Our Nickel Plating Solution NB SEMIPLATE NI 100
1 and 5 L units, short lead time, (AZ-)Resist compatible
NB SEMIPLATE NI 100 is a nickelsulfamate electroplating process that produces a pure, ductile, finegrained,semi-bright low stress nickel deposit required to meet the needs of the semiconductor industry for quality assured chemistry.
NB SEMIPLATE NI 100 is a ready-to-use product. It is not necessary to add other materials for the initially start of the application. Over time, it may be necessary depending on the electrolyte and application to add additives (see data sheet).
NB SEMIPLATE NI 100 is manufactured to meet the requirements associated with the electroforming of microstructured wafers (Micro System Technology).
The NB SEMIPLATE NI 100 process contains an anode activating agent in controlled amounts to enhance anode corrosion and prevent anode passivation.
Deposit properties are easy to control and maintain.
Feature / Benefits
- Pure nickel depositions
- High ductile plating
- Fine grained, satin dull deposition
- Controllable inner stress of the deposition up to 7000 µm
- No anode passivation
- High hardness, controllable
- Good throwing power
For further information please refer to TDS NB Semiplate Ni 100 en.pdf
Individual Technical Support and Price Request
If you are interested in products for the maintenance of the electrolyte solution and preparation, then please send us your inquiry.
For any further technical discussions around the application of our plating solutions in your running or scheduled plating processes, or your price and lead time request, please contact us via:
Tel.: +49 (0)731 36080 409
Fax: +49 (0)731 36080 908