Remover / Stripper
Positive Photoresist Removal
Acetone is not well-suited as stripper for photoresists: The high vapour pressure of acetone causes a fast drying and thus re-deposition of stripped photoresist onto the substrate forming striations. If nevertheless acetone shall be used for this purpose, a subsequent rinse with isopropyl alcohol - immediately after the acetone step - is recommended in order to remove the resist-contaminated acetone residual-free.
> Data sheets and further details on Acetone find here.
NMP (1-Methyl-2-pyrrolidon) is a powerful stripper due to its physical properties: NMP yields a low vapour pressure (no striation formation), strongly solves organic impurities as well as resists, keeps the removed resist in solution, and can be heated to 80°C due to its high boiling point. However, since NMP is classified as toxic and teratogenic, a recommended alternative is ...
> Data sheets and further details on NMP find here.
DMSO (Dimethyl sulfoxide) has a performance as photoresist stripper comparable to the performance of NMP, and is a kind of “safer-solvent” substitute for NMP.
> Data sheets and further details on DMSO (trading name TechniStrip Micro D350) find here.
AZ® 100 Remover is an amine-solvent mixture, and a ready-to-use standard remover for AZ® and TI photoresists. In order to improve its performance, AZ® 100 Remover can be heated to 60-80°C. Since AZ® 100 Remover is strongly alkaline, aluminium containing substrates might be attacked as well as copper- or GaAs alloys/compounds. In this case, AZ® 100 Remover should be used as concentrate, any dilution or contamination of AZ® 100 Remover with water (even in traces!) has to be avoided.
> Data sheets and further details on AZ® 100 Remover find here.
Crosslinked Positive Resist, Epoxy- or Acrylic-based Resin and Polyimide Removal
TechniStrip® P1316 is a NMP-free, with almost all common substrate materials compatible powerful remover for
Novolak-based positive resists such as all positive AZ® resists.
Polyimides, bonding glues
At 75°C, TechniStrip® P1316 is able to dissolve – not only peel – even heavily crosslinked resists (e. g. by dry etching or ion implantation) from the substrate in few minutes. TechniStrip® P1316 can be used in batch immersion and batch spray equipment, as well as in single wafers cleaning tools due to its high stripping efficiency.
> Data sheets and further details on TechniStrip® P1316 find here.
Negative and Thick Resist Removal
TechniStrip® NI555 is a NMP-free and with almost all common substrate materials compatible powerful remover for Novolak-based negative resists and ultrathick positive resists such as
AZ® nLOF 2000
AZ® 15 nXT
AZ® 40 XT
TechniStrip® NI555 was developed to address fast and complete photoresist film dissolution thus avoiding filter clogging and subsequent insoluble resin debris deposition encountered with most of standard stripping solutions.
> Data sheets and further details on TechniStrip® NI555 find here.
Lithography Application Notes
Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here: application notes.