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Fused silica JGS2 wafer 1 inch 500 um DSP

Fused Silica wafer 500 µm

Product information "Fused silica JGS2 wafer 1 inch 500 um DSP"

Fused silica JGS2 wafer 1 inch (!! 25.0 +/- 0.3 mm !!), thickness = 500 ± 25 µm, 2-side polished, 1 Flat

Diameter (round): 1 inch
Material: Fused Silica
Surface: 2-side polished
Thickness: 401 - 500 µm