AZ® IPS-6090

Outstanding Properties:

The IPS 6000 Series is a Series of positive photoresists with enhanced thermal and chemical resistance. It has been developed for use as patterning in semiconductors advanced packaging application (3DIC/TSV, CU Pillar, WLCSP, MEMS):

  • very high resolution
  • high aspect ratio
  • low exposure dose for the thickness of the film
  • straight pattern profile and footing free
  • i-line and broandbend sensitive

It has a broad range of application such as:

  • electro chemical deposition / plating of Cu RDL in WLCSP process
  • electro chemical deposition / plating of Cu, Ni, Sn, SnAg, Au for 3DIC, FO and Flipchip processing
  • Sacrificial layer for Si etching process in TSV
  • Sacrificial layer for SiO2 or SiN etching process in CMOS sensor processing

Sales volumes: 100 ml, 250 ml, 500 ml, 1000 ml, 2,5 L and 3,78 L bottles
Shelf Life: Overview critical shelf lifes

Suited Developers for the AZ® IPS 6000 Series:

We recommend AZ® 326 MIF Developer or AZ® 726 MIF Developer (this one contains surfactants)

Recommended Removers for the AZ® IPS 6000 Resists:

For non cross-linked resist films the AZ® 100 Remover, DMSO or other common organic solvents cab can be used as stripper. If the resist film is crosslinked (e.g. by high temperature steps >140° C, during plasma processes such as dry etching, or during ion implantation), we recommend the NMP-free TechniStrip P1316 as Remover or the TechniStrip P1331.

Technical Data Sheet:

For further information please refer to the technical data sheet:
AZ® IPS 6000 (TDS)

IPS 6050 (80 µm resist film thickness)
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