TechniStrip NF26

Dry Film Remover

General Information

TechniStrip NF26 is a highly effective negative tone photoresist remover used mainly for TSV mask and solder bumping applications.

Developed to address laminated photo-resins (dry-film resists) and liquid resins, the novel cleaning formulation TMAH based showed high dissolution performance compared to standard TMAH based blends. Additional advantages of the TechniStrip NF26 are its very high material compatibility compared to standard TMAH based solutions. The intrinsic nature of the additives and solvent make the blend totally compatible with metals used throughout the BEOL interconnects to WLP bumping applications.

Main Features:

  • very high stripping rate, > 10μm/min
  • great resin dissolution efficiency of dry film
  • bath life up to 72 hours @ 70°C
  • total metal compatibility, < 2 A/min @ 60°C
  • complete water miscibility

Technical Data Sheet

For further information please refer to the technical data sheet:
> TechniStrip NF26 (TDS)
> TechniStrip NF26 (SPEC)
> Photoresist Removal

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Lithography Application Notes

Our list of application notes with litho-related theoretical and technical background on all stages of micro-structuring can be downloaded from here:
> application notes

Sales Volumes, Purity Grade and Shipping

Available Sales Units:

  • Bottles á 5 L (1 PU = 4 x 5 liters or single bottles)
  • 30 L or 200 L drums on request

Available Purity Grade:

  • MOS

Our typical lead time is 1-3 working days within Germany, lead times to other countries on request. On demand, in urgent cases our etchants can be shipped within 24 hours to a destination inside Germany.

Please send us your request.

e-mail: sales(at)microchemicals.com
phone: +49 (0)731 977 343 0
fax: +49 (0)731 977 343 29

Thank you very much for your interest!

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