TechniStrip® NI555 is a powerful remover for Novolak-based negative resists and ultrathick positive resists such as
TechniStrip® NI555 was developed to address fast and complete photoresist film dissolution thus avoiding filter clogging and subsequent insoluble resin debris deposition encountered with most of standard stripping solutions.
A crosslinked AZ® 15 nXT film peels from the substrate in DMSO-, NMP- or TMAH-based strippers (left), while TechniStrip® NI555 completely dissolves the resist film after 20 minutes. Image taken from the technical documentation of TECHNIC INC.
For further information please refer to TF TechniStrip NI555
additional Information for TechniStrip NI555
Lithography Application Notes
Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here: application notes.