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Fused silica JGS2 wafer 3 inch 380 um DSP

Fused Silica wafer 380 µm

Product information "Fused silica JGS2 wafer 3 inch 380 um DSP"

Fused silica JGS2 wafer 3 inch, thickness = 380 ± 20 µm, 2-side polished, TTV < 10 µm

Diameter (round): 3 inch
Material: Fused Silica
Surface: 2-side polished
Thickness: 301 - 400 µm