Photoresists, Ancillaries, Etchants,  Solvents, and Technical

Support for all Stages of MicroStructuring and Lithography

englishdeutsch
Products
Packaging
Downloads
Support
News
Company
Contact
Data Protection
Photoresists
Developers
Remover / Stripper
Thinner / EBR
Adhesion Promotion
Etchants
Etching Mixtures
Solvents
Electroplating
Yellowlight UV- Filter
Wafers
Electrochemistry - Theory
Electrochemical Definitions
Film Growth Simulation
Electroplating of Various Metals
Photoresist Processing for Electroplating
Electroplating: Our Technical Brochure
Cu Plating Solution NB SEMIPLATE CU 100
Au Plating Solution NB SEMIPLATE AU 100 TH
Au Plating Solution NB SEMIPLATE AU 100 AS
Ni Plating Solution NB SEMIPLATE NI 100
Sn Plating Solution NB SEMIPLATE SN 100
In Plating Solution NB SEMIPLATE IN 100
Ag Plating Solution NB SEMIPLATE AG 100
Pd Plating Solution NB SEMIPLATE PD 200
Example of Use: MicroSwitch
Wire Connection of Plastic Foils
Plating Accessory
You are here:
Products
Electroplating

Electroplating

Overview of our Electroplatings

  • Semiplate Ag 100 (Datasheet as PDF)

  • Semiplate Au 100 (Datasheet as PDF)

  • Semiplate Au 100 TH (Datasheet as PDF)

  • Semiplate Cu 100 (Datasheet as PDF)

  • Semiplate In 100 (Datasheet as PDF)

  • Semiplate Ni 100 (Datasheet as PDF)

  • Semiplate Pd 200 (Datasheet as PDF)

  • Semiplate Sn 100 (Datasheet as PDF)

Imprint

Microchemicals GmbH | Nicolaus-Otto-Str. 39 | 89079 Ulm | Tel.: +49 (0) 731 977 343-0 | E-Mail: info@microchemicals.com