Fused silica JGS2 wafer 3 inch 380 um DSP
Fused Silica wafer 380 µm
Quantity | Unit price |
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To 4 |
€28.00*
|
To 9 |
€22.00*
|
To 24 |
€17.00*
|
To 49 |
€12.00*
|
To 99 |
€11.60*
|
To 199 |
€11.00*
|
From 200 |
€10.00*
|
No longer available - availability check on request
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Product number:
WUA30380200X0000SNN1
Product information "Fused silica JGS2 wafer 3 inch 380 um DSP"
Fused silica JGS2 wafer 3 inch, thickness = 380 ± 20 µm, 2-side polished, TTV < 10 µm
Diameter (round): | 3 inch |
---|---|
Material: | Fused Silica |
Surface: | 2-side polished |
Thickness: | 301 - 400 µm |