS and 29CPS) shows, the PFOA-free AZ 701 MIR does not show any significant changes compared to the PFOA-containing AZ 701 MIR. If you would like to test or qualify the PFOA-free AZ 701 MIR, we can provide you with samples.



support@microchemicals.com
> Sample request

DMSO from MicroChemicals

June 2020


In addition to our solvents acetone and isopropanol, our MicroChemicals DMSO is now also available in ULSI quality . This high-purity substance is available in 2.5 litre containers and can be ordered both as individual bottles and in packaging units of 4 x 2.5 litres.

Due to its low vapour pressure and water solubility, DMSO is an excellent substitute for NMP, which has been classified as toxic for some time , for the removal of paint or lift-off.



> Specs DMSO (ULSI)
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DMSO - 2.50 l - ULSI
MDMU1025
DMSO Dimethyl Sulfoxide   General Information Due to its low vapour pressure and its water solubility, DMSO is an excellent stripper for resists respectively Lift-off media and is a non-toxic substitute for the NMP, which has been classified as toxic since a while. The optional addition of Cyclopentanone or MEK increases the performance of the stripper for certain applications and significantly lowers the melting point of pure DMSO. NOTE: The solvent DMSO (dimethyl sulfoxide) has a melting point just below room temperature, so it can possi¬bly freeze in storage in cooler rooms. Thawing may require several days, but afterwards the product can still be used as it is. For more details please download the info letter. Product Properties Density: 1.1 g/cm3 Melting point: 18°C Boiling point: 189°C Flash point: 87°C Vapour pressure @ 20°C: 0.56 hPa   DMSO Molecule Further Information MSDS: Safety Data Sheet DMSO (ULSI) english Sicherheitsdatenblatt DMSO (ULSI) german Specs: Specs DMSO (ULSI) Application Notes: Solvents: Theory and Application english Lösemittel: Theorie und Anwendung german Photoresist Removal english Fotolack entfernen german Further Information about Processing
Acetone MC - 2.50 l - ULSI - EUD/EVE!
MACU1025
Acetone CH3COCH3   General Information Acetone removes organic impurities from substrates and is well suited for greasy/oily contaminations. However, its large vapour pressure causes rapid drying together with a resorption of the contaminants on the substrate. Therefore an immediately subse¬quent rinsing step is recommended with a higher boiling solvent such as isopropanol. Acetone is not well-suited as lift-off medium due to the high fire danger when heated and the trend of particles to be lifted to resorb onto the substrate. Product Properties Density: 0.79 g/cm^3 Melting point: 95°C Boiling point: 56°C Flash point: < -18°C Vapour pressure @ 20°C: 244 hPa   Acetone Molecule Further Information MSDS: Safety Data Sheet Acetone english (TECHNIC France) Sicherheitsdatenblatt Aceton german (TECHNIC France) Safety Data Sheet Acetone english (MicroChemicals GmbH) Sicherheitsdatenblatt Aceton german (MicroChemicals GmbH) Specs: Specs Acetone ULSI (TECHNIC France) Specs Acetone VLSI (TECHNIC France) Specs Acetone ULSI (MicroChemicals GmbH) Application Notes: Solvents english Lösemittel german

Acetone and Isopropanol from MicroChemicals

June 2018


MicroChemicals acetone and isopropanol are now available in ULSI quality. Our solvents are available in 2.5 litre containers and can be ordered as individual bottles or in packaging units of 4 x 2.5 litres Both products are ideal for substrate cleaning for organic contaminants and particles.



> Specs Isopropyl Alcohol (ULSI)
>Specs Acetone ULSI
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Isopropyl Alcohol MC - 2.50 l - ULSI
MIPU1025
Isopropyl Alcohol IPA, 2-propanol   General Information Isopropyl alcohol is well-suited for rinsing contaminated acetone as well as removing particles from surfaces. Therefore, this solvent is often used in the second substrate cleaning step after acetone. Additionally, Isopropyl alcohol is used as additive for anisotropic Si-etching. Product Properties Density: 0.78 g/cm3 Melting point: - 88°C Boiling point: 82°C Flash point: 13°C Vapour pressure @ 20°C: 43 hPa   Isopropyl alcohol Molecule* Further Information MSDS: Safety Data Sheet Isopropyl Alcohol (ULSI) english Sicherheitsdatenblatt Isopropyl Alcohol (ULSI) german Safety Data Sheet Isopropyl Alcohol (VLSI) english Sicherheitsdatenblatt Isopropyl Alcohol (VLSI) german Specs: Specs Isopropyl Alcohol (ULSI) Specs Isopropyl Alcohol (VLSI) Application Notes: Solvents: Theory and Application english Lösemittel: Theorie und Anwendung german Further Information about Processing