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FZ-Si wafer 6 inch 300 um (100) DSP

Prime FZ-Si wafer 300 µm 100

Product information "FZ-Si wafer 6 inch 300 um (100) DSP"

Prime FZ-Si wafer 6 inch, thickness = 300 ± 10 µm, (100), 2-side polished, 10000 - 100000 Ohm cm, 1 SEMI Flat, Laser-marking on rear side “BacksideXXX”, xx = 001 – 999

Diameter (round): 6 inch
Material: FZ-Si
Orientation: 100
Quality: Prime
Resistivity: > 10000 Ohm cm
Surface: 2-side polished
Thickness: 201 - 300 µm