Our Copper Plating Solution NB SEMIPLATE CU 100
1 and 5 L units, short lead time, (AZ-)Resist compatible
The NB SEMIPLATE CU 100 processis an acid copper plating formulation engineered for wafer plating applications including copper bump plating, interconnects for VLSI/ULSIor MEMS.
NB SEMIPLATE CU 100 is a ready-to-use product. It is not necessary to add other materials for the initially start of the application. Over time, it may be necessary depending on the electrolyte and application to add additives (see data sheet).
The NB SEMIPLATE CU 100 process provides excellent throwing power, improved levelling characteristics, ductile low stress deposits and offers unique flexibility in its operation.
For further informations please refer to TDS NB Semiplate Cu 100 en.pdf
Individual Technical Support and Price Request
If you are interested in products for the maintenance of the electrolyte solution and preparation, then please send us your inquiry.
For any further technical discussions around the application of our plating solutions in your running or scheduled plating processes, or your price and lead time request, please contact us via:
Tel.: +49 (0)731 36080 409
Fax: +49 (0)731 36080 908
Thank you for your interest!