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Electrochemistry - Theory
Electrochemical Definitions
Film Growth Simulation
Electroplating of Various Metals
Photoresist Processing for Electroplating
Electroplating: Our Technical Brochure
Cu Plating Solution NB SEMIPLATE CU 100
Au Plating Solution NB SEMIPLATE AU 100 TL
Au Plating Solution NB SEMIPLATE AU 100 AS
Ni Plating Solution NB SEMIPLATE NI 100
Sn Plating Solution NB SEMIPLATE SN 100
In Plating Solution NB SEMIPLATE IN 100
Ag Plating Solution NB SEMIPLATE AG 100
Pd Plating Solution NB SEMIPLATE PD 200
NiMn Plating Solution NB SEMIPLATE NiMn 100
Example of Use: MicroSwitch
Wire Connection of Plastic Foils
Plating Accessory
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Products
Electroplating

Electroplating

Overview of our Electroplatings

  • Semiplate Ag 100 (TDS)
  • Semiplate Au 100 (TDS)
  • Semiplate Au 100 TL (TDS)
  • Semiplate Cu 100 (TDS)
  • Semiplate In 100 (TDS)
  • Semiplate Ni 100 (TDS)
  • Semiplate Pd 200 (TDS)
  • Semiplate Sn 100 (TDS)
  • Semiplate NiMn (TDS)
  • Anleitung NBT Probenservice für Galvanikbäder
  • Instruction NBT Sample Service for plating baths

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Microchemicals GmbH | Nicolaus-Otto-Str. 39 | 89079 Ulm | Tel.: +49 (0) 731 977 343-0 | E-Mail: info@microchemicals.com